Frame cassette

Abstract

The present invention discloses a frame cassette comprising a case, a hollow parallelepiped with an front opening, having a bottom wall and a top wall parallel with each other, and a left side wall, a right side wall and a rear side wall perpendicular to the top wall and the bottom wall; and a plurality of frames for adhering and fixing cut wafers; characterized in that: a positioning hole is disposed on near the boundary between the bottom wall and the left side wall and the right side wall to fix the frame cassette on a personal guided vehicle.

What is claimed is:  
     
         1 . A frame cassette applied to a personal guided vehicle for transferring a semiconductor wafer, comprising: 
 a case, being a hollow parallelepiped with a front opening, having a bottom wall and a top wall parallel with each other, and a left side wall, a right side wall and a rear side wall perpendicular to the top wall and the bottom wall; and    a plurality of frames for adhering and fixing cut wafers;    characterized in that: a positioning hole is disposed on near the boundary between the bottom wall and the left side wall and the right side wall to fix the frame cassette on a personal guided vehicle.    
     
     
         2 . The frame cassette of  claim 1 , which is able to be applied to a 12-inch wafer.  
     
     
         3 . The frame cassette of  claim 1 , wherein inside the left and the right side walls of the case are oppositely provided with a plurality of grooves for placing a plurality of the frames.  
     
     
         4 . The frame cassette of  claim 1 , wherein inside the left and the right side walls of the case are oppositely provided with  13  grooves.