Embedded multilayer ceramic electronic component and printed circuit board having the same

Abstract

A multilayer ceramic electronic component embedded in a board may include: a ceramic body including dielectric layers; a plurality of first and second internal electrodes alternately exposed through both end surfaces of the ceramic body; and first and second external electrodes formed on both end portions of the ceramic body, respectively. The first external electrode may include a first base electrode and a first terminal electrode, the second external electrode may include a second base electrode and a second terminal electrode, 400 nm≦Ra≦600 nm may be satisfied when a surface roughness in a region of 50 μm×50 μm in the first and second terminal electrodes is defined as Ra, and 130 nm≦Ra′≦400 nm may be satisfied when a surface roughness in a region of 10 μm×10 μm in the first and second terminal electrodes is defined as Ra′.

What is claimed is: 
     
         1 . A multilayer ceramic electronic component embedded in a board, comprising:
 a ceramic body including dielectric layers, first and second main surfaces opposing each other, first and second side surfaces opposing each other, and first and second end surfaces opposing each other;   a plurality of first and second internal electrodes alternately exposed through end surfaces of the ceramic body, the dielectric layers being disposed between the plurality of first and second internal electrodes; and   first and second external electrodes disposed on end portions of the ceramic body, respectively,   wherein the first external electrode includes a first base electrode and a first terminal electrode disposed on the first base electrode, the second external electrode includes a second base electrode and a second terminal electrode disposed on the second base electrode, 400 nm≦Ra≦600 nm is satisfied when a surface roughness in a region of 50 μm×50 μm in the first and second terminal electrodes is defined as Ra, and 130 nm≦Ra′≦400 nm is satisfied when a surface roughness in a region of 10 μm×10 μm in the first and second terminal electrodes is defined as Ra′.   
     
     
         2 . The multilayer ceramic electronic component embedded in a board of  claim 1 , further comprising a silane coating layer formed on the ceramic body and the first and second terminal electrodes. 
     
     
         3 . The multilayer ceramic electronic component embedded in a board of  claim 1 , wherein when a thickness of the ceramic body is defined as ts, ts≦250 μm is satisfied. 
     
     
         4 . The multilayer ceramic electronic component embedded in a board of  claim 1 , wherein when a thickness of each of the first and second terminal electrodes is defined as tp tp≧5 μm is satisfied. 
     
     
         5 . The multilayer ceramic electronic component embedded in a board of  claim 1 , wherein the first and second terminal electrodes are formed of copper (Cu). 
     
     
         6 . The multilayer ceramic electronic component embedded in a board of  claim 1 , wherein the first and second terminal electrodes are formed by plating. 
     
     
         7 . A printed circuit board having a multilayer ceramic electronic component embedded therein, comprising:
 an insulating substrate; and   the multilayer ceramic electronic component embedded in a board including a ceramic body including dielectric layers and having first and second main surfaces opposing each other, first and second side surfaces opposing each other, and first and second end surfaces opposing each other, a plurality of first and second internal electrodes alternately exposed through both end surfaces of the ceramic body, having the dielectric layer therebetween, and first and second external electrodes formed on both end portions of the ceramic body, respectively,   wherein the first external electrode includes a first base electrode and a first terminal electrode formed on the first base electrode, the second external electrode includes a second base electrode and a second terminal electrode formed on the second base electrode, 400 nm≦Ra≦600 nm is satisfied when a surface roughness in a region of 50 μm×50 μm in the first and second terminal electrodes is defined as Ra, and 130 nm≦Ra′≦400 nm is satisfied when a surface roughness in a region of 10 μm×10 μm in the first and second terminal electrodes is defined as Ra′.   
     
     
         8 . The printed circuit board having a multilayer ceramic electronic component embedded therein of  claim 7 , wherein the multilayer ceramic electronic component embedded in a board further includes a silane coating layer formed on the ceramic body and the first and second terminal electrodes. 
     
     
         9 . The printed circuit board having a multilayer ceramic electronic component embedded therein of  claim 7 , wherein when a thickness of the ceramic body is defined as ts, ts≦250 μm is satisfied. 
     
     
         10 . The printed circuit board having a multilayer ceramic electronic component embedded therein of  claim 7 , wherein when a thickness of each of the first and second terminal electrodes is defined as tp, tp≧5 μm is satisfied. 
     
     
         11 . The printed circuit board having a multilayer ceramic electronic component embedded therein of  claim 7 , wherein the first and second terminal electrodes are made of copper (Cu). 
     
     
         12 . The printed circuit board having a multilayer ceramic electronic component embedded therein of  claim 7 , wherein the first and second terminal electrodes are formed by plating.