Inventor · disambiguated record
Heung Lak Park
Also filed as: PARK HEUNG L · PARK HEUNG LAK · PARK HEUNG-WOO
20 granted patents·4 pending applications·383 citations·filing 1996–2023
95Inventor score
Files withAPPLIED MATERIALS INC11NOVELLUS SYSTEMS INC5HAN XINHAI2HYUNDAI ELECTRONICS IND2CHENG SIU F1
Top patents by PatentIndex Score
24 records- 0197US9157730B2PECVD processAPPLIED MATERIALS INC·Filed 2013·Granted Oct 13, 2015·49 cites·18 claims
- 0296US9721784B2Ultra-conformal carbon film depositionAPPLIED MATERIALS INC·Filed 2014·Granted Aug 1, 2017·29 cites·16 claims
- 0396US9458537B2PECVD processAPPLIED MATERIALS INC·Filed 2015·Granted Oct 4, 2016·12 cites·20 claims
- 0496US6962873B1Nitridation of electrolessly deposited cobaltNOVELLUS SYSTEMS INC·Filed 2002·Granted Nov 8, 2005·117 cites·10 claims
- 0595US9816187B2PECVD processAPPLIED MATERIALS INC·Filed 2016·Granted Nov 14, 2017·8 cites·20 claims
- 0694US7531463B2Fabrication of semiconductor interconnect structureNOVELLUS SYSTEMS INC·Filed 2006·Granted May 12, 2009·31 cites·30 claims
- 0793US11613812B2PECVD processAPPLIED MATERIALS INC·Filed 2020·Granted Mar 28, 2023·2 cites·20 claims
- 0891US7338908B1Method for fabrication of semiconductor interconnect structure with reduced capacitance, leakage current, and improved breakdown voltageNOVELLUS SYSTEMS INC·Filed 2003·Granted Mar 4, 2008·66 cites·54 claims
- 0990US10793954B2PECVD processAPPLIED MATERIALS INC·Filed 2018·Granted Oct 6, 2020·3 cites·13 claims
- 1090US10060032B2PECVD processAPPLIED MATERIALS INC·Filed 2017·Granted Aug 28, 2018·3 cites·20 claims
- 1189US10074534B2Ultra-conformal carbon film depositionAPPLIED MATERIALS INC·Filed 2017·Granted Sep 11, 2018·5 cites·9 claims
- 1288US8227352B2Amorphous carbon deposition method for improved stack defectivityYU HANG·Filed 2011·Granted Jul 24, 2012·13 cites·20 claims
- 1385US11898249B2PECVD processAPPLIED MATERIALS INC·Filed 2023·Granted Feb 13, 2024·0 cites·17 claims
- 1485US8563095B2Silicon nitride passivation layer for covering high aspect ratio featuresRAJAGOPALAN NAGARAJAN·Filed 2010·Granted Oct 22, 2013·11 cites·35 claims
- 1573US10030306B2PECVD apparatus and processAPPLIED MATERIALS INC·Filed 2013·Granted Jul 24, 2018·1 cites·16 claims
- 1669US7897198B1Electroless layer plating process and apparatusNOVELLUS SYSTEMS INC·Filed 2002·Granted Mar 1, 2011·16 cites·23 claims
- 1755US8298887B2High mobility monolithic p-i-n diodesHAN XINHAI·Filed 2010·Granted Oct 30, 2012·1 cites·18 claims
- 1851US8349741B2Amorphous carbon deposition method for improved stack defectivityAPPLIED MATERIALS INC·Filed 2012·Granted Jan 8, 2013·0 cites·19 claims
- 1948US5739049AMethod for fabricating semiconductor device having a capacitor and a method of forming metal wiring on a semiconductor substrateHYUNDAI ELECTRONICS IND·Filed 1996·Granted Apr 14, 1998·14 cites·21 claims
- 2043US2012043518A1Variable resistance memory element and fabrication methodsCHENG SIU F·Filed 2010·Application pending·0 cites
- 2138US2004065540A1Liquid treatment using thin liquid layerNOVELLUS SYSTEMS INC·Filed 2003·Application pending·0 cites
- 2233US2003155208A1Disk and hub assembly for electromagnetic clutch and method for manufacturing the sameFiled 2003·Application pending·0 cites
- 2332US5918142AMethod for fabricating a semiconductor deviceHYUNDAI ELECTRONICS IND·Filed 1997·Granted Jun 29, 1999·2 cites·7 claims
- 2431US2013161629A1Zero shrinkage smooth interface oxy-nitride and oxy-amorphous-silicon stacks for 3d memory vertical gate applicationHAN XINHAI·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →