Inventor · disambiguated record
Kuniaki Mamitsu
Also filed as: MAMITSU KUNIAKI
29 granted patents·2 pending applications·552 citations·filing 2000–2014
97Inventor score
Top patents by PatentIndex Score
31 records- 0196US6703707B1Semiconductor device having radiation structureDENSO CORP·Filed 2000·Granted Mar 9, 2004·151 cites·57 claims
- 0294US8125781B2Semiconductor deviceMAMITSU KUNIAKI·Filed 2005·Granted Feb 28, 2012·37 cites·42 claims
- 0389US6891265B2Semiconductor device having radiation structureDENSO CORP·Filed 2003·Granted May 10, 2005·34 cites·1 claims
- 0489US6693350B2Semiconductor device having radiation structure and method for manufacturing semiconductor device having radiation structureDENSO CORP·Filed 2002·Granted Feb 17, 2004·56 cites·25 claims
- 0588US7957135B2Semiconductor moduleDENSO CORP·Filed 2009·Granted Jun 7, 2011·18 cites·2 claims
- 0688US6960825B2Semiconductor device having radiation structureDENSO CORP·Filed 2003·Granted Nov 1, 2005·33 cites·2 claims
- 0787US6992383B2Semiconductor device having radiation structureDENSO CORP·Filed 2003·Granted Jan 31, 2006·30 cites·2 claims
- 0885US7145254B2Transfer-molded power device and method for manufacturing transfer-molded power deviceDENSO CORP·Filed 2002·Granted Dec 5, 2006·45 cites·3 claims
- 0984US9070666B2Semiconductor device including coolerDENSO CORP·Filed 2014·Granted Jun 30, 2015·5 cites·1 claims
- 1084US6798062B2Semiconductor device having radiation structureDENSO CORP·Filed 2003·Granted Sep 28, 2004·23 cites·2 claims
- 1179US8547697B2Fixing structure and fixing method of circuit board with embedded electronic parts to coolerFUKUTANI KEITA·Filed 2011·Granted Oct 1, 2013·7 cites·18 claims
- 1278US7470939B2Semiconductor deviceDENSO CORP·Filed 2006·Granted Dec 30, 2008·9 cites·14 claims
- 1378US7235876B2Semiconductor device having metallic plate with grooveDENSO CORP·Filed 2006·Granted Jun 26, 2007·8 cites·8 claims
- 1478US6967404B2Semiconductor device having radiation structureDENSO CORP·Filed 2003·Granted Nov 22, 2005·16 cites·2 claims
- 1577US7944045B2Semiconductor module molded by resin with heat radiation plate opened outside from moldDENSO CORP·Filed 2009·Granted May 17, 2011·7 cites·9 claims
- 1677US7728413B2Resin mold type semiconductor deviceDENSO CORP·Filed 2006·Granted Jun 1, 2010·10 cites·11 claims
- 1774US6803667B2Semiconductor device having a protective filmDENSO CORP·Filed 2002·Granted Oct 12, 2004·22 cites·38 claims
- 1873US8963315B2Semiconductor device with surface electrodesFUKUOKA DAISUKE·Filed 2011·Granted Feb 24, 2015·4 cites·13 claims
- 1972US8957517B2Semiconductor device including coolerDENSO CORP·Filed 2013·Granted Feb 17, 2015·2 cites·2 claims
- 2070US8558375B2Semiconductor package cooled by grounded coolerMAMITSU KUNIAKI·Filed 2011·Granted Oct 15, 2013·2 cites·4 claims
- 2168US10079226B2Semiconductor deviceMAMITSU KUNIAKI·Filed 2012·Granted Sep 18, 2018·2 cites·45 claims
- 2268US8441122B2Semiconductor device having semiconductor chip and metal plateFUKUOKA DAISUKE·Filed 2010·Granted May 14, 2013·3 cites·3 claims
- 2367US7091603B2Semiconductor deviceDENSO CORP·Filed 2004·Granted Aug 15, 2006·13 cites·8 claims
- 2466US8278747B2Semiconductor apparatus having a two-side heat radiation structureMAMITSU KUNIAKI·Filed 2009·Granted Oct 2, 2012·3 cites·17 claims
- 2564US8497572B2Semiconductor module and method of manufacturing the sameFUKUTANI KEITA·Filed 2011·Granted Jul 30, 2013·3 cites·26 claims
- 2660US7239016B2Semiconductor device having heat radiation plate and bonding memberDENSO CORP·Filed 2004·Granted Jul 3, 2007·9 cites·24 claims
- 2756US8884426B2Semiconductor device including coolerDENSO CORP·Filed 2014·Granted Nov 11, 2014·0 cites·2 claims
- 2844US2007236891A1Semiconductor device having heat radiation member and semiconductor chip and method for manufacturing the sameDENSO CORP·Filed 2007·Application pending·0 cites
- 2941US7345369B2Semiconductor device having semiconductor chip on base through solder layer and method for manufacturing the sameDENSO CORP·Filed 2005·Granted Mar 18, 2008·0 cites·6 claims
- 3040US7573687B2Power semiconductor deviceDENSO CORP·Filed 2007·Granted Aug 11, 2009·0 cites·13 claims
- 3140US2005167802A1Semiconductor deviceDENSO CORP·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →