Inventor · disambiguated record
Cheol Ho Choi
Also filed as: CHOI CHEOL · CHOI CHEOL H · CHOI CHEOL-HO
17 granted patents·27 pending applications·109 citations·filing 2002–2022
91Inventor score
Files withSAMSUNG ELECTRO MECH16SAMSUNG DISPLAY CO LTD7LEE CHANG BO4SAMSUNG KWANGJU ELECTRONICS CO4HONG DAE JO2
Top patents by PatentIndex Score
44 records- 0196US11567614B2Flexible display device including sensing film and metal plate below the sensing filmSAMSUNG DISPLAY CO LTD·Filed 2020·Granted Jan 31, 2023·6 cites·15 claims
- 0295US11441054B2Manufacturing method of adhesive layer and display device comprising the adhesive layer manufactured therebySAMSUNG DISPLAY CO LTD·Filed 2020·Granted Sep 13, 2022·2 cites·10 claims
- 0392US11281346B2Electronic apparatus including display panel and digitizerSAMSUNG DISPLAY CO LTD·Filed 2020·Granted Mar 22, 2022·9 cites·29 claims
- 0492US8728186B2Vacuum cleaner and dust separating apparatus thereofKIM TAK SOO·Filed 2012·Granted May 20, 2014·28 cites·9 claims
- 0579US9040838B2Method for forming solder resist and substrate for packageSAMSUNG ELECTRO MECH·Filed 2013·Granted May 26, 2015·6 cites·6 claims
- 0676US6797781B2Blends of fluoropolymer and plasticized polyvinyl chlorideTEKNOR APEX CO·Filed 2002·Granted Sep 28, 2004·12 cites·22 claims
- 0774US12129410B2Manufacturing method of adhesive layer and display device comprising the adhesive layer manufactured therebySAMSUNG DISPLAY CO LTD·Filed 2022·Granted Oct 29, 2024·0 cites·7 claims
- 0874US6952937B2Ice making machineSAMSUNG KWANGJU ELECTRONICS CO·Filed 2003·Granted Oct 11, 2005·35 cites·10 claims
- 0960US6660570B2Method of fabricating a high voltage semiconductor device using SIPOSFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2002·Granted Dec 9, 2003·9 cites·11 claims
- 1057US8143715B2Semiconductor package transformerCHOI CHEOL HO·Filed 2009·Granted Mar 27, 2012·2 cites·8 claims
- 1156US2007201214A1Core board comprising nickel layer, multilayer board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2007·Application pending·0 cites
- 1255US11515368B2Organic light emitting display device and electronic device including the sameSAMSUNG DISPLAY CO LTD·Filed 2020·Granted Nov 29, 2022·0 cites·16 claims
- 1355US11301106B2Display device including built-in components to sense input through electromagnetic penSAMSUNG DISPLAY CO LTD·Filed 2020·Granted Apr 12, 2022·0 cites·17 claims
- 1453US2009044501A1Dust separating apparatusSAMSUNG KWANGJU ELECTRONICS CO·Filed 2008·Application pending·0 cites
- 1551US2014215753A1Vacuum cleaner and dust separating apparatus thereofSAMSUNG ELECTRONICS CO LTD·Filed 2014·Application pending·0 cites
- 1651US2010054546A1Integrated resource management systemDOALLTECH SOLUTION PROVIDER·Filed 2008·Application pending·0 cites
- 1751US2006257622A1Laminate for printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2006·Application pending·0 cites
- 1850US2006272299A1Cyclone dust collecting apparatusSAMSUNG KWANGJU ELECTRONICS CO·Filed 2005·Application pending·0 cites
- 1949US2015062850A1Printed circuit boardSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 2049US2010291488A1Manufacturing method for multilayer core boardSAMSUNG ELECTRO MECH·Filed 2010·Application pending·0 cites
- 2148US2005020776A1Blends of fluoropolymer and plasticized polyvinyl chlorideTEKNOR APEX CO·Filed 2004·Application pending·0 cites
- 2248US2016139068A1Method for measuring coefficient of thermal expansion and thermal mechanical analyzerSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 2346US2004188517A1Drink dispensing apparatusSAMSUNG KWANGJU ELECTRONICS CO·Filed 2003·Application pending·0 cites
- 2445US2013026626A1Method for forming bumps and substrate including the bumpsSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
- 2545US2017255954A1Method for indirect sns advertising and server for sameSONG SANGWOO·Filed 2017·Application pending·0 cites
- 2645US2006246284A1Fabric reinforcement using modified cyclic olefin copolymer and resin substrate for printed circuit boardSAMSUNG ELECTRO MECH·Filed 2006·Application pending·0 cites
- 2744US2007152368A1Method of modifying cyclic olefin copolymer using reactive extrusionSAMSUNG ELECTRO MECH·Filed 2006·Application pending·0 cites
- 2843US2013089703A1Solder resist composition, board for package comprising solder resist opening using the composition, and method for preparing the board for packageSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
- 2943US2015373856A1Method for forming bumps and substrate including the bumpsSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
- 3042US2021223874A1Touch penSAMSUNG DISPLAY CO LTD·Filed 2020·Application pending·0 cites
- 3141US9060458B2Method for manufacturing multi-layer printed circuit boardOH YOONG·Filed 2011·Granted Jun 16, 2015·0 cites·7 claims
- 3241US2014183726A1Package substrate, method for manufacturing the same, and package on package substrateSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 3340US2014037862A1Method for manufacturing printed circuit boardSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
- 3440US2014041911A1Flat dam and method for manufacturing chip package using the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 3538US7053541B2Rail in flat type cathode ray tubeLG PHILIPS DISPLAYS KOREA·Filed 2002·Granted May 30, 2006·0 cites·12 claims
- 3637US2013175238A1Etching solution and method of manufacturing printed wiring substrate using the sameHONG DAE JO·Filed 2012·Application pending·0 cites
- 3736US8865393B2Printed circuit board and method of manufacturing the sameHONG DAE JO·Filed 2011·Granted Oct 21, 2014·0 cites·10 claims
- 3836US2012266463A1Method for manufacturing printed circuit boardLEE CHANG BO·Filed 2011·Application pending·0 cites
- 3934US2017084528A1Package substrate and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2016·Application pending·0 cites
- 4034US2016198574A1Substrate with electronic device embedded therein and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
- 4133US2012103662A1Printed circuit board and manufacturing method thereofLEE CHANG BO·Filed 2011·Application pending·0 cites
- 4231US8489222B2Machine and method for grinding spacer grid of nuclear fuel assemblyKIM CHANG KUG·Filed 2010·Granted Jul 16, 2013·0 cites·9 claims
- 4330US2012055901A1Substrate fabricating apparatus and substrate fabricating methodLEE CHANG BO·Filed 2011·Application pending·0 cites
- 4429US9107329B2Method for manufacturing printed circuit boardLEE CHANG BO·Filed 2011·Granted Aug 11, 2015·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →