Inventor · disambiguated record
Michael Rogalli
Also filed as: ROGALLI MICHAEL
16 granted patents·5 pending applications·72 citations·filing 1989–2024
91Inventor score
Top patents by PatentIndex Score
21 records- 0185US10103123B2Semiconductor devices and processing methodsINFINEON TECHNOLOGIES AG·Filed 2017·Granted Oct 16, 2018·4 cites·15 claims
- 0284US6790737B2Method for fabricating thin metal layers from the liquid phaseINFINEON TECHNOLOGIES AG·Filed 2003·Granted Sep 14, 2004·32 cites·12 claims
- 0382US9165821B2Method for providing a self-aligned pad protection in a semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2013·Granted Oct 20, 2015·4 cites·25 claims
- 0480US12040288B2Chip package and method of forming a chip packageINFINEON TECHNOLOGIES AG·Filed 2023·Granted Jul 16, 2024·0 cites·20 claims
- 0577US2024371796A1Chip package and method of forming a chip packageINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 0671US11735534B2Chip package and method of forming a chip packageINFINEON TECHNOLOGIES AG·Filed 2021·Granted Aug 22, 2023·0 cites·20 claims
- 0768US6958256B2Process for the back-surface grinding of wafersINFINEON TECHNOLOGIES AG·Filed 2003·Granted Oct 25, 2005·12 cites·17 claims
- 0852US10446469B2Semiconductor device having a copper element and method of forming a semiconductor device having a copper elementINFINEON TECHNOLOGIES AG·Filed 2016·Granted Oct 15, 2019·0 cites·15 claims
- 0952US9385031B2Method for providing a self-aligned pad protection in a semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2015·Granted Jul 5, 2016·0 cites·12 claims
- 1049US11424201B2Method of forming an aluminum oxide layer, metal surface with aluminum oxide layer, and electronic deviceINFINEON TECHNOLOGIES AG·Filed 2018·Granted Aug 23, 2022·0 cites·13 claims
- 1149US2014110838A1Semiconductor devices and processing methodsINFINEON TECHNOLOGIES AG·Filed 2012·Application pending·0 cites
- 1244US6380076B2Dielectric filling of electrical wiring planesINFINEON TECHNOLOGIES AG·Filed 2000·Granted Apr 30, 2002·1 cites·15 claims
- 1342US9418937B2Integrated circuit and method of forming an integrated circuitDETZEL THOMAS·Filed 2011·Granted Aug 16, 2016·0 cites·17 claims
- 1442US5468786ARadiation-curable reaction resin systemSIEMENS AG·Filed 1994·Granted Nov 21, 1995·5 cites·6 claims
- 1539US2008006098A1Sensor device and a method for its manufacturingINFINEON TECHNOLOGIES·Filed 2006·Application pending·0 cites
- 1636US2020043876A1Adhesion Enhancing Structures for a PackageINFINEON TECHNOLOGIES AG·Filed 2019·Application pending·0 cites
- 1735US7169716B2Photosensitive lacquer for providing a coating on a semiconductor substrate or a maskINFINEON TECHNOLOGIES AG·Filed 2004·Granted Jan 30, 2007·0 cites·20 claims
- 1835US5917705AChip cardSIEMENS AG·Filed 1996·Granted Jun 29, 1999·7 cites·6 claims
- 1932US5780103AMethod for forming of a silicon oxide layer on a topographySIEMENS AG·Filed 1996·Granted Jul 14, 1998·4 cites·22 claims
- 2031US5227219ASurface wave components with an acoustically matched damping compoundSIEMENS AG·Filed 1989·Granted Jul 13, 1993·3 cites·6 claims
- 2128US2005090114A1Method for the production of a semiconductor deviceFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →