Inventor · disambiguated record
Byong Woo Cho
Also filed as: CHO BYONG WOO
9 granted patents·2 pending applications·32 citations·filing 2009–2024
83Inventor score
Technology areasH10W
Top patents by PatentIndex Score
11 records- 0186US8575742B1Semiconductor device with increased I/O leadframe including power barsKIM WAN JONG·Filed 2009·Granted Nov 5, 2013·24 cites·19 claims
- 0282US2025022784A1Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrateAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Application pending·0 cites
- 0380US11031356B2Semiconductor package structure for improving die warpage and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2019·Granted Jun 8, 2021·2 cites·5 claims
- 0480US9917063B2Semiconductor package structure for improving die warpage and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2014·Granted Mar 13, 2018·4 cites·16 claims
- 0576US12107035B2Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrateAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Granted Oct 1, 2024·0 cites·20 claims
- 0673US10090230B2Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrateAMKOR TECHNOLOGY INC·Filed 2014·Granted Oct 2, 2018·2 cites·21 claims
- 0767US2021296263A1Semiconductor package structure for improving die warpage and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Application pending·0 cites
- 0859US12288764B2Semiconductor device and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Apr 29, 2025·0 cites·19 claims
- 0959US11430723B2Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrateAMKOR TECHNOLOGY INC·Filed 2018·Granted Aug 30, 2022·0 cites·21 claims
- 1056US10504857B2Semiconductor package structure for improving die warpage and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2018·Granted Dec 10, 2019·0 cites·22 claims
- 1147US11049828B2Electronic device with interconnection structure oblate ellipsoid-shaped apertureAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2016·Granted Jun 29, 2021·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →