Fluid ejection device

Abstract

Disclosed is a method for fabricating a fluid ejection device. The method includes forming a drive circuitry layer on a substrate. The method further includes fabricating at least one fluid ejection element on the substrate. Furthermore, the method includes forming at least one slot within a top portion of the substrate, and forming at least one fluid feed trench within a bottom portion of the substrate. Each fluid feed trench of the at least one fluid feed trench is in fluid communication with one or more slots of the at least one slot. Additionally, the method includes laminating a flow feature layer and a nozzle plate over the substrate having the at least one slot and the at least one fluid feed trench formed therewithin. Further disclosed is a fluid ejection device fabricated using the aforementioned method.

1 - 20 . (canceled) 
     
     
         21 . A fluid ejection device comprising:
 a substrate comprising:
 a top portion and a bottom portion; 
 at least one slot formed within the top portion of the substrate; and 
 at least one fluid feed trench formed within the bottom portion of the substrate, each fluid feed trench of the at least one fluid feed trench being in fluid communication with the at least one slot; 
   a drive circuitry layer formed on the substrate;   at least one fluid ejection element fabricated on the top portion of the substrate and electrically coupled to the drive circuitry layer; and   one or more flow features disposed over the substrate; and   a nozzle plate disposed over the one or more flow features, wherein all of the one or more flow features and the nozzle plate are formed as a unitary structure in the form of a laminated layer disposed over the top portion of the substrate, and the at least one slot and the at least one fluid feed trench are formed within the substrate prior to the lamination of the laminated layer.   
     
     
         22 . The fluid ejection device of  claim 21 , wherein the laminated layer is directly coupled to the top portion of the substrate. 
     
     
         23 . The fluid ejection device of  claim 21 , wherein the at least one slot is formed within the top portion of the substrate by etching the top portion. 
     
     
         24 . The fluid ejection device of  claim 23 , wherein the top portion is etched by a deep reactive ion etching technique. 
     
     
         25 . The fluid ejection device of  claim 21 , wherein the at least one fluid feed trench is formed within the bottom portion of the substrate by etching the bottom portion. 
     
     
         26 . The fluid ejection device of  claim 25 , wherein the bottom portion is etched by a deep reactive ion etching technique. 
     
     
         27 . The fluid ejection device of  claim 21 , wherein at least one flow feature of the one or more flow features is in fluid communication with the at least one slot. 
     
     
         28 . The fluid ejection device of  claim 27 , wherein the nozzle plate comprises at least one nozzle in fluid communication with the at least one flow feature. 
     
     
         29 . The fluid ejection device of  claim 21 , wherein the drive circuitry layer is formed by complementary metal-oxide-semiconductor implantation. 
     
     
         30 . The fluid ejection driver of  claim 21 , wherein the laminated layer comprises a polymeric material. 
     
     
         31 . The fluid ejection driver of  claim 30 , wherein the polymeric material is photoimageable.