Inventor · disambiguated record
Viresh Piyush Patel
Also filed as: PATEL VIRESH · PATEL VIRESH P · PATEL VIRESH PIYUSH
11 granted patents·3 pending applications·228 citations·filing 2002–2021
90Inventor score
Files withINTEGRATED DEVICE TECH8MAXIM INTEGRATED PRODUCTS3ASAT LTD2RENESAS ELECTRONICS AMERICA INC1
Top patents by PatentIndex Score
14 records- 0193US9306537B1Integrated circuit device substrates having packaged crystal resonators thereonINTEGRATED DEVICE TECH·Filed 2014·Granted Apr 5, 2016·13 cites·21 claims
- 0292US7071545B1Shielded integrated circuit packageASAT LTD·Filed 2002·Granted Jul 4, 2006·106 cites·7 claims
- 0390US7381588B1Shielded integrated circuit packageASAT LTD·Filed 2004·Granted Jun 3, 2008·74 cites·8 claims
- 0489US9478599B1Integrated circuit device substrates having packaged inductors thereonINTEGRATED DEVICE TECH·Filed 2014·Granted Oct 25, 2016·11 cites·18 claims
- 0586US9250262B1Method and apparatus for an integrated isolation mechanical filter with substrate based packageMAXIM INTEGRATED PRODUCTS·Filed 2013·Granted Feb 2, 2016·7 cites·10 claims
- 0684US9409765B1Method and apparatus for an isolating structureMAXIM INTEGRATED PRODUCTS·Filed 2013·Granted Aug 9, 2016·8 cites·17 claims
- 0784US9397151B1Packaged integrated circuits having high-Q inductors therein and methods of forming sameINTEGRATED DEVICE TECH·Filed 2013·Granted Jul 19, 2016·7 cites·15 claims
- 0860US10304758B1Wafer level package device formed using a wafer level lead frame on a carrier wafer having a similar coefficient of thermal expansion as an active waferMAXIM INTEGRATED PRODUCTS·Filed 2013·Granted May 28, 2019·1 cites·5 claims
- 0959US9445536B1Crystal oscillator fabrication methods using dual-deposition of mounting cement and dual-curing techniquesINTEGRATED DEVICE TECH·Filed 2014·Granted Sep 13, 2016·1 cites·14 claims
- 1053US11353363B2Monolithic spectrometerINTEGRATED DEVICE TECH·Filed 2019·Granted Jun 7, 2022·0 cites·6 claims
- 1142US11894352B2Power electronic module with enhanced thermal and electrical performanceRENESAS ELECTRONICS AMERICA INC·Filed 2021·Granted Feb 6, 2024·0 cites·20 claims
- 1237US2018196022A1Gas sensorINTEGRATED DEVICE TECH·Filed 2017·Application pending·0 cites
- 1330US2017166442A1System and method for providing hermetically sealed packages with consistent vacuum cavityINTEGRATED DEVICE TECH·Filed 2015·Application pending·0 cites
- 1430US2017170159A1System and method for improving dicing quality for bonded wafer pairsINTEGRATED DEVICE TECH·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →