Inventor · disambiguated record
Yong-Tae Oh
Also filed as: OH YONG-TAE
2 granted patents·2 pending applications·102 citations·filing 2007–2012
61Inventor score
Top patents by PatentIndex Score
4 records- 0196US7541252B2Methods of fabricating a semiconductor device including a self-aligned cell diodeSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Jun 2, 2009·101 cites·19 claims
- 0251US8791448B2Semiconductor memory devices having strapping contactsKIM JUNG-IN·Filed 2012·Granted Jul 29, 2014·1 cites·12 claims
- 0343US2008122116A1Method of forming metal layer wiring structure on backside of wafer, metal layer wiring structure formed using the method, method of stacking chip package, and chip package stack structure formed using the methodSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 0438US2008239783A1Semiconductor memory devices having strapping contactsSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →