Inventor · disambiguated record
Naoki Idani
Also filed as: IDANI NAOKI
13 granted patents·7 pending applications·49 citations·filing 2003–2012
89Inventor score
Files withFUJITSU LTD8IDANI NAOKI4FUJITSU SEMICONDUCTOR LTD3FUJITSU MICROELECTRONICS LTD2SAKAMOTO MANABU2
Top patents by PatentIndex Score
20 records- 0190US8496758B2Cleaning apparatus and cleaning method for waferIDANI NAOKI·Filed 2011·Granted Jul 30, 2013·14 cites·7 claims
- 0277US7908698B2Cleaning apparatus and cleaning method for waferFUJITSU SEMICONDUCTOR LTD·Filed 2006·Granted Mar 22, 2011·5 cites·10 claims
- 0376US8658529B2Method for manufacturing semiconductor deviceIDANI NAOKI·Filed 2012·Granted Feb 25, 2014·5 cites·16 claims
- 0470US8614146B2Semiconductor device manufacture method and semiconductor deviceTAKESAKO SATOSHI·Filed 2011·Granted Dec 24, 2013·4 cites·17 claims
- 0566US7424688B2Designing and fabrication of a semiconductor deviceFUJITSU LTD·Filed 2006·Granted Sep 9, 2008·2 cites·3 claims
- 0665US7250644B2Electronic device and method for designing the sameFUJITSU LTD·Filed 2005·Granted Jul 31, 2007·3 cites·6 claims
- 0762US8991042B2Method for fabricating semiconductor deviceSAKAMOTO MANABU·Filed 2012·Granted Mar 31, 2015·1 cites·4 claims
- 0861US8286344B2Method for fabricating semiconductor deviceSAKAMOTO MANABU·Filed 2008·Granted Oct 16, 2012·2 cites·7 claims
- 0959US6854095B2Designing method and a manufacturing method of an electronic deviceFUJITSU LTD·Filed 2003·Granted Feb 8, 2005·7 cites·11 claims
- 1052US8153525B2Polishing method, polishing apparatus, and method for manufacturing semiconductor deviceIDANI NAOKI·Filed 2008·Granted Apr 10, 2012·0 cites·2 claims
- 1152US7879724B2Method of manufacturing a semiconductor device and a semiconductor manufacturing equipmentFUJITSU SEMICONDUCTOR LTD·Filed 2008·Granted Feb 1, 2011·0 cites·12 claims
- 1249US7951715B2Semiconductor device fabrication methodFUJITSU SEMICONDUCTOR LTD·Filed 2004·Granted May 31, 2011·4 cites·7 claims
- 1349US7017133B2Designing a semiconductor device layout using polishing regionsFUJITSU LTD·Filed 2004·Granted Mar 21, 2006·2 cites·11 claims
- 1447US2009215267A1Method of manufacturing semiconductor deviceFUJITSU MICROELECTRONICS LTD·Filed 2009·Application pending·0 cites
- 1546US2012171931A1Polishing method, polishing apparatus, and method for manufacturing semiconductor deviceIDANI NAOKI·Filed 2012·Application pending·0 cites
- 1643US2008064308A1Polishing apparatus and manufacturing method of an electronic apparatusFUJITSU LTD·Filed 2007·Application pending·0 cites
- 1743US2009075477A1Method of manufacturing semiconductor deviceFUJITSU MICROELECTRONICS LTD·Filed 2008·Application pending·0 cites
- 1842US2007215975A1Method of fabricating semiconductor deviceFUJITSU LTD·Filed 2006·Application pending·0 cites
- 1941US2007007246A1Manufacture of semiconductor device with CMPFUJITSU LTD·Filed 2005·Application pending·0 cites
- 2038US2005215180A1Semiconductor device fabrication methodFUJITSU LTD·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →