Inventor · disambiguated record
Pao-Kang Niu
Also filed as: NIU PAO-KANG
11 granted patents·6 pending applications·194 citations·filing 1999–2010
91Inventor score
Files withTAIWAN SEMICONDUCTOR MFG11WORLDWIDE SEMICONDUCTOR MFG3TSAO PEI-HAW2TAIWAN SEMINCONDUCTOR MFG CO L1
Top patents by PatentIndex Score
17 records- 0195US7719122B2System-in-package packaging for minimizing bond wire contamination and yield lossTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted May 18, 2010·72 cites·6 claims
- 0291US7659632B2Solder bump structure and method of manufacturing sameTAIWAN SEMINCONDUCTOR MFG CO L·Filed 2006·Granted Feb 9, 2010·30 cites·20 claims
- 0390US7602065B2Seal ring in semiconductor deviceTAIWAN SEMICONDUCTOR MFG·Filed 2008·Granted Oct 13, 2009·18 cites·17 claims
- 0485US7446398B2Bump pattern design for flip chip semiconductor packageTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Nov 4, 2008·15 cites·18 claims
- 0581US7148574B2Bonding pad structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Dec 12, 2006·30 cites·13 claims
- 0674US7843058B2Flip chip packages with spacers separating heat sinks and substratesTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Nov 30, 2010·6 cites·15 claims
- 0772US7679180B2Bond pad design to minimize dielectric crackingTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Mar 16, 2010·6 cites·14 claims
- 0854US2008274569A1Method for forming semiconductor ball grid array packageTAIWAN SEMICONDUCTOR MFG·Filed 2008·Application pending·0 cites
- 0951US2008054455A1Semiconductor ball grid array packageTAIWAN SEMICONDUCTOR MFG·Filed 2006·Application pending·0 cites
- 1049US6630051B2Auto slurry deliver fine-tune systems for chemical-mechanical-polishing process and method of using the systemWORLDWIDE SEMICONDUCTOR MFG·Filed 2002·Granted Oct 7, 2003·3 cites·6 claims
- 1146US2007042593A1Bonding pad structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2006·Application pending·0 cites
- 1241US6277751B1Method of planarizationWORLDWIDE SEMICONDUCTOR MFG·Filed 1999·Granted Aug 21, 2001·9 cites·9 claims
- 1339US8217520B2System-in-package packaging for minimizing bond wire contamination and yield lossTSAO PEI-HAW·Filed 2010·Granted Jul 10, 2012·0 cites·5 claims
- 1439US2008042269A1Bump structures and packaged structures thereofTAIWAN SEMICONDUCTOR MFG·Filed 2006·Application pending·0 cites
- 1537US2004175918A1Novel formation of an aluminum contact pad free of plasma induced damage by applying CMPTAIWAN SEMICONDUCTOR MFG·Filed 2003·Application pending·0 cites
- 1635US6410441B1Auto slurry deliver fine-tune system for chemical-mechanical-polishing process and method of using the systemWORLDWIDE SEMICONDUCTOR MFG·Filed 1999·Granted Jun 25, 2002·5 cites·5 claims
- 1730US2008003803A1Semiconductor package substrate for flip chip packagingTSAO PEI-HAW·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →