Inventor · disambiguated record
Andy Fan
Also filed as: FAN ANDY
4 granted patents·6 pending applications·126 citations·filing 2003–2018
78Inventor score
Files withJDV CONTROL VALVES CO LTD3MASSACHUSETTS INST TECHNOLOGY2REIF RAFAEL2BUZBY PHILIP R1UNIV BOSTON1
Top patents by PatentIndex Score
10 records- 0194US7307003B2Method of forming a multi-layer semiconductor structure incorporating a processing handle memberMASSACHUSETTS INST TECHNOLOGY·Filed 2003·Granted Dec 11, 2007·101 cites·45 claims
- 0285US10768185B2Tenofovir detection assayUNIV BOSTON·Filed 2018·Granted Sep 8, 2020·5 cites·18 claims
- 0383US9863552B2Fluid valve and a single shaft-sealing module thereofJDV CONTROL VALVES CO LTD·Filed 2016·Granted Jan 9, 2018·5 cites·20 claims
- 0468US7064055B2Method of forming a multi-layer semiconductor structure having a seamless bonding interfaceMASSACHUSETTS INST TECHNOLOGY·Filed 2003·Granted Jun 20, 2006·15 cites·30 claims
- 0548US2008064183A1Method of forming a multi-layer semiconductor structure incorporating a processing handle memberREIF RAFAEL·Filed 2007·Application pending·0 cites
- 0646US2012316075A1Sequence preserved dna conversion for optical nanopore sequencingBUZBY PHILIP R·Filed 2012·Application pending·0 cites
- 0744US2015369389A1Fluid valve and shaft sealing structure thereofJDV CONTROL VALVES CO LTD·Filed 2014·Application pending·0 cites
- 0844US2015369388A1Fluid valve and modular shaft sealing structure thereofJDV CONTROL VALVES CO LTD·Filed 2014·Application pending·0 cites
- 0942US2006099796A1Method of forming a multi-layer semiconductor structure having a seam-less bonding interfaceREIF RAFAEL·Filed 2005·Application pending·0 cites
- 1029US2004124538A1Multi-layer integrated semiconductor structureFiled 2003·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Andy Fan files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →