Universal semiconductor package molds

Abstract

In accordance with at least one example of the disclosure, a system comprises a semiconductor package, comprising a first side surface having a first set of metal contacts extending therefrom; a second side surface having a second set of metal contacts extending therefrom; a top surface; a bottom surface; and an end surface meeting at least one of the first side surface, the second side surface, the top surface, and the bottom surface at a non-rounded edge.

What is claimed is: 
     
         1 . A semiconductor package, comprising:
 a first side surface having a first set of metal contacts extending therefrom;   a second side surface having a second set of metal contacts extending therefrom;   a top surface;   a bottom surface; and   an end surface meeting at least one of the first side surface, the second side surface, the top surface, and the bottom surface at a non-rounded edge.   
     
     
         2 . The package of  claim 1 , further comprising a second end surface opposite the end surface, the second end surface meeting at least one of the first side surface, the second side surface, the top surface, and the bottom surface at another non-rounded edge. 
     
     
         3 . The package of  claim 1 , wherein the end surface forms an approximately 90 degree angle with at least one of the first side surface, the second side surface, the top surface, and the bottom surface. 
     
     
         4 . The package of  claim 1 , wherein the first set of metal contacts comprise gullwing leads. 
     
     
         5 . The package of  claim 1 , wherein the top surface and the first side surface form an angle greater than 90 degrees. 
     
     
         6 . The package of  claim 1 , wherein the top surface and the first side surface form a rounded edge. 
     
     
         7 . A semiconductor package, comprising:
 a top surface;   a bottom surface opposite the top surface;   a first side surface positioned between the top and bottom surfaces;   a first set of metal contacts extending from the first side surface;   a second side surface positioned between the top and bottom surfaces;   a second set of metal contacts extending from the second side surface; and   an end surface forming an approximately 90 degree angle with at least one of the top surface, the bottom surface, the first side surface, and the second side surface.   
     
     
         8 . The package of  claim 7 , further comprising a second end surface opposite the end surface and forming another approximately 90 degree angle with at least one of the top surface, the bottom surface, the first side surface, and the second side surface. 
     
     
         9 . The package of  claim 7 , wherein the end surface meets at least one of the top surface, the bottom surface, the first side surface, and the second side surface at a non-rounded edge. 
     
     
         10 . The package of  claim 7 , wherein the first set of metal contacts comprise gullwing leads. 
     
     
         11 . The package of  claim 7 , wherein the bottom surface and the second side surface form an angle greater than 90 degrees. 
     
     
         12 . The package of  claim 7 , wherein the bottom surface and the second side surface form a rounded edge. 
     
     
         13 . A semiconductor packaging system, comprising:
 a semiconductor packaging mold, comprising:
 a mold compound storage cavity; 
 a plurality of semiconductor die cavities, each semiconductor die cavity configured to accommodate multiple semiconductor dies along a longitudinal axis of the semiconductor die cavity and further configured to accommodate a mold compound such that the mold compound abuts the multiple semiconductor dies; and 
 a plurality of runner cavities extending from the mold compound storage cavity to the plurality of semiconductor die cavities. 
   
     
     
         14 . The system of  claim 13 , further comprising a second semiconductor packaging mold comprising a second plurality of semiconductor die cavities. 
     
     
         15 . The system of  claim 13 , wherein each of the plurality of semiconductor die cavities includes rounded edges. 
     
     
         16 . The system of  claim 13 , wherein each of the plurality of semiconductor die cavities includes a pair of surfaces meeting at an angle less than 90 degrees. 
     
     
         17 . A method, comprising:
 providing a lead frame having a plurality of semiconductor dies positioned in a column;   positioning the lead frame over a semiconductor packaging mold such that the plurality of semiconductor dies are positioned over a semiconductor die cavity;   placing a second semiconductor packaging mold over the lead frame;   injecting a mold compound into the semiconductor die cavity;   removing the second semiconductor packaging mold;   removing the lead frame from the semiconductor packaging mold; and   singulating the plurality of semiconductor dies to produce a plurality of semiconductor packages, each of the plurality of semiconductor packages comprising a semiconductor die encapsulated within the mold compound.   
     
     
         18 . The method of  claim 17 , wherein at least one of the plurality of semiconductor packages comprises:
 a first side surface having a first set of metal contacts extending therefrom;   a second side surface having a second set of metal contacts extending therefrom;   a top surface;   a bottom surface; and   an end surface meeting at least one of the first side surface, the second side surface, the top surface, and the bottom surface at a non-rounded edge.   
     
     
         19 . The method of  claim 17 , wherein at least one of the plurality of semiconductor packages comprises:
 a top surface;   a bottom surface opposite the top surface;   a first side surface positioned between the top and bottom surfaces;   a first set of metal contacts extending from the first side surface;   a second side surface positioned between the top and bottom surfaces;   a second set of metal contacts extending from the second side surface; and   an end surface forming an approximately 90 degree angle with at least one of the top surface, the bottom surface, the first side surface, and the second side surface.   
     
     
         20 . A method, comprising:
 providing a first lead frame having a first plurality of semiconductor dies arranged along a first longitudinal axis, each of the first plurality of semiconductor dies having a first number of metal contacts;   encapsulating the first plurality of semiconductor dies in a first mold using a common semiconductor die cavity;   providing a second lead frame having a second plurality of semiconductor dies arranged along a second longitudinal axis, each of the second plurality of semiconductor dies having a second number of metal contacts; and   encapsulating the second plurality of semiconductor dies in a second mold using the common semiconductor die cavity.   
     
     
         21 . The method of  claim 20 , further comprising singulating the first mold to produce a plurality of semiconductor packages, each of the plurality of semiconductor packages comprising a different one of the first plurality of semiconductor dies. 
     
     
         22 . The method of  claim 21 , further comprising singulating the second mold to produce a second plurality of semiconductor packages, each of the second plurality of semiconductor packages comprising a different one of the second plurality of semiconductor dies.