Inventor · disambiguated record
Hoa Kieu
Also filed as: KIEU HOA · KIEU HOA T · KIEU HOA THI
11 granted patents·478 citations·filing 1991–2004
93Inventor score
Files withAPPLIED MATERIALS INC11
Top patents by PatentIndex Score
11 records- 0194US6750156B2Method and apparatus for forming an anti-reflective coating on a substrateAPPLIED MATERIALS INC·Filed 2001·Granted Jun 15, 2004·58 cites·36 claims
- 0293US7041200B2Reducing particle generation during sputter depositionAPPLIED MATERIALS INC·Filed 2002·Granted May 9, 2006·45 cites·28 claims
- 0389US5171412AMaterial deposition method for integrated circuit manufacturingAPPLIED MATERIALS INC·Filed 1991·Granted Dec 15, 1992·138 cites·21 claims
- 0486US6946408B2Method and apparatus for depositing dielectric filmsAPPLIED MATERIALS INC·Filed 2004·Granted Sep 20, 2005·30 cites·33 claims
- 0584US5780357ADeposition process for coating or filling re-entry shaped contact holesAPPLIED MATERIALS INC·Filed 1997·Granted Jul 14, 1998·65 cites·16 claims
- 0683US5911113ASilicon-doped titanium wetting layer for aluminum plugAPPLIED MATERIALS INC·Filed 1997·Granted Jun 8, 1999·65 cites·13 claims
- 0765US5668055AMethod of filling of contact openings and vias by self-extrusion of overlying compressively stressed matal layerAPPLIED MATERIALS INC·Filed 1995·Granted Sep 16, 1997·30 cites·21 claims
- 0856US5847461AIntegrated circuit structure having contact openings and vias filled by self-extrusion of overlying metal layerAPPLIED MATERIALS INC·Filed 1996·Granted Dec 8, 1998·20 cites·14 claims
- 0949US6312568B2Two-step AIN-PVD for improved film propertiesAPPLIED MATERIALS INC·Filed 1999·Granted Nov 6, 2001·19 cites·19 claims
- 1039US6033541ADeposition process for coating or filling re-entry shaped contact holesAPPLIED MATERIALS INC·Filed 1998·Granted Mar 7, 2000·7 cites·5 claims
- 1131US6232665B1Silicon-doped titanium wetting layer for aluminum plugAPPLIED MATERIALS INC·Filed 1999·Granted May 15, 2001·1 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →