Inventor · disambiguated record
Sang-Hoon Ahn
Also filed as: AHN SANG · AHN SANG H · AHN SANG HOON
83 granted patents·22 pending applications·915 citations·filing 2001–2024
99Inventor score
Files withSAMSUNG ELECTRONICS CO LTD45ITM SEMICONDUCTOR CO LTD17APPLIED MATERIALS INC15AHN SANG HOON7AHN SANG H3
Top patents by PatentIndex Score
105 records- 0198US9281277B2Methods of forming wiring structuresSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Mar 8, 2016·491 cites·12 claims
- 0295US7064078B2Techniques for the use of amorphous carbon (APF) for various etch and litho integration schemeAPPLIED MATERIALS INC·Filed 2004·Granted Jun 20, 2006·114 cites·23 claims
- 0394US10461027B2Semiconductor device including via plug and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Oct 29, 2019·10 cites·20 claims
- 0494US7297376B1Method to reduce gas-phase reactions in a PECVD process with silicon and organic precursors to deposit defect-free initial layersAPPLIED MATERIALS INC·Filed 2006·Granted Nov 20, 2007·33 cites·26 claims
- 0592US10475739B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Nov 12, 2019·8 cites·20 claims
- 0692US7718081B2Techniques for the use of amorphous carbon (APF) for various etch and litho integration schemesAPPLIED MATERIALS INC·Filed 2006·Granted May 18, 2010·17 cites·20 claims
- 0791US8426308B2Method of forming through silicon via of semiconductor device using low-k dielectric materialHAN KYU-HEE·Filed 2011·Granted Apr 23, 2013·16 cites·20 claims
- 0887US11452213B2Method of fabricating battery protection circuit packageITM SEMICONDUCTOR CO LTD·Filed 2021·Granted Sep 20, 2022·1 cites·9 claims
- 0986US10276505B2Integrated circuit device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Apr 30, 2019·5 cites·20 claims
- 1086US6927178B2Nitrogen-free dielectric anti-reflective coating and hardmaskAPPLIED MATERIALS INC·Filed 2003·Granted Aug 9, 2005·32 cites·20 claims
- 1186US6853043B2Nitrogen-free antireflective coating for use with photolithographic patterningAPPLIED MATERIALS INC·Filed 2002·Granted Feb 8, 2005·41 cites·32 claims
- 1284US9812450B2Semiconductor devices and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Nov 7, 2017·4 cites·10 claims
- 1384US9653400B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted May 16, 2017·5 cites·20 claims
- 1483US10283981B2Protection IC and semiconductor integrated circuitMITSUMI ELECTRIC CO LTD·Filed 2017·Granted May 7, 2019·4 cites·6 claims
- 1583US9680973B2Electronic device capable of NFC communicationITM SEMICONDUCTOR CO LTD·Filed 2015·Granted Jun 13, 2017·5 cites·6 claims
- 1682US10950845B2Battery protection circuit module packageITM SEMICONDUCTOR CO LTD·Filed 2019·Granted Mar 16, 2021·4 cites·19 claims
- 1782US10008407B2Methods of manufacturing semiconductor devices including conductive structuresSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Jun 26, 2018·4 cites·19 claims
- 1882US9728604B2Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Aug 8, 2017·3 cites·20 claims
- 1982US7611996B2Multi-stage curing of low K nano-porous filmsAPPLIED MATERIALS INC·Filed 2005·Granted Nov 3, 2009·10 cites·7 claims
- 2082US7547643B2Techniques promoting adhesion of porous low K film to underlying barrier layerAPPLIED MATERIALS INC·Filed 2005·Granted Jun 16, 2009·6 cites·17 claims
- 2181US10756550B2Battery protection circuit module and battery pack comprising sameITM SEMICONDUCTOR CO LTD·Filed 2016·Granted Aug 25, 2020·4 cites·17 claims
- 2281US10192782B2Method of manufacturing semiconductor device using a plurality of etch stop layersLEE WOOJIN·Filed 2015·Granted Jan 29, 2019·4 cites·20 claims
- 2379US11037872B2Semiconductor devices and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jun 15, 2021·2 cites·19 claims
- 2479US11011469B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted May 18, 2021·2 cites·20 claims
- 2579US10497649B2Integrated circuit device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Dec 3, 2019·2 cites·15 claims
- 2678US11375623B2Battery protection circuit package and method of fabricating the sameITM SEMICONDUCTOR CO LTD·Filed 2020·Granted Jun 28, 2022·1 cites·16 claims
- 2778US10867923B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Dec 15, 2020·2 cites·8 claims
- 2878US10090690B2Secondary battery protection circuitMITSUMI ELECTRIC CO LTD·Filed 2017·Granted Oct 2, 2018·3 cites·5 claims
- 2976US8455985B2Integrated circuit devices having selectively strengthened composite interlayer insulation layers and methods of fabricating the sameHAN KYU-HEE·Filed 2011·Granted Jun 4, 2013·4 cites·20 claims
- 3076US6559074B1Method of forming a silicon nitride layer on a substrateAPPLIED MATERIALS INC·Filed 2001·Granted May 6, 2003·19 cites·14 claims
- 3175US9812353B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Nov 7, 2017·2 cites·20 claims
- 3275US8581334B2Via structures and semiconductor devices having the via structuresLIM DONG-CHAN·Filed 2010·Granted Nov 12, 2013·5 cites·13 claims
- 3374US10535600B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jan 14, 2020·2 cites·19 claims
- 3474US9865594B2Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jan 9, 2018·2 cites·20 claims
- 3572US10847454B2Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Nov 24, 2020·1 cites·20 claims
- 3672US10700164B2Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jun 30, 2020·1 cites·20 claims
- 3772US9787111B2Battery protection module packageITM SEMICONDUCTOR CO LTD·Filed 2013·Granted Oct 10, 2017·4 cites·15 claims
- 3872US9390966B2Methods of forming wiring structures and methods of fabricating semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Jul 12, 2016·2 cites·20 claims
- 3971US10217820B2Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Feb 26, 2019·1 cites·19 claims
- 4071US9799606B2Semiconductor device and method of fabricating the sameAHN SANG HOON·Filed 2015·Granted Oct 24, 2017·2 cites·14 claims
- 4171US9767450B2Antenna module package, antenna module package circuit, battery pack including the same and mobile device including the sameITM SEMICONDUCTOR CO LTD·Filed 2016·Granted Sep 19, 2017·2 cites·10 claims
- 4270US10510658B2Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Dec 17, 2019·1 cites·20 claims
- 4369US11600569B2Integrated circuit device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Mar 7, 2023·0 cites·20 claims
- 4468US9224593B2Method of manufacturing a semiconductor device having a porous, low-k dielectric layerAHN SANG-HOON·Filed 2011·Granted Dec 29, 2015·2 cites·5 claims
- 4568US7105460B2Nitrogen-free dielectric anti-reflective coating and hardmaskAPPLIED MATERIALS INC·Filed 2002·Granted Sep 12, 2006·8 cites·37 claims
- 4668US2024014414A1Fuel cell systemHYUNDAI MOTOR CO LTD·Filed 2022·Application pending·0 cites
- 4766US10529618B2Methods of manufacturing a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jan 7, 2020·1 cites·17 claims
- 4866US9826990B2Reamer for implant surgeryAHN SANG-HOON·Filed 2013·Granted Nov 28, 2017·1 cites·1 claims
- 4966US8872354B2Method of forming through silicon via of semiconductor device using low-K dielectric materialSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Oct 28, 2014·2 cites·17 claims
- 5066US7080528B2Method of forming a phosphorus doped optical core using a PECVD processAPPLIED MATERIALS INC·Filed 2002·Granted Jul 25, 2006·7 cites·22 claims
Showing the top 50 of 105 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →