Inventor · disambiguated record
Rajesh Vaddi
Also filed as: VADDI RAJESH
15 granted patents·14 pending applications·19 citations·filing 2010–2024
87Inventor score
Top patents by PatentIndex Score
29 records- 0197US11777067B2Bezel-free display tile with edge-wrapped conductors and methods of manufactureCORNING INC·Filed 2022·Granted Oct 3, 2023·3 cites·22 claims
- 0295US11282994B2Bezel-free display tile with edge-wrapped conductors and methods of manufactureCORNING INC·Filed 2018·Granted Mar 22, 2022·7 cites·29 claims
- 0393US12131985B2Hermetic metallized via with improved reliabilityCORNING INC·Filed 2021·Granted Oct 29, 2024·2 cites·10 claims
- 0486US11152294B2Hermetic metallized via with improved reliabilityCORNING INC·Filed 2019·Granted Oct 19, 2021·4 cites·18 claims
- 0577US2024140864A13d interposer with through glass vias - method of increasing adhesion between copper and glass surfaces and articles therefromCORNING INC·Filed 2024·Application pending·0 cites
- 0674US10424606B1Systems and methods for reducing substrate surface disruption during via formationCORNING INC·Filed 2018·Granted Sep 24, 2019·2 cites·55 claims
- 0774US2022173296A1Bezel-free display tile with edge-wrapped conductors and methods of manufactureCORNING INC·Filed 2022·Application pending·0 cites
- 0872US2020148593A13d interposer with through glass vias - method of increasing adhesion between copper and glass surfaces and articles therefromCORNING INC·Filed 2019·Application pending·0 cites
- 0967US11456225B2Method of manufacturing a glass article to provide increased bonding of metal to a glass substrate via the generation of a metal oxide layer, and glass articles such as glass interposers including the metal oxide layerCORNING INC·Filed 2021·Granted Sep 27, 2022·0 cites·3 claims
- 1067US11257728B2Fluidic assembly substrates and methods for making suchCORNING INC·Filed 2018·Granted Feb 22, 2022·1 cites·15 claims
- 1166US11756847B2Method of manufacturing a glass article to provide increased bonding of metal to a glass substrate via the generation of a metal oxide layer, and glass articles such as glass interposers including the metal oxide layerCORNING INC·Filed 2022·Granted Sep 12, 2023·0 cites·12 claims
- 1264US11201109B2Hermetic metallized via with improved reliabilityCORNING INC·Filed 2020·Granted Dec 14, 2021·0 cites·14 claims
- 1364US2025174470A1Method for metallization through-glass vias and a glass article manufacutured thereofCORNING INC·Filed 2024·Application pending·0 cites
- 1456US2020095684A1Methods for increasing adhesion between metallic films and glass surfaces and articles made therefromCORNING INC·Filed 2019·Application pending·0 cites
- 1554US12046481B2Systems and methods for reducing via formation impact on electronic device formationCORNING INC·Filed 2020·Granted Jul 23, 2024·0 cites·33 claims
- 1654US2025008654A1Methods and apparatus for manufacturing an electronic apparatusCORNING INC·Filed 2022·Application pending·0 cites
- 1749US11654657B2Through glass via fabrication using a protective materialCORNING INC·Filed 2018·Granted May 23, 2023·0 cites·20 claims
- 1849US2022212981A1Glass sheets with copper films and methods of making the sameCORNING INC·Filed 2020·Application pending·0 cites
- 1947US11329228B2Polar elastomer microstructures and methods for fabricating sameCORNING INC·Filed 2017·Granted May 10, 2022·0 cites·10 claims
- 2047US10957628B2Bottom up electroplating with release layerCORNING INC·Filed 2019·Granted Mar 23, 2021·0 cites·20 claims
- 2145US12013619B2Methods for forming thin film transistors on a glass substrate and liquid crystal displays formed therefromCORNING INC·Filed 2019·Granted Jun 18, 2024·0 cites·20 claims
- 2244US2020227277A1Interposer with manganese oxide adhesion layerCORNING INC·Filed 2019·Application pending·0 cites
- 2343US2021359185A1Device including vias and method and material for fabricating viasCORNING INC·Filed 2019·Application pending·0 cites
- 2442US2020115584A1A substrate with a polar elastomer dielectric and a method of coating a substrate with a polar elastomer dielectricCORNING INC·Filed 2017·Application pending·0 cites
- 2542US2019363010A1Methods of increasing adhesion between a conductive metal and an oxide substrate and articles made therefromCORNING INC·Filed 2019·Application pending·0 cites
- 2642US2019327840A13d interposer with through glass vias - method of increasing adhesion between copper and glass surfaces and articles therefromCORNING INC·Filed 2019·Application pending·0 cites
- 2742US2019378773A1Glass article having a metallic nanofilm and method of increasing adhesion between metal and glassCORNING INC·Filed 2019·Application pending·0 cites
- 2841US2021114923A1Systems and methods for adhering copper interconnects in a display deviceCORNING INC·Filed 2019·Application pending·0 cites
- 2939US8491712B2Dehydration systems and methods for removing water from a gasKIDAMBI GANESH PRASADH·Filed 2010·Granted Jul 23, 2013·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →