Inventor · disambiguated record
Takami Otsuki
Also filed as: OTSUKI TAKAMI
10 granted patents·1 pending application·12 citations·filing 2009–2020
82Inventor score
Top patents by PatentIndex Score
11 records- 0179US9741788B2Semiconductor device and method for fabricating the sameMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Aug 22, 2017·3 cites·3 claims
- 0279US9425065B2Semiconductor device and method of manufacture thereofMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Aug 23, 2016·3 cites·11 claims
- 0372US10727150B2Semiconductor module and power converterMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Jul 28, 2020·2 cites·4 claims
- 0472US9578754B2Metal base substrate, power module, and method for manufacturing metal base substrateMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Feb 21, 2017·2 cites·20 claims
- 0564US8994141B2Semiconductor device and method for fabricating the sameTAKAHASHI TETSUO·Filed 2010·Granted Mar 31, 2015·2 cites·20 claims
- 0653US11610873B2Semiconductor device and method of manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2020·Granted Mar 21, 2023·0 cites·7 claims
- 0748US10615140B2Semiconductor device suppressing an inclination of a semiconductor element after solder bondingMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Apr 7, 2020·0 cites·6 claims
- 0848US9159676B2Semiconductor moduleMITSUBISHI ELECTRIC CORP·Filed 2014·Granted Oct 13, 2015·0 cites·10 claims
- 0945US2013082283A1Semiconductor device and method of manufacture thereofOTSUKI TAKAMI·Filed 2012·Application pending·0 cites
- 1044US9723718B2Electronic component mounting device and semiconductor device including the sameMITSUBISHI ELECTRIC CORP·Filed 2014·Granted Aug 1, 2017·0 cites·12 claims
- 1144US9236436B2Semiconductor deviceTAKAHASHI TETSUO·Filed 2009·Granted Jan 12, 2016·0 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →