Methods for increasing adhesion between metallic films and glass surfaces and articles made therefrom

Abstract

Methods of plating a metal on a substrate including coating a nanoporous metal-oxide layer on a surface of the substrate prior to metal plating. Methods may include coating a surface of the substrate with a slurry including colloidal metal-oxide precursor particles and aluminum oxide particles. After coating, the slurry may be calcinated on the surface of the substrate to form a nanoporous metal-oxide layer on the surface. Then, a metallic film may be plated on the nanoporous metal-oxide layer. The metallic film may be plated by an electroless plating method and/or an electroplating method. Articles, such as electronic interposers, may be made using the methods of plating a metal described herein.

What is claimed is: 
     
         1 . A method of plating a metal on a substrate, the method comprising:
 coating a surface of the substrate with a slurry, the slurry comprising:
 colloidal metal-oxide precursor particles, and 
 aluminum oxide particles; 
   calcinating the slurry on the surface of the substrate to form a nanoporous metal-oxide layer on the surface of the substrate; and   plating the nanoporous metal-oxide layer with a metal.   
     
     
         2 . The method of  claim 1 , wherein the colloidal metal-oxide precursor particles comprise at least one of: aluminum oxide precursor particles, silicon oxide precursor particles, titanium oxide precursor particles, cerium oxide precursor particles, and zirconium oxide precursor particles. 
     
     
         3 . The method of  claim 1 , wherein the colloidal metal-oxide precursor particles comprise aluminum oxide precursor particles. 
     
     
         4 . The method of  claim 1 , wherein the colloidal metal-oxide precursor particles comprise aluminum oxide hydroxide particles. 
     
     
         5 . The method of  claim 1 , wherein the metal comprises copper. 
     
     
         6 . The method of  claim 1 , wherein the substrate is a glass or glass-ceramic substrate. 
     
     
         7 . The method of  claim 1 , wherein the substrate is a glass or glass-ceramic substrate comprising a via formed in the substrate and wherein the surface is an interior surface of the via. 
     
     
         8 . The method of  claim 7 , wherein the via is a through via. 
     
     
         9 . The method of  claim 1 , wherein the nanoporous metal-oxide layer comprises an average pore size in the range of 5 nanometers to 30 nanometers. 
     
     
         10 . The method of  claim 1 , wherein the nanoporous metal-oxide layer comprises a pore volume in the range of 0.3 cubic centimeters per gram to 10 cubic centimeters per gram. 
     
     
         11 . The method of  claim 1 , wherein the aluminum oxide particles comprise nanoparticles. 
     
     
         12 . The method of  claim 1 , wherein the slurry comprises X wt % aluminum oxide particles and Y wt % colloidal metal-oxide precursor particles, and wherein X is greater than or equal to Y. 
     
     
         13 . The method of  claim 1 , wherein a weight percent ratio of the aluminum oxide particles to the colloidal metal-oxide precursor particles in the slurry is in the range of 3:1 to 20:1. 
     
     
         14 . The method of  claim 1 , wherein plating the nanoporous metal-oxide layer comprises an electroless plating method. 
     
     
         15 . The method of  claim 14 , wherein plating the nanoporous metal-oxide layer further comprises an electroplating method performed after the electroless plating method. 
     
     
         16 . The method of  claim 1 , wherein the plated metal is capable of passing a 3N/cm tape test after being annealed at 350 degrees C. for 30 minutes. 
     
     
         17 . A method of plating copper on a substrate, the method comprising:
 coating a surface of the substrate with a slurry, the slurry comprising:
 colloidal aluminum oxide hydroxide particles, and 
 aluminum oxide particles; 
   calcinating the slurry on the surface of the substrate to form a nanoporous metal-oxide layer on the surface of the substrate;   charging the nanoporous metal-oxide layer, wherein the charging comprises treating the nanoporous metal-oxide layer with an aminosilane; and   plating the nanoporous metal-oxide layer with copper after charging the nanoporous metal-oxide layer.   
     
     
         18 . An article, comprising:
 a glass or glass-ceramic substrate comprising a surface having a plurality of vias formed therein, each via having an interior surface;   a nanoporous metal-oxide layer coated on the interior surface of each of the plurality of vias, the nanoporous metal-oxide layer comprising aluminum oxide and an average pore size in the range of 5 nanometers to 30 nanometers; and   a metal plating disposed on the nanoporous metal-oxide layer in each of the plurality of vias.   
     
     
         19 . The article of  claim 18 , wherein a least one of the vias is a through via. 
     
     
         20 . The article of  claim 18 , wherein the metal plating comprises copper.