Inventor · disambiguated record
Yu-Chiang Cheng
Also filed as: CHENG YU-CHIANG
24 granted patents·20 pending applications·124 citations·filing 2000–2010
94Inventor score
Files withMITAC INT CORP11GETAC TECHNOLOGY CORP9HWANG MING-HANG8MITAC TECHNOLOGY CORP7CHENG YU-CHIANG4
Top patents by PatentIndex Score
44 records- 0190US7768461B2Antenna device with insert-molded antenna patternGETAC TECHNOLOGY CORP·Filed 2007·Granted Aug 3, 2010·31 cites·6 claims
- 0271US7782270B2Planar inverted-F antenna with extended grounding planeGETAC TECHNOLOGY CORP·Filed 2008·Granted Aug 24, 2010·7 cites·16 claims
- 0368US6326557B1Multi-layer circuit boardMITAC INT CORP·Filed 2001·Granted Dec 4, 2001·14 cites·10 claims
- 0467US7825862B2Antenna device with surface antenna pattern integrally coated casing of electronic deviceGETAC TECHNOLOGY CORP·Filed 2007·Granted Nov 2, 2010·6 cites·4 claims
- 0565US6417460B1Multi-layer circuit board having signal, ground and power layersMITAC INT CORP·Filed 2001·Granted Jul 9, 2002·10 cites·13 claims
- 0664US7671811B2Antenna device with ground plane coupled to conductive portion of an electronic deviceGETAC TECHNOLOGY CORP·Filed 2007·Granted Mar 2, 2010·5 cites·15 claims
- 0764US6548858B2Multi-layer circuit boardMITAC INT CORP·Filed 2001·Granted Apr 15, 2003·11 cites·11 claims
- 0863US6384340B1Multi-layer circuit boardMITAC INT CORP·Filed 2001·Granted May 7, 2002·10 cites·10 claims
- 0960US8035980B2Circuit structure and circuit substance for modifying characteristic impedance using different reference planesCHENG YU-CHIANG·Filed 2009·Granted Oct 11, 2011·4 cites·20 claims
- 1059US8013799B2Dual-band monopole antenna with antenna signal fed through short-circuit terminal of transmission lineGETAC TECHNOLOGY CORP·Filed 2008·Granted Sep 6, 2011·3 cites·16 claims
- 1159US6489570B2Multi-layer circuit boardMITAC INT CORP·Filed 2001·Granted Dec 3, 2002·7 cites·13 claims
- 1258US7474268B2Coupling antenna device having antenna pattern with multi-frequency resonating sectorsMITAC TECHNOLOGY CORP·Filed 2006·Granted Jan 6, 2009·3 cites·14 claims
- 1358US6429749B1Cancellation circuit that suppresses electromagnetic interference in a high speed circuitMITAC INT CORP·Filed 2000·Granted Aug 6, 2002·5 cites·16 claims
- 1454US7742002B2Antenna device with radiation pattern adjustment elementGETAC TECHNOLOGY CORP·Filed 2006·Granted Jun 22, 2010·2 cites·9 claims
- 1554US7504148B2Printed circuit board structure and manufacturing method thereofMITAC TECHNOLOGY CORP·Filed 2006·Granted Mar 17, 2009·1 cites·3 claims
- 1654US7432866B2Antenna device with ion-implanted resonant patternMITAC TECHNOLOGY CORP·Filed 2006·Granted Oct 7, 2008·2 cites·14 claims
- 1753US7671809B2Antenna device with ion-implanted antenna patternGETAC TECHNOLOGY CORP·Filed 2006·Granted Mar 2, 2010·2 cites·6 claims
- 1850US7961152B2Electronic device having helical resilient member serving as electric inductance elementGETAC TECHNOLOGY CORP·Filed 2006·Granted Jun 14, 2011·0 cites·9 claims
- 1945US2007199682A1Dissipation Heat Pipe Structure and Manufacturing Method ThereofHWANG MING-HANG·Filed 2006·Application pending·0 cites
- 2044US7804459B2Transmission line loaded dual-band monopole antennaGETAC TECHNOLOGY CORP·Filed 2008·Granted Sep 28, 2010·0 cites·15 claims
- 2144US6792056B1Cancellation circuit that suppresses electromagnetic interference in a high speed circuit using a function generatorMITAC INT CORP·Filed 2000·Granted Sep 14, 2004·1 cites·22 claims
- 2243USRE40068EMulti-layer circuit board having signal, ground and power layersMITAC TECHNOLOGY CORP·Filed 2004·Granted Feb 19, 2008·0 cites·17 claims
- 2343USRE39766EMulti-layer circuit boardMITAC INT CORP·Filed 2004·Granted Aug 14, 2007·0 cites·18 claims
- 2443US2007199681A1Dissipation Heat Pipe Structure and Manufacturing Method ThereofHWANG MING-HANG·Filed 2006·Application pending·0 cites
- 2542US2009115685A1Dual band helical antenna with wide bandwidthCHUNG SHYH-JONG·Filed 2008·Application pending·0 cites
- 2641US2008198087A1Dual-band antennaMITAC TECHNOLOGY CORP·Filed 2007·Application pending·0 cites
- 2741US2009066588A1Case structure of electronic deviceMITAC TECHNOLOGY CORP·Filed 2007·Application pending·0 cites
- 2838US2012011395A1Boot method under boot sector failure in hard disk and computer device using the sameCHOU CHENG-ZING·Filed 2010·Application pending·0 cites
- 2938US2003098177A1Multi-layer circuit boardMITAC INT CORP·Filed 2001·Application pending·0 cites
- 3035US7427807B2Chip heat dissipation structure and manufacturing methodMITAC TECHNOLOGY CORP·Filed 2006·Granted Sep 23, 2008·0 cites·18 claims
- 3135US2003103340A1EMI cancellation circuit embeded in an ICFiled 2001·Application pending·0 cites
- 3235US2007236397A1Antenna device with antenna element coupled to anti-EMI plate of an electronic deviceCHENG YU-CHIANG·Filed 2007·Application pending·0 cites
- 3334US2007236399A1Antenna device with antenna element matched by resonance circuitCHENG YU-CHIANG·Filed 2006·Application pending·0 cites
- 3433US2007201203A1Adhesion Material Structure and Process Method ThereofHWANG MING-HANG·Filed 2006·Application pending·0 cites
- 3533US2004109278A1Transformer circuitMITAC TECHNOLOGY CORP AND MITA·Filed 2002·Application pending·0 cites
- 3633US2007199678A1Surface Coating Film Structure on Heat Dissipation Metal and Manufacturing Method ThereofHWANG MING-HANG·Filed 2006·Application pending·0 cites
- 3733US2006255451A1Heat Conduction Interface Method and Manufacturing Method ThereofHWANG MING-HANG·Filed 2006·Application pending·0 cites
- 3833US2005007717A1[offset circuit for supressing electromagnetic interference and operation method thereof]Filed 2004·Application pending·0 cites
- 3931US6922049B2Testing method for a printed circuit board formed with conductive traces for high-frequency differential signal transmissionMITAC INT CORP·Filed 2003·Granted Jul 26, 2005·0 cites·8 claims
- 4031US2003131472A1Method of fabricating a multi-layer circuit board assemblyMITAC INT CORP·Filed 2002·Application pending·0 cites
- 4130US2007199677A1Heat Sink Fin Structure and Manufacturing Method ThereofHWANG MING-HANG·Filed 2006·Application pending·0 cites
- 4230US2007199679A1Chip Heat Dissipation System and Manufacturing Method and Structure of Heat Dissipation Device ThereofHWANG MING-HANG·Filed 2006·Application pending·0 cites
- 4330US2007201207A1Chip Heat Dissipation System and Structure of Heat Exchange Device and Manufacturing Method ThereofHWANG MING-HANG·Filed 2006·Application pending·0 cites
- 4425US2006071840A1Circuit structure and circuit substrate for modifying charcteristic impedance by using different reference planesCHENG YU-CHIANG·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →