Inventor · disambiguated record
Timothy D. Sullivan
Also filed as: SULLIVAN TIMOTHY D · SULLIVAN TIMOTHY DOOLING
153 granted patents·5 pending applications·1,878 citations·filing 1978–2018
99Inventor score
Top patents by PatentIndex Score
158 records- 0199US7397260B2Structure and method for monitoring stress-induced degradation of conductive interconnectsIBM·Filed 2005·Granted Jul 8, 2008·169 cites·12 claims
- 0299US5326430ACooling microfan arrangements and processIBM·Filed 1993·Granted Jul 5, 1994·174 cites·7 claims
- 0396US9472490B1IC structure with recessed solder bump area and methods of forming sameGLOBALFOUNDRIES INC·Filed 2015·Granted Oct 18, 2016·18 cites·17 claims
- 0496US8508043B2Metal pad structure for thickness enhancement of polymer used in electrical interconnection of semiconductor die to semiconductor chip package substrate with solder bumpDAUBENSPECK TIMOTHY H·Filed 2011·Granted Aug 13, 2013·24 cites·19 claims
- 0594US6141245AImpedance control using fusesIBM·Filed 1999·Granted Oct 31, 2000·142 cites·31 claims
- 0693US8803317B2Structures for improving current carrying capability of interconnects and methods of fabricating the sameARVIN CHARLES L·Filed 2012·Granted Aug 12, 2014·5 cites·15 claims
- 0792US5296775ACooling microfan arrangements and processIBM·Filed 1992·Granted Mar 22, 1994·66 cites·13 claims
- 0892US5233263ALateral field emission devicesIBM·Filed 1991·Granted Aug 3, 1993·69 cites·9 claims
- 0991US7868453B2Solder interconnect pads with current spreading layersIBM·Filed 2008·Granted Jan 11, 2011·15 cites·18 claims
- 1090US5308439ALaternal field emmission devices and methods of fabricationIBM·Filed 1993·Granted May 3, 1994·56 cites·7 claims
- 1189US9059106B2Compensating for warpage of a flip chip package by varying heights of a redistribution layer on an integrated circuit chipIBM·Filed 2012·Granted Jun 16, 2015·9 cites·18 claims
- 1289US8637392B2Solder interconnect with non-wettable sidewall pillars and methods of manufactureARVIN CHARLES L·Filed 2010·Granted Jan 28, 2014·9 cites·23 claims
- 1389US8350383B2IC chip package having IC chip with overhang and/or BGA blocking underfill material flow and related methodsIBM·Filed 2009·Granted Jan 8, 2013·16 cites·19 claims
- 1489US7985671B2Structures and methods for improving solder bump connections in semiconductor devicesIBM·Filed 2008·Granted Jul 26, 2011·18 cites·22 claims
- 1589US6417572B1Process for producing metal interconnections and product produced therebyIBM·Filed 1999·Granted Jul 9, 2002·105 cites·21 claims
- 1688US9776270B2Chip joining by induction heatingGLOBALFOUNDRIES INC·Filed 2013·Granted Oct 3, 2017·7 cites·7 claims
- 1788US8198133B2Structures and methods to improve lead-free C4 interconnect reliabilityDAUBENSPECK TIMOTHY H·Filed 2009·Granted Jun 12, 2012·16 cites·12 claims
- 1888US6773952B2Semiconductor chip structures with embedded thermal conductors and a thermal sink disposed over opposing substrate surfacesIBM·Filed 2002·Granted Aug 10, 2004·45 cites·12 claims
- 1987US6603321B2Method and apparatus for accelerated determination of electromigration characteristics of semiconductor wiringIBM·Filed 2001·Granted Aug 5, 2003·49 cites·26 claims
- 2087US6333557B1Semiconductor chip structures with embedded thermal conductorsIBM·Filed 2000·Granted Dec 25, 2001·46 cites·24 claims
- 2187US6243283B1Impedance control using fusesIBM·Filed 2000·Granted Jun 5, 2001·42 cites·4 claims
- 2286US9891261B2Electromigration monitorIBM·Filed 2014·Granted Feb 13, 2018·6 cites·10 claims
- 2386US7096450B2Enhancement of performance of a conductive wire in a multilayered substrateIBM·Filed 2003·Granted Aug 22, 2006·41 cites·18 claims
- 2485US10245667B2Chip joining by induction heatingGLOBALFOUNDRIES INC·Filed 2017·Granted Apr 2, 2019·3 cites·8 claims
- 2585US7875854B2Design structure for alpha particle sensor in SOI technology and structure thereofIBM·Filed 2008·Granted Jan 25, 2011·8 cites·16 claims
- 2684US8138099B1Chip package solder interconnect formed by surface tensionDAUBENSPECK TIMOTHY H·Filed 2010·Granted Mar 20, 2012·7 cites·20 claims
- 2784US6512292B1Semiconductor chip structures with embedded thermal conductors and a thermal sink disposed over opposing substrate surfacesIBM·Filed 2000·Granted Jan 28, 2003·34 cites·13 claims
- 2883US8927334B2Overcoming chip warping to enhance wetting of solder bumps and flip chip attaches in a flip chip packageIBM·Filed 2012·Granted Jan 6, 2015·7 cites·8 claims
- 2983US8159067B2Underfill flow guide structuresDAUBENSPECK TIMOTHY H·Filed 2008·Granted Apr 17, 2012·8 cites·11 claims
- 3083US6633055B2Electronic fuse structure and method of manufacturingIBM·Filed 1999·Granted Oct 14, 2003·69 cites·8 claims
- 3182US10224225B2Centering substrates on a chuckIBM·Filed 2018·Granted Mar 5, 2019·2 cites·20 claims
- 3282US8933540B2Thermal via for 3D integrated circuits structuresIBM·Filed 2013·Granted Jan 13, 2015·6 cites·9 claims
- 3382US8212357B2Combination via and pad structure for improved solder bump electromigration characteristicsDAUBENSPECK TIMOTHY H·Filed 2008·Granted Jul 3, 2012·10 cites·22 claims
- 3482US7224063B2Dual-damascene metallization interconnectionIBM·Filed 2001·Granted May 29, 2007·30 cites·6 claims
- 3582US6639242B1Monolithically integrated solid-state SiGe thermoelectric energy converter for high speed and low power circuitsIBM·Filed 2002·Granted Oct 28, 2003·29 cites·24 claims
- 3682US6219215B1Chip thermal protection deviceIBM·Filed 1999·Granted Apr 17, 2001·65 cites·10 claims
- 3781US9536829B2Programmable electrical fuse in keep out zoneIBM·Filed 2014·Granted Jan 3, 2017·5 cites·20 claims
- 3881US9190375B2Solder bump reflow by induction heatingIBM·Filed 2014·Granted Nov 17, 2015·6 cites·20 claims
- 3981US6992390B2Liner with improved electromigration redundancy for damascene interconnectsIBM·Filed 2003·Granted Jan 31, 2006·30 cites·15 claims
- 4080US9997385B2Centering substrates on a chuckIBM·Filed 2017·Granted Jun 12, 2018·2 cites·19 claims
- 4179US9685362B2Apparatus and method for centering substrates on a chuckIBM·Filed 2014·Granted Jun 20, 2017·3 cites·24 claims
- 4279US9035459B2Structures for improving current carrying capability of interconnects and methods of fabricating the sameARVIN CHARLES L·Filed 2009·Granted May 19, 2015·1 cites·10 claims
- 4378US8580673B2Underfill flow guide structures and method of using sameULTRATECH INC·Filed 2013·Granted Nov 12, 2013·3 cites·5 claims
- 4478US8084858B2Metal wiring structures for uniform current density in C4 ballsDAUBENSPECK TIMOTHY H·Filed 2009·Granted Dec 27, 2011·6 cites·10 claims
- 4578US7667328B2Integration circuits for reducing electromigration effectIBM·Filed 2007·Granted Feb 23, 2010·8 cites·20 claims
- 4678US7470613B2Dual damascene multi-level metallizationIBM·Filed 2007·Granted Dec 30, 2008·7 cites·19 claims
- 4777US6876282B2Micro-electro-mechanical RF switchIBM·Filed 2002·Granted Apr 5, 2005·18 cites·9 claims
- 4877US6729979B1Basketball shooting trainer deviceGUGEL DONALD E·Filed 2002·Granted May 4, 2004·31 cites·2 claims
- 4976US9508578B2Method and apparatus for detecting foreign material on a chuckGLOBALFOUNDRIES INC·Filed 2014·Granted Nov 29, 2016·3 cites·18 claims
- 5076US8426247B2Polymer and solder pillars for connecting chip and carrierDAUBENSPECK TIMOTHY H·Filed 2012·Granted Apr 23, 2013·3 cites·19 claims
Showing the top 50 of 158 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Timothy D. Sullivan files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →