Inventor · disambiguated record
Reiner Willeke
Also filed as: WILLEKE REINER
3 granted patents·1 pending application·9 citations·filing 2011–2015
60Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0167US9773744B2Solder bump cleaning before reflowWILLEKE REINER·Filed 2011·Granted Sep 26, 2017·7 cites·20 claims
- 0266US9214436B2Etching of under bump mettallization layer and resulting deviceGLOBALFOUNDRIES INC·Filed 2014·Granted Dec 15, 2015·2 cites·11 claims
- 0341US9159683B2Methods for etching copper during the fabrication of integrated circuitsGLOBALFOUNDRIES INC·Filed 2014·Granted Oct 13, 2015·0 cites·14 claims
- 0441US2016043046A1Etching of under bump metallization layer and resulting deviceGLOBALFOUNDRIES INC·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →