Inventor · disambiguated record
Fu Tang Chu
Also filed as: CHU FU T · CHU FU-TANG
6 granted patents·5 pending applications·26 citations·filing 2001–2023
75Inventor score
Top patents by PatentIndex Score
11 records- 0187US11587809B2Wafer supporting mechanism and method for wafer dicingADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Feb 21, 2023·2 cites·12 claims
- 0274US6691876B2Semiconductor wafer cassetteADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted Feb 17, 2004·21 cites·6 claims
- 0372US12112965B2Wafer supporting mechanism and method for wafer dicingADVANCED SEMICONDUCTOR ENG·Filed 2023·Granted Oct 8, 2024·0 cites·17 claims
- 0447US2023106612A1Method of manufacturing electrical packageADVANCED SEMICONDUCTOR ENG·Filed 2021·Application pending·0 cites
- 0540US11189518B2Method of processing a semiconductor waferADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Nov 30, 2021·0 cites·14 claims
- 0638US6476504B1Adhesive pattern for attaching semiconductor chip onto substrateADVANCED SEMICONDUCTOR ENG·Filed 2001·Granted Nov 5, 2002·3 cites·2 claims
- 0736US7749866B2Method for sawing a wafer and method for manufacturing a semiconductor package by using a multiple-type tapeADVANCED SEMICONDUCTOR ENG·Filed 2008·Granted Jul 6, 2010·0 cites·15 claims
- 0832US2003066810A1Frame cassetteADVANCED SEMICONDUCTOR ENG·Filed 2002·Application pending·0 cites
- 0930US2007224780A1Method for dicing a waferADVANCED SEMICONDUCTOR ENG·Filed 2006·Application pending·0 cites
- 1026US2008045124A1Sawing method for a waferCHU FU-TANG·Filed 2007·Application pending·0 cites
- 1125US2006281282A1Method for maching a waferCHU FU T·Filed 2006·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →