Inventor · disambiguated record
Yoshimaro Fujii
Also filed as: FUJII YOSHIMARO
27 granted patents·4 pending applications·361 citations·filing 2003–2022
97Inventor score
Top patents by PatentIndex Score
31 records- 0199US7566635B2Substrate dividing methodHAMAMATSU PHOTONICS KK·Filed 2006·Granted Jul 28, 2009·172 cites·16 claims
- 0297US8314013B2Semiconductor chip manufacturing methodFUJII YOSHIMARO·Filed 2010·Granted Nov 20, 2012·23 cites·6 claims
- 0397US8304325B2Substrate dividing methodFUJII YOSHIMARO·Filed 2007·Granted Nov 6, 2012·25 cites·6 claims
- 0496US8518800B2Substrate dividing methodFUJII YOSHIMARO·Filed 2012·Granted Aug 27, 2013·13 cites·7 claims
- 0595US9543207B2Substrate dividing methodHAMAMATSU PHOTONICS KK·Filed 2016·Granted Jan 10, 2017·6 cites·29 claims
- 0695US8519511B2Substrate dividing methodFUJII YOSHIMARO·Filed 2012·Granted Aug 27, 2013·10 cites·3 claims
- 0794US10068801B2Substrate dividing methodHAMAMATSU PHOTONICS KK·Filed 2017·Granted Sep 4, 2018·4 cites·5 claims
- 0894US8518801B2Substrate dividing methodFUJII YOSHIMARO·Filed 2012·Granted Aug 27, 2013·8 cites·4 claims
- 0993US9548246B2Substrate dividing methodHAMAMATSU PHOTONICS KK·Filed 2016·Granted Jan 17, 2017·4 cites·24 claims
- 1091US11424162B2Substrate dividing methodHAMAMATSU PHOTONICS KK·Filed 2021·Granted Aug 23, 2022·1 cites·2 claims
- 1191US9553023B2Substrate dividing methodHAMAMATSU PHOTONICS KK·Filed 2016·Granted Jan 24, 2017·3 cites·20 claims
- 1291US8268704B2Method for dicing substrateFUJII YOSHIMARO·Filed 2003·Granted Sep 18, 2012·25 cites·56 claims
- 1388US9543256B2Substrate dividing methodHAMAMATSU PHOTONICS KK·Filed 2016·Granted Jan 10, 2017·2 cites·30 claims
- 1487US7649236B2Semiconductor photodetector and photodetecting device having layers with specific crystal orientationsHAMAMATSU PHOTONICS KK·Filed 2006·Granted Jan 19, 2010·15 cites·6 claims
- 1584US2022352026A1Substrate dividing methodHAMAMATSU PHOTONICS KK·Filed 2022·Application pending·0 cites
- 1682US6933489B2Back illuminated photodiode array and method of manufacturing the sameHAMAMATSU PHOTONICS KK·Filed 2003·Granted Aug 23, 2005·29 cites·2 claims
- 1781US9711405B2Substrate dividing methodHAMAMATSU PHOTONICS KK·Filed 2015·Granted Jul 18, 2017·1 cites·2 claims
- 1880US10622255B2Substrate dividing methodHAMAMATSU PHOTONICS KK·Filed 2018·Granted Apr 14, 2020·0 cites·20 claims
- 1980US9142458B2Substrate dividing methodHAMAMATSU PHOTONICS KK·Filed 2014·Granted Sep 22, 2015·1 cites·12 claims
- 2079US9287177B2Substrate dividing methodHAMAMATSU PHOTONICS KK·Filed 2015·Granted Mar 15, 2016·1 cites·12 claims
- 2179US8889525B2Substrate dividing methodHAMAMATSU PHOTONICS KK·Filed 2013·Granted Nov 18, 2014·1 cites·12 claims
- 2278US11101315B2Detector, PET system and X-ray CT systemHAMAMATSU PHOTONICS KK·Filed 2017·Granted Aug 24, 2021·2 cites·12 claims
- 2376US2020203225A1Substrate dividing methodHAMAMATSU PHOTONICS KK·Filed 2020·Application pending·0 cites
- 2475US9293499B2Semiconductor light detecting element having silicon substrate and conductorMASE MITSUHITO·Filed 2011·Granted Mar 22, 2016·1 cites·6 claims
- 2565US7336808B2Optical sensorHAMAMATSU PHOTONICS KK·Filed 2003·Granted Feb 26, 2008·13 cites·3 claims
- 2660US8993361B2Manufacturing method for edge illuminated type photodiode and semiconductor waferHAMAMATSU PHOTONICS KK·Filed 2013·Granted Mar 31, 2015·1 cites·8 claims
- 2752US10879303B2Detector, PET system and X-ray CT systemHAMAMATSU PHOTONICS KK·Filed 2014·Granted Dec 29, 2020·0 cites·33 claims
- 2852US7960202B2Photodiode array having semiconductor substrate and crystal fused regions and method for making thereofHAMAMATSU PHOTONICS KK·Filed 2007·Granted Jun 14, 2011·0 cites·4 claims
- 2947US2006197188A1Photodiode array and method for making thereofHAMAMATSU PHOTONICS KK·Filed 2006·Application pending·0 cites
- 3045US9385151B2Manufacturing method for edge illuminated type photodiode and semiconductor waferHAMAMATSU PHOTONICS KK·Filed 2015·Granted Jul 5, 2016·0 cites·3 claims
- 3131US2017200693A1Electronic componentHAMAMATSU PHOTONICS KK·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →