Inventor · disambiguated record
Hai Joon Lee
Also filed as: LEE HAI JOON
26 granted patents·10 pending applications·20 citations·filing 2013–2022
92Inventor score
Files withSAMSUNG ELECTRO MECH36
Top patents by PatentIndex Score
36 records- 0191US11094460B2Capacitor componentSAMSUNG ELECTRO MECH·Filed 2019·Granted Aug 17, 2021·5 cites·20 claims
- 0283US10062516B2Thin-film ceramic capacitorSAMSUNG ELECTRO MECH·Filed 2017·Granted Aug 28, 2018·2 cites·12 claims
- 0382US10395842B2Thin film capacitor and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2017·Granted Aug 27, 2019·2 cites·16 claims
- 0476US9390852B2Multilayer ceramic electronic part to be embedded in board and printed circuit board having multilayer ceramic electronic part embedded thereinSAMSUNG ELECTRO MECH·Filed 2014·Granted Jul 12, 2016·3 cites·11 claims
- 0573US10192672B2Coil component and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Jan 29, 2019·1 cites·7 claims
- 0671US9390859B2Multilayer ceramic capacitor and board with the same mounted thereonSAMSUNG ELECTRO MECH·Filed 2014·Granted Jul 12, 2016·2 cites·16 claims
- 0769US9287047B2Multilayer ceramic capacitor and board with the same mounted thereonSAMSUNG ELECTRO MECH·Filed 2014·Granted Mar 15, 2016·1 cites·8 claims
- 0868US9923048B2Monolayer thin film capacitorSAMSUNG ELECTRO MECH·Filed 2016·Granted Mar 20, 2018·1 cites·8 claims
- 0967US9424989B2Embedded multilayer ceramic electronic component and printed circuit board having the sameSAMSUNG ELECTRO MECH·Filed 2014·Granted Aug 23, 2016·1 cites·4 claims
- 1065US9226401B2Multilayer ceramic electronic part to be embedded in board and printed circuit board having multilayer ceramic electronic part embedded thereinSAMSUNG ELECTRO MECH·Filed 2013·Granted Dec 29, 2015·1 cites·18 claims
- 1164US9929231B2Electronic component and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Mar 27, 2018·1 cites·12 claims
- 1262US2015021079A1Multilayer ceramic electronic component to be embedded in board and printed circuit board having multilayer ceramic electronic component embedded thereinSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 1359US2018211776A1Multilayer ceramic electronic component to be embedded in board and printed circuit board having multilayer ceramic electronic component embedded thereinSAMSUNG ELECTRO MECH·Filed 2018·Application pending·0 cites
- 1458US10199171B2Thin film type capacitor element and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2017·Granted Feb 5, 2019·0 cites·17 claims
- 1558US2018033552A1Multilayer ceramic electronic component to be embedded in board and printed circuit board having multilayer ceramic electronic component embedded thereinSAMSUNG ELECTRO MECH·Filed 2017·Application pending·0 cites
- 1657US11682527B2Multilayer capacitorSAMSUNG ELECTRO MECH·Filed 2021·Granted Jun 20, 2023·0 cites·19 claims
- 1756US9984823B2Capacitor element and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2015·Granted May 29, 2018·0 cites·22 claims
- 1855US11955289B2Multilayer capacitorSAMSUNG ELECTRO MECH·Filed 2022·Granted Apr 9, 2024·0 cites·24 claims
- 1955US10355074B2Monolayer thin film capacitor and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2018·Granted Jul 16, 2019·0 cites·8 claims
- 2053US10141115B2Thin film capacitor including alternatively disposed dielectric layers having different thicknessesSAMSUNG ELECTRO MECH·Filed 2017·Granted Nov 27, 2018·0 cites·14 claims
- 2153US9324500B2Multilayer ceramic electronic component to be embedded in board and printed circuit board having multilayer ceramic electronic component embedded thereinSAMSUNG ELECTRO MECH·Filed 2014·Granted Apr 26, 2016·0 cites·29 claims
- 2251US9642260B2Embedded multilayer ceramic electronic component and printed circuit board having the sameSAMSUNG ELECTRO MECH·Filed 2013·Granted May 2, 2017·0 cites·14 claims
- 2351US2015380161A1Multilayer ceramic electronic component to be embedded in board, manufacturing method thereof and printed circuit board having the same embedded thereinSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 2450US10490355B2Thin film capacitor and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2017·Granted Nov 26, 2019·0 cites·14 claims
- 2550US9607762B2Multilayer ceramic electronic part to be embedded in board and printed circuit board having multilayer ceramic electronic part embedded thereinSAMSUNG ELECTRO MECH·Filed 2014·Granted Mar 28, 2017·0 cites·16 claims
- 2649US10446324B2Thin film capacitorSAMSUNG ELECTRO MECH·Filed 2017·Granted Oct 15, 2019·0 cites·15 claims
- 2749US2015041197A1Embedded multilayer ceramic electronic component and printed circuit board having the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 2849US2015075853A1Multilayer ceramic electronic component embedded in board and printed circuit board having the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 2948US9198297B2Multilayer ceramic electronic part to be embedded in board and printed circuit board having multilayer ceramic electronic part embedded thereinSAMSUNG ELECTRO MECH·Filed 2013·Granted Nov 24, 2015·0 cites·14 claims
- 3047US9173294B2Multilayer ceramic electronic component to be embedded in board and printed circuit board having multilayer ceramic electronic component embedded thereinSAMSUNG ELECTRO MECH·Filed 2014·Granted Oct 27, 2015·0 cites·16 claims
- 3147US2015098202A1Embedded multilayer ceramic electronic component and printed circuit board having the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 3247US2014151101A1Embedded multilayer ceramic electronic component and method of manufacturing the same, and printed circuit board having embedded multilayer ceramic electronic component thereinSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 3341US10319526B2Thin-film capacitorSAMSUNG ELECTRO MECH·Filed 2017·Granted Jun 11, 2019·0 cites·8 claims
- 3440US10553363B2Multilayer ceramic capacitor having via electrode and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Feb 4, 2020·0 cites·8 claims
- 3539US2017338042A1Thin-film capacitor and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Application pending·0 cites
- 3636US2015371779A1Multi-layered capacitor and manufacturing method for the sameSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →