Inventor · disambiguated record
Keisuke Yamanishi
Also filed as: YAMANISHI KEISUKE
11 granted patents·7 pending applications·249 citations·filing 1990–2022
89Inventor score
Files withYAMANISHI KEISUKE5NIKKO GOULD FOIL KK4SUMITOMO CHEMICAL CO4JX NIPPON MINING & METALS CORP3KOBAYASHI YOUSUKE2
Top patents by PatentIndex Score
18 records- 0192US5366814ACopper foil for printed circuits and process for producing the sameNIKKO GOULD FOIL KK·Filed 1993·Granted Nov 22, 1994·108 cites·14 claims
- 0290US8252166B2Method of roughening rolled copper or copper alloy foilKOBAYASHI YOUSUKE·Filed 2011·Granted Aug 28, 2012·5 cites·24 claims
- 0389US8449987B2Rolled copper or copper alloy foil with roughened surface and method of roughening rolled copper or copper alloy foilKOBAYASHI YOUSUKE·Filed 2007·Granted May 28, 2013·8 cites·10 claims
- 0482US5389446ACopper foil for printed circuitsNIKKO GOULD FOIL KK·Filed 1993·Granted Feb 14, 1995·42 cites·4 claims
- 0577US5456817ASurface treatment method of a copper foil for printed circuitsNIKKO GOULD FOIL KK·Filed 1994·Granted Oct 10, 1995·44 cites·9 claims
- 0673US5019222ATreatment of copper foil for printed circuitsNIKKO GOULD FOIL KK·Filed 1990·Granted May 28, 1991·40 cites·4 claims
- 0766US8357307B2Method of forming electronic circuitJX NIPPON MINING & METALS CORP·Filed 2009·Granted Jan 22, 2013·2 cites·13 claims
- 0864US2024067814A1Resin composition and molded bodySUMITOMO CHEMICAL CO·Filed 2022·Application pending·0 cites
- 0958US8668994B2Rolled copper foil or electrolytic copper foil for electronic circuit, and method of forming electronic circuit using sameYAMANISHI KEISUKE·Filed 2009·Granted Mar 11, 2014·0 cites·19 claims
- 1055US11447628B2Liquid-crystalline resin composition and molded articleSUMITOMO CHEMICAL CO·Filed 2017·Granted Sep 20, 2022·0 cites·9 claims
- 1151US11738921B2Banding bandSUMITOMO CHEMICAL CO·Filed 2019·Granted Aug 29, 2023·0 cites·8 claims
- 1250US2011259848A1Rolled Copper Foil or Electrolytic Copper Foil for Electronic Circuit, and Method of Forming Electronic Circuit Using SameJX NIPPON MINING & METALS CORP·Filed 2009·Application pending·0 cites
- 1349US2020216642A1Liquid-crystalline resin compositionSUMITOMO CHEMICAL CO·Filed 2017·Application pending·0 cites
- 1448US2013270218A1Rolled Copper Foil or Electrolytic Copper Foil for Electronic Circuit, and Method of Forming Electronic Circuit Using SameJX NIPPON MINING & METALS CORP·Filed 2013·Application pending·0 cites
- 1543US2011300401A1Rolled Copper Foil or Electrolytic Copper Foil for Electronic Circuit, and Method of Forming Electronic Circuit using sameYAMANISHI KEISUKE·Filed 2010·Application pending·0 cites
- 1640US8580390B2Rolled copper foil or electrolytic copper foil for electronic circuit, and method of forming electronic circuit using sameYAMANISHI KEISUKE·Filed 2009·Granted Nov 12, 2013·0 cites·19 claims
- 1739US2012318568A1Electronic circuit, method for forming same, and copper clad laminate for forming electronic circuitYAMANISHI KEISUKE·Filed 2011·Application pending·0 cites
- 1833US2013071652A1Laminate for flexible wiringYAMANISHI KEISUKE·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →