Inventor · disambiguated record
Adam W. Manzonie
Also filed as: MANZONIE ADAM · MANZONIE ADAM W · MANZONIE ADAM WADE
9 granted patents·2 pending applications·432 citations·filing 1996–2023
90Inventor score
Top patents by PatentIndex Score
11 records- 0195US5910043APolishing pad for chemical-mechanical planarization of a semiconductor waferMICRON TECHNOLOGY INC·Filed 1998·Granted Jun 8, 1999·148 cites·24 claims
- 0295US5738567APolishing pad for chemical-mechanical planarization of a semiconductor waferMICRON TECHNOLOGY INC·Filed 1996·Granted Apr 14, 1998·140 cites·27 claims
- 0388US8298046B2Retaining ringsFRANK JR GEORGE J·Filed 2010·Granted Oct 30, 2012·17 cites·9 claims
- 0487US6561891B2Eliminating air pockets under a polished padRODEL INC·Filed 2001·Granted May 13, 2003·38 cites·9 claims
- 0585US8517803B2Retaining ring for chemical mechanical polishingSATHER WILLIAM B·Filed 2009·Granted Aug 27, 2013·17 cites·2 claims
- 0682US5899745AMethod of chemical mechanical polishing (CMP) using an underpad with different compression regions and polishing pad thereforMOTOROLA INC·Filed 1997·Granted May 4, 1999·68 cites·29 claims
- 0780US2024025009A1Polishing pads having selectively arranged porosityAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 0879US2024025010A1Advanced polishing pads and related polishing pad manufacturing methodsAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 0975US8556684B2Retaining ring for chemical mechanical polishingSPM TECHNOLOGY INC·Filed 2013·Granted Oct 15, 2013·4 cites·8 claims
- 1071US11813712B2Polishing pads having selectively arranged porosityAPPLIED MATERIALS INC·Filed 2020·Granted Nov 14, 2023·0 cites·20 claims
- 1167US11806829B2Advanced polishing pads and related polishing pad manufacturing methodsAPPLIED MATERIALS INC·Filed 2020·Granted Nov 7, 2023·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →