Inventor · disambiguated record
Scott K. Pozder
Also filed as: POZDER SCOTT · POZDER SCOTT K
22 granted patents·4 pending applications·449 citations·filing 1999–2023
96Inventor score
Files withFREESCALE SEMICONDUCTOR INC16MOTOROLA INC4GLOBALFOUNDRIES INC2GLOBALFOUNDRIES US INC1MICHAELSON LYNNE M1
Top patents by PatentIndex Score
26 records- 0191US7276435B1Die level metal density gradient for improved flip chip package reliabilityFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Oct 2, 2007·27 cites·20 claims
- 0290US7622309B2Mechanical integrity evaluation of low-k devices with bump shearFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted Nov 24, 2009·23 cites·17 claims
- 0389US6951801B2Metal reduction in wafer scribe areaFREESCALE SEMICONDUCTOR INC·Filed 2003·Granted Oct 4, 2005·51 cites·24 claims
- 0485US6531384B1Method of forming a bond pad and structure thereofMOTOROLA INC·Filed 2001·Granted Mar 11, 2003·55 cites·20 claims
- 0585US6429531B1Method and apparatus for manufacturing an interconnect structureMOTOROLA INC·Filed 2000·Granted Aug 6, 2002·52 cites·11 claims
- 0685US6420208B1Method of forming an alternative ground contact for a semiconductor dieMOTOROLA INC·Filed 2000·Granted Jul 16, 2002·45 cites·20 claims
- 0783US7247552B2Integrated circuit having structural support for a flip-chip interconnect pad and method thereforFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted Jul 24, 2007·12 cites·20 claims
- 0883US6803302B2Method for forming a semiconductor device having a mechanically robust pad interfaceFREESCALE SEMICONDUCTOR INC·Filed 1999·Granted Oct 12, 2004·64 cites·16 claims
- 0982US7041576B2Separately strained N-channel and P-channel transistorsFREESCALE SEMICONDUCTOR INC·Filed 2004·Granted May 9, 2006·37 cites·21 claims
- 1082US6294458B1Semiconductor device adhesive layer structure and process for forming structureMOTOROLA INC·Filed 2000·Granted Sep 25, 2001·36 cites·24 claims
- 1176US7358616B2Semiconductor stacked die/wafer configuration and packaging and method thereofFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted Apr 15, 2008·7 cites·20 claims
- 1272US8581383B23-D semiconductor die structure with containing feature and methodPOZDER SCOTT K·Filed 2010·Granted Nov 12, 2013·4 cites·20 claims
- 1372US7169694B2Method for forming a bond pad interfaceFREESCALE SEMICONDUCTOR INC·Filed 2004·Granted Jan 30, 2007·16 cites·33 claims
- 1470US7811932B23-D semiconductor die structure with containing feature and methodFREESCALE SEMICONDUCTOR INC·Filed 2007·Granted Oct 12, 2010·4 cites·9 claims
- 1566US7622313B2Fabrication of three dimensional integrated circuit employing multiple die panelsFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted Nov 24, 2009·2 cites·16 claims
- 1663US2024413603A1Laser chips with a lead frame attachment to a photonics chipGLOBALFOUNDRIES US INC·Filed 2023·Application pending·0 cites
- 1762US7535078B2Semiconductor device having a fuse and method of forming thereofFREESCALE SEMICONDUCTOR INC·Filed 2002·Granted May 19, 2009·11 cites·20 claims
- 1849US2008197497A1Barrier for use in 3-d integration of circuitsFREESCALE SEMICONDUCTOR INC·Filed 2008·Application pending·0 cites
- 1947US7378339B2Barrier for use in 3-D integration of circuitsFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted May 27, 2008·0 cites·17 claims
- 2046US10566300B2Bond pads with surrounding fill linesGLOBALFOUNDRIES INC·Filed 2018·Granted Feb 18, 2020·0 cites·19 claims
- 2145US7553753B2Method of forming crack arrest features in embedded device build-up package and package thereofFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Jun 30, 2009·0 cites·15 claims
- 2245US6958548B2Semiconductor device with magnetically permeable heat sinkFREESCALE SEMICONDUCTOR INC·Filed 2003·Granted Oct 25, 2005·3 cites·21 claims
- 2342US7153726B2Semiconductor device with magnetically permeable heat sinkFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted Dec 26, 2006·0 cites·11 claims
- 2440US10643912B2Chip package interaction (CPI) back-end-of-line (BEOL) monitoring structure and methodGLOBALFOUNDRIES INC·Filed 2017·Granted May 5, 2020·0 cites·14 claims
- 2539US2007181653A1Magnetic alignment of integrated circuits to each otherMICHAELSON LYNNE M·Filed 2006·Application pending·0 cites
- 2635US2005280088A1Backside body contactMIN BYOUNG W·Filed 2004·Application pending·0 cites
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