Inventor · disambiguated record
David L. Bernard
Also filed as: BERNARD DAVID · BERNARD DAVID L · BERNARD DAVID LAURIER
28 granted patents·5 pending applications·69 citations·filing 1977–2023
94Inventor score
Files withFUNAI ELECTRIC CO12LEXMARK INT INC9BERNARD DAVID LAURIER4BERNARD DAVID3ANDERSON FRANK EDWARD1
Top patents by PatentIndex Score
33 records- 0197US9855566B1Fluid ejection head and process for making a fluid ejection head structureFUNAI ELECTRIC CO·Filed 2016·Granted Jan 2, 2018·21 cites·9 claims
- 0283US11980889B2Microfluidic chip, head, and dispensing device for dispensing fluids containing an acidic componentFUNAI ELECTRIC CO·Filed 2023·Granted May 14, 2024·0 cites·6 claims
- 0383US7938513B2Heater chips with silicon die bonded on silicon substrate and methods of fabricating the heater chipsLEXMARK INT INC·Filed 2008·Granted May 10, 2011·7 cites·20 claims
- 0482US9132654B1Label for inkjet printheadFUNAI ELECTRIC CO·Filed 2014·Granted Sep 15, 2015·3 cites·20 claims
- 0582US8087756B2Heater chips with silicon die bonded on silicon substrateANDERSON FRANK EDWARD·Filed 2011·Granted Jan 3, 2012·5 cites·3 claims
- 0680US10031415B1Method to taylor mechanical properties on MEMS devices and nano-devices with multiple layer photoimageable dry filmFUNAI ELECTRIC CO·Filed 2017·Granted Jul 24, 2018·2 cites·17 claims
- 0778US7479203B2Lamination of dry film to micro-fluid ejection head substratesLEXMARK INT INC·Filed 2005·Granted Jan 20, 2009·5 cites·19 claims
- 0876US9403365B2Method for fabricating fluid ejection deviceBERNARD DAVID·Filed 2011·Granted Aug 2, 2016·3 cites·5 claims
- 0975US9962948B1Fluid delivery devicesFUNAI ELECTRIC CO·Filed 2016·Granted May 8, 2018·1 cites·11 claims
- 1074US10599034B2Method for manufacturing MEMS devices and nano devices with varying degrees of hydrophobicity and hydrophilicity in a composite photoimageable dry filmFUNAI ELECTRIC CO·Filed 2017·Granted Mar 24, 2020·1 cites·9 claims
- 1171US11666918B2Microfluidic chip, head, and dispensing device for dispensing fluids containing an acidic componentFUNAI ELECTRIC CO·Filed 2020·Granted Jun 6, 2023·0 cites·9 claims
- 1268US8324076B2Micro-fluid ejection heads and methods for bonding substrates to supportsBERNARD DAVID LAURIER·Filed 2010·Granted Dec 4, 2012·2 cites·7 claims
- 1368US7735952B2Method of bonding a micro-fluid ejection head to a support substrateLEXMARK INT INC·Filed 2007·Granted Jun 15, 2010·2 cites·20 claims
- 1467US8728715B2Non-photosensitive siloxane coating for processing hydrophobic photoimageable nozzle plateBERNARD DAVID·Filed 2012·Granted May 20, 2014·1 cites·22 claims
- 1565US11746005B2Deep reactive ion etching process for fluid ejection headsFUNAI ELECTRIC CO·Filed 2021·Granted Sep 5, 2023·0 cites·17 claims
- 1661US10647119B2Method for fabricating fluid ejection deviceFUNAI ELECTRIC CO·Filed 2018·Granted May 12, 2020·0 cites·10 claims
- 1761US8071275B2Methods for planarizing unevenness on surface of wafer photoresist layer and wafers produced by the methodsBERNARD DAVID LAURIER·Filed 2008·Granted Dec 6, 2011·1 cites·10 claims
- 1860US7271104B2Method for dry etching fluid feed slots in a silicon substrateLEXMARK INT INC·Filed 2005·Granted Sep 18, 2007·2 cites·18 claims
- 1960US4405725AFoamed polyisocyanuratesMOBAY CHEMICAL CORP·Filed 1977·Granted Sep 20, 1983·13 cites·6 claims
- 2054US2014203114A1Non-photosensitive siloxane coating for processing hydrophobic photoimageable nozzle plateFUNAI ELECTRIC CO·Filed 2014·Application pending·0 cites
- 2151US2016325546A1Fluid ejection deviceFUNAI ELECTRIC CO·Filed 2016·Application pending·0 cites
- 2250US7850284B2Method for dry etching fluid feed slots in a silicon substrateLEXMARK INT INC·Filed 2007·Granted Dec 14, 2010·0 cites·12 claims
- 2350US7815289B2Micro-fluid ejection heads and methods for bonding substrates to supportsLEXMARK INT INC·Filed 2007·Granted Oct 19, 2010·0 cites·6 claims
- 2448US2010206840A1Bonding a micro-fluid ejection head to a support substrateBERNARD DAVID L·Filed 2010·Application pending·0 cites
- 2547US8826502B2Method for making a substantially planar micro-fluid ejection headBERNARD DAVID LAURIER·Filed 2010·Granted Sep 9, 2014·0 cites·19 claims
- 2645US8882221B2Modular micro-fluid ejection head assemblyBERNARD DAVID LAURIER·Filed 2008·Granted Nov 11, 2014·0 cites·4 claims
- 2744US9878894B1Fluid delivery devices having improved efficiency in delivering fluid with reduced wastage of fluidFUNAI ELECTRIC CO·Filed 2016·Granted Jan 30, 2018·0 cites·8 claims
- 2843US2008083700A1Method and Apparatus for Maximizing Cooling for Wafer ProcessingLEXMARK INT INC·Filed 2006·Application pending·0 cites
- 2943US2013048601A1Use of Hydrogen-Oxygen Plasma for Forming Hydroxyl Functional Groups on a Polymer SurfaceDRYER PAUL·Filed 2011·Application pending·0 cites
- 3041US9132639B2Method for fabricating fluid ejection deviceBERNARD DAVID·Filed 2011·Granted Sep 15, 2015·0 cites·6 claims
- 3138US7560223B2Fluid ejection device structures and methods thereforLEXMARK INT INC·Filed 2004·Granted Jul 14, 2009·0 cites·31 claims
- 3236US8491095B2Fluid ejection device and method for fabricating fluid ejection deviceMCNEES ANDREW L·Filed 2011·Granted Jul 23, 2013·0 cites·20 claims
- 3336US7767103B2Micro-fluid ejection assembliesLEXMARK INT INC·Filed 2004·Granted Aug 3, 2010·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →