Inventor · disambiguated record
Arnold Kholodenko
Also filed as: CHENG LEGAL REPRESENTATIVE HELEN · KHOLODENKO ARNOLD · KHOLODENKO ARNOLD V
59 granted patents·10 pending applications·4,099 citations·filing 1992–2015
99Inventor score
Top patents by PatentIndex Score
69 records- 0198US6095084AHigh density plasma process chamberAPPLIED MATERIALS INC·Filed 1997·Granted Aug 1, 2000·250 cites·86 claims
- 0297US6828241B2Efficient cleaning by secondary in-situ activation of etch precursor from remote plasma sourceAPPLIED MATERIALS INC·Filed 2002·Granted Dec 7, 2004·144 cites·56 claims
- 0397US6310755B1Electrostatic chuck having gas cavity and methodAPPLIED MATERIALS INC·Filed 1999·Granted Oct 30, 2001·325 cites·38 claims
- 0497US6108189AElectrostatic chuck having improved gas conduitsAPPLIED MATERIALS INC·Filed 1997·Granted Aug 22, 2000·255 cites·64 claims
- 0597US6015465ATemperature control system for semiconductor process chamberAPPLIED MATERIALS INC·Filed 1998·Granted Jan 18, 2000·743 cites·13 claims
- 0696US6721162B2Electrostatic chuck having composite dielectric layer and method of manufactureAPPLIED MATERIALS INC·Filed 2002·Granted Apr 13, 2004·76 cites·20 claims
- 0796US6538872B1Electrostatic chuck having heater and methodAPPLIED MATERIALS INC·Filed 2001·Granted Mar 25, 2003·123 cites·18 claims
- 0896US6478924B1Plasma chamber support having dual electrodesAPPLIED MATERIALS INC·Filed 2000·Granted Nov 12, 2002·124 cites·42 claims
- 0996US6189484B1Plasma reactor having a helicon wave high density plasma sourceAPPLIED MATERIALS INC·Filed 1999·Granted Feb 20, 2001·116 cites·44 claims
- 1095US7743730B2Apparatus for an optimized plasma chamber grounded electrode assemblyLAM RES CORP·Filed 2005·Granted Jun 29, 2010·32 cites·23 claims
- 1194US6490146B2Electrostatic chuck bonded to base with a bond layer and methodAPPLIED MATERIALS INC·Filed 2001·Granted Dec 3, 2002·88 cites·28 claims
- 1294US6464795B1Substrate support member for a processing chamberAPPLIED MATERIALS INC·Filed 2000·Granted Oct 15, 2002·98 cites·28 claims
- 1394US6464790B1Substrate support memberAPPLIED MATERIALS INC·Filed 2000·Granted Oct 15, 2002·126 cites·23 claims
- 1494US6414834B1Dielectric covered electrostatic chuckAPPLIED MATERIALS INC·Filed 2000·Granted Jul 2, 2002·56 cites·34 claims
- 1594US6185839B1Semiconductor process chamber having improved gas distributorAPPLIED MATERIALS INC·Filed 1998·Granted Feb 13, 2001·83 cites·44 claims
- 1693US6503368B1Substrate support having bonded sections and methodAPPLIED MATERIALS INC·Filed 2000·Granted Jan 7, 2003·76 cites·22 claims
- 1793US6490145B1Substrate support pedestalAPPLIED MATERIALS INC·Filed 2001·Granted Dec 3, 2002·86 cites·40 claims
- 1892US6676760B2Process chamber having multiple gas distributors and methodAPPILED MATERIALS INC·Filed 2001·Granted Jan 13, 2004·55 cites·22 claims
- 1992US6471822B1Magnetically enhanced inductively coupled plasma reactor with magnetically confined plasmaAPPLIED MATERIALS INC·Filed 1999·Granted Oct 29, 2002·88 cites·50 claims
- 2091US6908540B2Method and apparatus for encapsulation of an edge of a substrate during an electro-chemical deposition processAPPLIED MATERIALS INC·Filed 2001·Granted Jun 21, 2005·47 cites·32 claims
- 2191US6583980B1Substrate support tolerant to thermal expansion stressesAPPLIED MATERIALS INC·Filed 2000·Granted Jun 24, 2003·60 cites·44 claims
- 2291US6320736B1Chuck having pressurized zones of heat transfer gasAPPLIED MATERIALS INC·Filed 1999·Granted Nov 20, 2001·122 cites·37 claims
- 2390US9905402B2Plasma processing chamber with a grounded electrode assemblyLAM RES CORP·Filed 2015·Granted Feb 27, 2018·5 cites·18 claims
- 2490US5900064APlasma process chamberAPPLIED MATERIALS INC·Filed 1997·Granted May 4, 1999·106 cites·33 claims
- 2588US8261905B2Wafer carrier drive apparatus and method for operating the sameKHOLODENKO ARNOLD·Filed 2010·Granted Sep 11, 2012·11 cites·12 claims
- 2688US6449871B1Semiconductor process chamber having improved gas distributorAPPLIED MATERIALS INC·Filed 2000·Granted Sep 17, 2002·26 cites·37 claims
- 2788US6094334APolymer chuck with heater and method of manufactureAPPLIED MATERIALS INC·Filed 1999·Granted Jul 25, 2000·97 cites·58 claims
- 2888US6033478AWafer support with improved temperature controlAPPLIED MATERIALS INC·Filed 1996·Granted Mar 7, 2000·94 cites·24 claims
- 2986US8317934B2Multi-stage substrate cleaning method and apparatusKHOLODENKO ARNOLD·Filed 2009·Granted Nov 27, 2012·10 cites·14 claims
- 3085US6795292B2Apparatus for regulating temperature of a process kit in a semiconductor wafer-processing chamberFiled 2001·Granted Sep 21, 2004·41 cites·26 claims
- 3185US6151203AConnectors for an electrostatic chuck and combination thereofAPPLIED MATERIALS INC·Filed 1998·Granted Nov 21, 2000·76 cites·20 claims
- 3284US9111968B2Plasma processing chamber with a grounded electrode assemblyKHOLODENKO ARNOLD·Filed 2010·Granted Aug 18, 2015·11 cites·13 claims
- 3384US8757177B2Multi-stage substrate cleaning method and apparatusKHOLODENKO ARNOLD·Filed 2012·Granted Jun 24, 2014·6 cites·17 claims
- 3483US6462928B1Electrostatic chuck having improved electrical connector and methodAPPLIED MATERIALS INC·Filed 1999·Granted Oct 8, 2002·65 cites·13 claims
- 3581US5942039ASelf-cleaning focus ringAPPLIED MATERIALS INC·Filed 1997·Granted Aug 24, 1999·66 cites·17 claims
- 3679US7699634B2High power electrical connector for a laminated heaterLAM RES CORP·Filed 2007·Granted Apr 20, 2010·9 cites·14 claims
- 3777US7572334B2Apparatus for fabricating large-surface area polycrystalline silicon sheets for solar cell applicationAPPLIED MATERIALS INC·Filed 2006·Granted Aug 11, 2009·5 cites·3 claims
- 3877US5801915AElectrostatic chuck having a unidirectionally conducting coupler layerAPPLIED MATERIALS INC·Filed 1997·Granted Sep 1, 1998·49 cites·14 claims
- 3976US6572814B2Method of fabricating a semiconductor wafer support chuck apparatus having small diameter gas distribution ports for distributing a heat transfer gasAPPLIED MATERIALS INC·Filed 2001·Granted Jun 3, 2003·21 cites·15 claims
- 4076US6278600B1Electrostatic chuck with improved temperature control and puncture resistanceAPPLIED MATERIALS INC·Filed 1999·Granted Aug 21, 2001·46 cites·13 claims
- 4175US6267839B1Electrostatic chuck with improved RF power distributionAPPLIED MATERIALS INC·Filed 1999·Granted Jul 31, 2001·44 cites·17 claims
- 4269US8146902B2Hybrid composite wafer carrier for wet clean equipmentCHENG WING LAU·Filed 2007·Granted Apr 3, 2012·3 cites·16 claims
- 4367US6736668B1High temperature electrical connectorFiled 2000·Granted May 18, 2004·16 cites·22 claims
- 4465US8900400B2Proximity head having a fluid resistorLAM RES CORP·Filed 2012·Granted Dec 2, 2014·1 cites·12 claims
- 4565US8584613B2Single substrate processing head for particle removal using low viscosity fluidKHOLODENKO ARNOLD·Filed 2008·Granted Nov 19, 2013·2 cites·6 claims
- 4665US6689418B2Apparatus for wafer rinse and clean and edge etchingAPPLIED MATERIALS INC·Filed 2001·Granted Feb 10, 2004·9 cites·23 claims
- 4765US5885469ATopographical structure of an electrostatic chuck and method of fabricating sameAPPLIED MATERIALS INC·Filed 1996·Granted Mar 23, 1999·29 cites·22 claims
- 4864US5856906ABackside gas quick dump apparatus for a semiconductor wafer processing systemAPPLIED MATERIALS INC·Filed 1997·Granted Jan 5, 1999·31 cites·11 claims
- 4963US8161984B2Generator for foam to clean substrateKHOLODENKO ARNOLD·Filed 2008·Granted Apr 24, 2012·1 cites·15 claims
- 5062US8141566B2System, method and apparatus for maintaining separation of liquids in a controlled meniscusO'DONNELL ROBERT·Filed 2007·Granted Mar 27, 2012·1 cites·17 claims
Showing the top 50 of 69 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →