Inventor · disambiguated record
Sylvain Pharand
Also filed as: PHARAND SYLVAIN
10 granted patents·1 pending application·26 citations·filing 2008–2021
84Inventor score
Top patents by PatentIndex Score
11 records- 0191US11209598B2Photonics package with face-to-face bondingIBM·Filed 2019·Granted Dec 28, 2021·11 cites·19 claims
- 0276US11310921B2Buried via in a circuit boardIBM·Filed 2019·Granted Apr 19, 2022·2 cites·15 claims
- 0373US9793232B1All intermetallic compound with stand off feature and method to makeIBM·Filed 2016·Granted Oct 17, 2017·2 cites·20 claims
- 0471US8841209B2Method for forming coreless flip chip ball grid array (FCBGA) substrates and such substrates formed by the methodALLARD SYLVIE·Filed 2011·Granted Sep 23, 2014·4 cites·14 claims
- 0568US9111793B2Joining a chip to a substrate with solder alloys having different reflow temperaturesIBM·Filed 2013·Granted Aug 18, 2015·2 cites·8 claims
- 0668US7482180B1Method for determining the impact of layer thicknesses on laminate warpageIBM·Filed 2008·Granted Jan 27, 2009·3 cites·1 claims
- 0761US12504747B2Multicomponent module design and fabricationIBM·Filed 2021·Granted Dec 23, 2025·0 cites·19 claims
- 0850US8903531B2Characterizing laminate shapePHARAND SYLVAIN·Filed 2011·Granted Dec 2, 2014·2 cites·14 claims
- 0944US11004614B2Stacked capacitors for use in integrated circuit modules and the likeIBM·Filed 2018·Granted May 11, 2021·0 cites·24 claims
- 1043US11404365B2Direct attachment of capacitors to flip chip diesIBM·Filed 2019·Granted Aug 2, 2022·0 cites·8 claims
- 1142US2015243625A1Joining a chip to a substrate with solder alloys having different reflow temperaturesIBM·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →