Inventor · disambiguated record
Dongsub Choi
Also filed as: CHOI DONGSUB
16 granted patents·168 citations·filing 2008–2018
93Inventor score
Top patents by PatentIndex Score
16 records- 0196US9116442B2Feedforward/feedback litho process control of stress and overlayADEL MICHAEL·Filed 2011·Granted Aug 25, 2015·18 cites·38 claims
- 0294US8175831B2Methods and systems for creating or performing a dynamic sampling scheme for a process during which measurements are performed on wafersIZIKSON PAVEL·Filed 2008·Granted May 8, 2012·42 cites·30 claims
- 0394US8111376B2Feedforward/feedback litho process control of stress and overlayADEL MICHAEL·Filed 2008·Granted Feb 7, 2012·20 cites·33 claims
- 0493US9709903B2Overlay target geometry for measuring multiple pitchesCHOI DONGSUB·Filed 2012·Granted Jul 18, 2017·15 cites·18 claims
- 0592US9093458B2Device correlated metrology (DCM) for OVL with embedded SEM structure overlay targetsAMIR NURIEL·Filed 2013·Granted Jul 28, 2015·31 cites·20 claims
- 0689US10295993B2Method and system for detecting and correcting problematic advanced process control parametersCHOI DONGSUB·Filed 2012·Granted May 21, 2019·14 cites·31 claims
- 0787US9476838B2Hybrid imaging and scatterometry targetsKLA TENCOR CORP·Filed 2014·Granted Oct 25, 2016·5 cites·18 claims
- 0885US10409171B2Overlay control with non-zero offset predictionKLA TENCOR CORP·Filed 2018·Granted Sep 10, 2019·3 cites·39 claims
- 0985US10095121B2Optimizing the utilization of metrology toolsKLA TENCOR CORP·Filed 2016·Granted Oct 9, 2018·5 cites·19 claims
- 1083US8655469B2Advanced process control optimizationCHOI DONGSUB·Filed 2011·Granted Feb 18, 2014·4 cites·15 claims
- 1180US10649447B2Methods and systems for creating or performing a dynamic sampling scheme for a process during which measurements are performed on wafersKLA TENCOR CORP·Filed 2017·Granted May 12, 2020·2 cites·19 claims
- 1276US10303835B2Method and apparatus for direct self assembly in target design and productionKLA TENCOR CORP·Filed 2015·Granted May 28, 2019·2 cites·26 claims
- 1375US8804137B2Unique mark and method to determine critical dimension uniformity and registration of reticles combined with wafer overlay capabilityCHOI DONGSUB·Filed 2010·Granted Aug 12, 2014·4 cites·21 claims
- 1465US9651943B2Methods and systems for creating or performing a dynamic sampling scheme for a process during which measurements are performed on wafersIZIKSON PAVEL·Filed 2012·Granted May 16, 2017·1 cites·16 claims
- 1561US9466100B2Focus monitoring method using asymmetry embedded imaging targetKLA TENCOR CORP·Filed 2013·Granted Oct 11, 2016·2 cites·20 claims
- 1653US10725385B2Optimizing the utilization of metrology toolsKLA TENCOR CORP·Filed 2018·Granted Jul 28, 2020·0 cites·20 claims
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