Inventor · disambiguated record
Hidenori Kimbara
Also filed as: KIMBARA HIDENORI
21 granted patents·1 pending application·545 citations·filing 1980–2010
96Inventor score
Top patents by PatentIndex Score
22 records- 0190US6396143B1Ball grid array type printed wiring board having exellent heat diffusibility and printed wiring boardMITSUBISHI GAS CHEMICAL CO·Filed 2000·Granted May 28, 2002·68 cites·3 claims
- 0288US6362436B1Printed wiring board for semiconductor plastic packageMITSUBISHI GAS CHEMICAL CO·Filed 2000·Granted Mar 26, 2002·49 cites·7 claims
- 0388US4904760AThermosetting resin composition from cyanate ester and non-branched aromatic compoundMITSUBISHI GAS CHEMICAL CO·Filed 1988·Granted Feb 27, 1990·57 cites·10 claims
- 0486US7056585B2Prepreg and laminateMITSUBISHI GAS CHEMICAL CO·Filed 2003·Granted Jun 6, 2006·25 cites·9 claims
- 0583US4944373ADisc brake padMITSUBISHI GAS CHEMICAL CO·Filed 1989·Granted Jul 31, 1990·28 cites·6 claims
- 0682US5082402AMethod of drilling of through-holes in printed circuit board panelsMITSUBISHI GAS CHEMICAL CO·Filed 1991·Granted Jan 21, 1992·50 cites·5 claims
- 0781US6479760B2Printed wiring board for semiconductor plastic packageMITSUBISHI GAS CHEMICAL CO·Filed 2001·Granted Nov 12, 2002·28 cites·7 claims
- 0876US4780507ACurable thermosetting cyanate ester compositionMITSUBISHI GAS CHEMICAL CO·Filed 1986·Granted Oct 25, 1988·38 cites·9 claims
- 0976US4740343AMethod for producing rigid resin moldsMITSUBISHI GAS CHEMICAL CO·Filed 1987·Granted Apr 26, 1988·37 cites·6 claims
- 1076US4533727AProcess for producing a curable resin from cyanate ester compound and unsaturated 1,2-epoxy compoundMITSUBISHI GAS CHEMICAL CO·Filed 1984·Granted Aug 6, 1985·22 cites·8 claims
- 1175US4330658ACurable resin compositionMITSUBISHI GAS CHEMICAL CO·Filed 1980·Granted May 18, 1982·24 cites·9 claims
- 1273US4554346APreparation of curable resin from cyanate ester compoundMITSUBISHI GAS CHEMICAL CO·Filed 1984·Granted Nov 19, 1985·24 cites·7 claims
- 1369US8377544B2Glass fabric base material/thermosetting resin copper-clad laminate having a high-elasticityMITSUBISHI GAS CHEMICAL CO·Filed 2010·Granted Feb 19, 2013·1 cites·2 claims
- 1466US4785034APolyolefin resin compositionMITSUBISHI GAS CHEMICAL CO·Filed 1987·Granted Nov 15, 1988·18 cites·11 claims
- 1563US4585855AProcess for producing curable resin composition from cyanate ester and maleimide/diamine reaction productMITSUBISHI GAS CHEMICAL CO·Filed 1985·Granted Apr 29, 1986·14 cites·11 claims
- 1661US4645805AAdhesive composition and adhesive film or sheet on which the composition is coatedMITSUBISHI GAS CHEMICAL CO·Filed 1985·Granted Feb 24, 1987·20 cites·7 claims
- 1761US4499245ACurable resin compositionMITSUBISHI GAS CHEMICAL CO·Filed 1983·Granted Feb 12, 1985·12 cites·3 claims
- 1850US4820855AProcess for producing polyfunctional cyanate ester polymerMITSUBISHI GAS CHEMICAL CO·Filed 1987·Granted Apr 11, 1989·7 cites·4 claims
- 1949US4717609AAdhesive composition and adhesive film or sheet on which the composition is coatedMITSUBISHI GAS CHEMICAL CO·Filed 1986·Granted Jan 5, 1988·13 cites·7 claims
- 2048US2006089070A1Glass fabric base material/thermosetting resin copper-clad laminate having a high-elasticityGAKU MORIO·Filed 2005·Application pending·0 cites
- 2142US4410666ACurable resin compositionMITSUBISHI GAS CHEMICAL CO·Filed 1981·Granted Oct 18, 1983·6 cites·3 claims
- 2235US4410601AColloidal solutions, processes for producing the same and uses thereofMITSUBISHI GAS CHEMICAL CO·Filed 1981·Granted Oct 18, 1983·4 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →