US2024067814A1PendingUtilityA1
Resin composition and molded body
Est. expiryApr 14, 2041(~14.7 yrs left)· nominal 20-yr term from priority
Inventors:Keisuke Yamanishi
C08L 61/16C08J 3/12C08J 2361/16C08J 2479/08C08J 2481/06C08L 2205/03C08L 71/10C08L 79/08C08L 81/06C08G 2650/40C08G 73/1053C08G 75/23C08G 65/4056C09D 181/06C09J 181/06
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Claims
Abstract
A resin composition comprises a polyether ether ketone, an aromatic polysulfone, a polyetherimide, and a fibrous filler.
Claims
exact text as granted — not AI-modified1 . A resin composition comprising a polyether ether ketone, an aromatic polysulfone, a polyetherimide, and a fibrous filler.
2 . The resin composition according to claim 1 , wherein the content of the polyetherimide is less than 40% by mass based on a total content of the polyether ether ketone, the aromatic polysulfone, and the polyetherimide.
3 . The resin composition according to claim 1 , wherein a content of the polyether ether ketone is 25% by mass or more based on the total content of the polyether ether ketone, the aromatic polysulfone, and the polyetherimide.
4 . The resin composition according to claim 1 , wherein a melt viscosity ratio between a melt viscosity of the polyether ether ketone at 400° C. and a melt viscosity of the aromatic polysulfone at 400° C. (a melt viscosity of aromatic polysulfone/a melt viscosity of polyether ether ketone) is 1.5 or more and 6 or less.
5 . The resin composition according to claim 1 , wherein a content of the fibrous filler is 10 parts by mass or more and 100 parts by mass or less based on 100 parts by mass of the total content of the polyether ether ketone, the aromatic polysulfone, and the polyetherimide.
6 . A resin composition comprising a polyether ether ketone, an aromatic polysulfone, a polyetherimide, and a fibrous filler, wherein openings generated by contacting N-methylpyrrolidone with a cross section of a molded body made by using the resin composition have an average circle-equivalent diameter of 0.22 μm or less.
7 . A molded body produced by using the resin composition according to claim 1 .Join the waitlist — get patent alerts
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