US2006089070A1PendingUtilityA1

Glass fabric base material/thermosetting resin copper-clad laminate having a high-elasticity

Assignee: GAKU MORIOPriority: Jul 29, 1999Filed: Dec 8, 2005Published: Apr 27, 2006
Est. expiryJul 29, 2019(expired)· nominal 20-yr term from priority
H05K 2201/0209B29C 70/003B32B 27/04H05K 2201/029B29K 2309/08H05K 1/0366B32B 15/14B32B 2311/12Y10T428/24331Y10T428/24917Y10T442/3008Y10T442/3423Y10T442/3415Y10T442/3341B32B 2457/08Y10T442/209Y10T428/24994Y10T442/2951Y10T442/2992Y10T442/2738B32B 2262/101B32B 2260/046B32B 2260/021B32B 15/20
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Claims

Abstract

A copper-clad laminate of a highly-elastic glass fabric base material/thermosetting resin formed of prepreg obtained by impregnating a glass fabric base material made of a glass woven fabric having a thickness of 25 to 150 μm, a weight of 15 to 165 g/m 2 and a gas permeability of 1 to 20 cm 3 /cm 2 /sec. with a thermosetting resin composition and drying it.

Claims

exact text as granted — not AI-modified
1 - 5 . (canceled)  
   
   
       6 . A process for processing a hole in a copper-clad laminate, being used in a printed wiring board, comprising a glass fabric/thermosetting resin base material, which comprises 
 adding and mixing an insulating inorganic filler with a thermosetting resin composition in an amount of 10 to 80% by weight based on said resin composition,    impregnating a glass fabric base material made of a glass woven fabric having a thickness of 25 to 40 μm, a weight of 15 to 27 g/m 2  and a gas permeability of 1 to 20 cm 3 /cm 2 /sec, with the thermosetting resin composition being dissolved in a solvent,    drying it to obtain prepreg,    placing a copper foil on the prepreg,    laminate-forming the copper foil and the prepreg to obtain the copper-clad laminate, and    irradiating the copper-clad laminate with a carbon dioxide gas laser to form a hole having a diameter of 0.15 mm or less.    
   
   
       7 . A process for processing a hole according to  claim 6 , wherein the output energy of a carbon dioxide gas laser is 20 to 60 mJ/pulse.  
   
   
       8 . A process for processing a hole according to  claim 6 , wherein the prepreg has a glass content of 25 to 70% by weight.  
   
   
       9 . A process for processing a hole according to  claim 6 , wherein a glass fabric material/thermosetting resin base material layer of the copper-clad laminate has a thickness of 30 to 150 μm.  
   
   
       10 . A process for processing a hole according to  claim 6 , wherein the thermosetting resin composition is a resin composition containing, as an essential component, a polyfunctional cyanate ester and a prepolymer of said polyfunctional cyanate ester.

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