Inventor · disambiguated record
Wei Fen Sueann Lim
Also filed as: LIM WEI FEN SUEANN
15 granted patents·7 pending applications·8 citations·filing 2011–2024
87Inventor score
Top patents by PatentIndex Score
22 records- 0191US11791170B2Universal semiconductor package moldsTEXAS INSTRUMENTS INC·Filed 2021·Granted Oct 17, 2023·2 cites·16 claims
- 0281US10115660B2Leadframe strip with vertically offset die attach pads between adjacent vertical leadframe columnsTEXAS INSTRUMENTS INC·Filed 2017·Granted Oct 30, 2018·2 cites·13 claims
- 0378US11056462B2Locking dual leadframe for flip chip on leadframe packagesTEXAS INSTRUMENTS INC·Filed 2017·Granted Jul 6, 2021·2 cites·20 claims
- 0476US10784190B2Method of making leadframe stripTEXAS INSTRUMENTS INC·Filed 2017·Granted Sep 22, 2020·1 cites·19 claims
- 0571US11373940B2Method of making leadframe stripTEXAS INSTRUMENTS INC·Filed 2020·Granted Jun 28, 2022·0 cites·16 claims
- 0670US11742263B2Flippable leadframe for packaged electronic system having vertically stacked chip and componentsTEXAS INSTRUMENTS INC·Filed 2020·Granted Aug 29, 2023·0 cites·21 claims
- 0769US9892936B2Packaged semiconductor device having leadframe features preventing delaminationTEXAS INSTRUMENTS INC·Filed 2016·Granted Feb 13, 2018·1 cites·5 claims
- 0860US2025308939A1Leadframe and electronic device singulation processBIN ABDUL AZIZ ANIS FAUZI·Filed 2024·Application pending·0 cites
- 0957US2020176365A1Integrated circuit package with lead lockTEXAS INSTRUMENTS INC·Filed 2020·Application pending·0 cites
- 1056US10879154B2Flippable leadframe for packaged electronic system having vertically stacked chips and componentsTEXAS INSTRUMENTS INC·Filed 2016·Granted Dec 29, 2020·0 cites·11 claims
- 1155US10541225B2Methods of assembling a flip chip on a locking dual leadframeTEXAS INSTRUMENTS INC·Filed 2017·Granted Jan 21, 2020·0 cites·16 claims
- 1253US12021011B2Solder surface features for integrated circuit packagesTEXAS INSTRUMENTS INC·Filed 2021·Granted Jun 25, 2024·0 cites·16 claims
- 1352US2021043466A1Universal semiconductor package moldsTEXAS INSTRUMENTS INC·Filed 2019·Application pending·0 cites
- 1451US11626350B2Cutting a leadframe assembly with a plurality of punching toolsTEXAS INSTRUMENTS INC·Filed 2020·Granted Apr 11, 2023·0 cites·9 claims
- 1551US2023361008A1Electronic device with high draft angle package structureTEXAS INSTRUMENTS INC·Filed 2022·Application pending·0 cites
- 1649US2019206770A1Integrated circuit package with lead lockTEXAS INSTRUMENTS INC·Filed 2017·Application pending·0 cites
- 1748US11502045B2Electronic device with step cut leadTEXAS INSTRUMENTS INC·Filed 2019·Granted Nov 15, 2022·0 cites·41 claims
- 1847US2018122724A1Semiconductor Device Having Leadframe With Pressure-Absorbing Pad StrapsLEE LEE HAN MENG@EUGENE·Filed 2017·Application pending·0 cites
- 1946US9842807B2Integrated circuit assemblyTEXAS INSTRUMENTS INC·Filed 2015·Granted Dec 12, 2017·0 cites·20 claims
- 2044US11569152B2Electronic device with lead pitch gapTEXAS INSTRUMENTS INC·Filed 2019·Granted Jan 31, 2023·0 cites·19 claims
- 2142US11348806B2Making a flat no-lead package with exposed electroplated side lead surfacesTEXAS INSTRUMENTS INC·Filed 2014·Granted May 31, 2022·0 cites·13 claims
- 2229US2013127029A1Two level leadframe with upset ball bonding surface and device packageLEE LEE HAN MENG EUGENE·Filed 2011·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Wei Fen Sueann Lim files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →