Inventor · disambiguated record
Ralf Wombacher
Also filed as: WOMBACHER RALF
14 granted patents·4 pending applications·45 citations·filing 2006–2022
89Inventor score
Files withINFINEON TECHNOLOGIES AG11AMS OSRAM INT GMBH1FUERGUT EDWARD1INFINEON TECHNOLOGIES AUSTRIA1MAHLER JOACHIM1
Top patents by PatentIndex Score
18 records- 0182US7847375B2Electronic device and method of manufacturing sameINFINEON TECHNOLOGIES AG·Filed 2008·Granted Dec 7, 2010·10 cites·25 claims
- 0282US7705472B2Semiconductor device with semiconductor device components embedded in a plastic housing compositionINFINEON TECHNOLOGIES AG·Filed 2006·Granted Apr 27, 2010·14 cites·22 claims
- 0381US10056348B2Chip assembling on adhesion layer or dielectric layer, extending beyond chip, on substrateINFINEON TECHNOLOGIES AG·Filed 2017·Granted Aug 21, 2018·2 cites·15 claims
- 0480US9379033B2Sensor packageINFINEON TECHNOLOGIES AG·Filed 2014·Granted Jun 28, 2016·4 cites·19 claims
- 0577US12218098B2Chip assembling on adhesion layer or dielectric layer, extending beyond chip, on substrateINFINEON TECHNOLOGIES AG·Filed 2022·Granted Feb 4, 2025·0 cites·20 claims
- 0677US9159701B2Method of manufacturing a chip package, chip package, method of manufacturing a chip assembly and chip assemblyINFINEON TECHNOLOGIES AG·Filed 2013·Granted Oct 13, 2015·4 cites·10 claims
- 0772US11309277B2Chip assembling on adhesion layer or dielectric layer, extending beyond chip, on substrateINFINEON TECHNOLOGIES AG·Filed 2020·Granted Apr 19, 2022·0 cites·20 claims
- 0871US8674462B2Sensor packageWOMBACHER RALF·Filed 2007·Granted Mar 18, 2014·6 cites·36 claims
- 0967US8980687B2Semiconductor device and method of manufacturing thereofNIKITIN IVAN·Filed 2012·Granted Mar 17, 2015·2 cites·25 claims
- 1062US7645636B2Semiconductor device and method for producing it, and use of an electrospinning methodINFINEON TECHNOLOGIES AG·Filed 2006·Granted Jan 12, 2010·2 cites·10 claims
- 1161US10734351B2Chip assembling on adhesion layer or dielectric layer, extending beyond chip, on substrateINFINEON TECHNOLOGIES AG·Filed 2018·Granted Aug 4, 2020·0 cites·19 claims
- 1260US9123708B2Semiconductor chip packageINFINEON TECHNOLOGIES AUSTRIA·Filed 2013·Granted Sep 1, 2015·1 cites·18 claims
- 1352US2015221569A1Chip assembling on adhesion layer or dielectric layer, extending beyond chip, on substrateINFINEON TECHNOLOGIES AG·Filed 2015·Application pending·0 cites
- 1449US2024204476A1Optoelectronic semiconductor componentAMS OSRAM INT GMBH·Filed 2022·Application pending·0 cites
- 1548US9530754B2Chip package and chip assemblyINFINEON TECHNOLOGIES AG·Filed 2015·Granted Dec 27, 2016·0 cites·13 claims
- 1645US8847385B2Chip arrangement, a method for forming a chip arrangement, a chip package, a method for forming a chip packageMAHLER JOACHIM·Filed 2012·Granted Sep 30, 2014·0 cites·25 claims
- 1740US2013337614A1Methods for manufacturing a chip package, a method for manufacturing a wafer level package, and a compression apparatusFUERGUT EDWARD·Filed 2012·Application pending·0 cites
- 1835US2021351319A1Production Method for a ComponentOSRAM OLED GMBH·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →