Inventor · disambiguated record
Sreenivasan K. Koduri
Also filed as: KODURI SREENIVASAN · KODURI SREENIVASAN K · KODURI SREENIVASAN KALYANI
130 granted patents·46 pending applications·427 citations·filing 1995–2025
99Inventor score
Files withTEXAS INSTRUMENTS INC151KODURI SREENIVASAN K9KODURI SREENIVASAN2KUMMERL STEVEN A2ZUNIGA-ORTIZ EDGAR R2
Top patents by PatentIndex Score
176 records- 0198US11195811B2Dielectric and metallic nanowire bond layersTEXAS INSTRUMENTS INC·Filed 2020·Granted Dec 7, 2021·7 cites·16 claims
- 0297US11552006B2Coated semiconductor devicesTEXAS INSTRUMENTS INC·Filed 2020·Granted Jan 10, 2023·6 cites·20 claims
- 0395US7531893B2Power semiconductor devices having integrated inductorTEXAS INSTRUMENTS INC·Filed 2006·Granted May 12, 2009·28 cites·18 claims
- 0493US8569082B2Semiconductor package with a mold material encapsulating a chip and a portion of a lead frameKUMMERL STEVEN A·Filed 2011·Granted Oct 29, 2013·18 cites·9 claims
- 0592US11636242B2Process aware compact representation of integrated circuitsTEXAS INSTRUMENTS INC·Filed 2021·Granted Apr 25, 2023·2 cites·20 claims
- 0691US11676951B2Package for power semiconductor devicesTEXAS INSTRUMENTS INC·Filed 2021·Granted Jun 13, 2023·2 cites·20 claims
- 0791US10658278B2Electrical device terminal finishingTEXAS INSTRUMENTS INC·Filed 2018·Granted May 19, 2020·5 cites·20 claims
- 0891US8358014B2Structure and method for power field effect transistorTEXAS INSTRUMENTS INC·Filed 2010·Granted Jan 22, 2013·10 cites·12 claims
- 0990US11978699B2Electronic device multilevel package substrate for improved electromigration preformanceTEXAS INSTRUMENTS INC·Filed 2021·Granted May 7, 2024·2 cites·20 claims
- 1089US10991641B2Cantilevered leadframe support structure for magnetic wireless transfer between integrated circuit diesTEXAS INSTRUMENTS INC·Filed 2020·Granted Apr 27, 2021·2 cites·13 claims
- 1189US8017410B2Power semiconductor devices having integrated inductorTEXAS INSTRUMENTS INC·Filed 2010·Granted Sep 13, 2011·8 cites·18 claims
- 1288US11887906B2Packaged device with die wrapped by a substrateTEXAS INSTRUMENTS INC·Filed 2021·Granted Jan 30, 2024·1 cites·23 claims
- 1388US11387155B2IC having a metal ring thereon for stress reductionTEXAS INSTRUMENTS INC·Filed 2020·Granted Jul 12, 2022·2 cites·24 claims
- 1488US7723129B2Power semiconductor devices having integrated inductorTEXAS INSTRUMENTS INC·Filed 2009·Granted May 25, 2010·12 cites·12 claims
- 1587US11282807B2Nanowires plated on nanoparticlesTEXAS INSTRUMENTS INC·Filed 2020·Granted Mar 22, 2022·2 cites·30 claims
- 1687US6768210B2Bumpless wafer scale device and board assemblyTEXAS INSTRUMENTS INC·Filed 2001·Granted Jul 27, 2004·51 cites·25 claims
- 1786US11573324B2Lidar imaging receiverTEXAS INSTRUMENTS INC·Filed 2018·Granted Feb 7, 2023·2 cites·23 claims
- 1885US11727175B2Automated analog and mixed-signal circuit design and validationTEXAS INSTRUMENTS INC·Filed 2021·Granted Aug 15, 2023·1 cites·20 claims
- 1983US8133763B2Method for semiconductor leadframes in low volume and rapid turnaroundKODURI SREENIVASAN K·Filed 2009·Granted Mar 13, 2012·8 cites·17 claims
- 2083US7847391B2Manufacturing method for integrating a shunt resistor into a semiconductor packageTEXAS INSTRUMENTS INC·Filed 2008·Granted Dec 7, 2010·11 cites·13 claims
- 2182US12489067B2Industrial chip scale package for microelectronic deviceTEXAS INSTRUMENTS INC·Filed 2023·Granted Dec 2, 2025·0 cites·18 claims
- 2282US8810023B2Cantilever packages for sensor MEMS (micro-electro-mechanical system)KODURI SREENIVASAN·Filed 2012·Granted Aug 19, 2014·8 cites·14 claims
- 2382US2025247963A1Wafer level bump stack for chip scale packageTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 2481US12419063B2Inductor on microelectronic dieTEXAS INSTRUMENTS INC·Filed 2023·Granted Sep 16, 2025·0 cites·20 claims
- 2581US12198995B2Covers for semiconductor package componentsTEXAS INSTRUMENTS INC·Filed 2023·Granted Jan 14, 2025·0 cites·20 claims
- 2681US11094616B2Multi-pitch leadsTEXAS INSTRUMENTS INC·Filed 2019·Granted Aug 17, 2021·2 cites·25 claims
- 2780US11239195B2Nanowire interfacesTEXAS INSTRUMENTS INC·Filed 2020·Granted Feb 1, 2022·1 cites·22 claims
- 2880US8866237B2Methods for embedding controlled-cavity MEMS package in integration boardMANACK CHRISTOPHER D·Filed 2012·Granted Oct 21, 2014·6 cites·16 claims
- 2979US11430722B2Integration of a passive component in a cavity of an integrated circuit packageTEXAS INSTRUMENTS INC·Filed 2018·Granted Aug 30, 2022·2 cites·13 claims
- 3079US11094659B2Microelectronic device with pillars having flared endsTEXAS INSTRUMENTS INC·Filed 2019·Granted Aug 17, 2021·2 cites·20 claims
- 3179US9013032B2High pin count, small SON/QFN packagesTEXAS INSTRUMENTS INC·Filed 2014·Granted Apr 21, 2015·3 cites·6 claims
- 3279US2023012200A1Shaped interconnect bumps in semiconductor devicesTEXAS INSTRUMENTS INC·Filed 2022·Application pending·0 cites
- 3378US11972994B2Film covers for sensor packagesTEXAS INSTRUMENTS INC·Filed 2023·Granted Apr 30, 2024·0 cites·19 claims
- 3478US11335570B2Multirow gull-wing package for microelectronic devicesTEXAS INSTRUMENTS INC·Filed 2018·Granted May 17, 2022·2 cites·15 claims
- 3577US12183703B2Leadframes in semiconductor devicesTEXAS INSTRUMENTS INC·Filed 2021·Granted Dec 31, 2024·0 cites·20 claims
- 3677US10643929B2Cantilevered leadframe support structure for magnetic wireless transfer between integrated circuit diesTEXAS INSTRUMENTS INC·Filed 2014·Granted May 5, 2020·2 cites·13 claims
- 3777US8129228B2Manufacturing method for integrating a shunt resistor into a semiconductor packageUDOMPANYAVIT UBOL·Filed 2010·Granted Mar 6, 2012·5 cites·16 claims
- 3876US12074098B2Three-dimensional functional integrationTEXAS INSTRUMENTS INC·Filed 2023·Granted Aug 27, 2024·0 cites·21 claims
- 3976US10832993B1Packaged multichip device with stacked die having a metal die attachTEXAS INSTRUMENTS INC·Filed 2019·Granted Nov 10, 2020·2 cites·17 claims
- 4076US6734532B2Back side coating of semiconductor wafersTEXAS INSTRUMENTS INC·Filed 2001·Granted May 11, 2004·22 cites·20 claims
- 4175US12191273B2Pre-molded leadframes in semiconductor devicesTEXAS INSTRUMENTS INC·Filed 2021·Granted Jan 7, 2025·0 cites·17 claims
- 4275US11791248B2Coated semiconductor devicesTEXAS INSTRUMENTS INC·Filed 2023·Granted Oct 17, 2023·0 cites·9 claims
- 4375US2024369598A1Integrated circuit package with current sense elementTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 4474US12300678B2Package for power semiconductor devicesTEXAS INSTRUMENTS INC·Filed 2023·Granted May 13, 2025·0 cites·17 claims
- 4574US2025285949A1Integration of a passive component in a cavity of an integrated circuit packageTEXAS INSTRUMENTS INC·Filed 2025·Application pending·0 cites
- 4673US12347738B2Sensor package cavities with polymer filmsTEXAS INSTRUMENTS INC·Filed 2022·Granted Jul 1, 2025·0 cites·36 claims
- 4773US11682609B2Three-dimensional functional integrationTEXAS INSTRUMENTS INC·Filed 2019·Granted Jun 20, 2023·1 cites·24 claims
- 4873US10832991B1Leadless packaged device with metal die attachTEXAS INSTRUMENTS INC·Filed 2019·Granted Nov 10, 2020·1 cites·20 claims
- 4973US10636758B2Expanded head pillar for bump bondsTEXAS INSTRUMENTS INC·Filed 2018·Granted Apr 28, 2020·1 cites·20 claims
- 5072US12505268B2Automated geometry optimization for analog, mixed-signal circuit designTEXAS INSTRUMENTS INC·Filed 2021·Granted Dec 23, 2025·0 cites·19 claims
Showing the top 50 of 176 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →