Inventor · disambiguated record
Mark E. Jost
Also filed as: JOST MARK · JOST MARK E
52 granted patents·1 pending application·1,735 citations·filing 1990–2009
99Inventor score
Top patents by PatentIndex Score
53 records- 0197US5605857AMethod of forming a bit line over capacitor array of memory cells and an array of bit line over capacitor array of memory cellsMICRON TECHNOLOGY INC·Filed 1995·Granted Feb 25, 1997·226 cites·6 claims
- 0295US5705838AArray of bit line over capacitor array of memory cellsMICRON TECHNOLOGY INC·Filed 1996·Granted Jan 6, 1998·130 cites·4 claims
- 0394US6046094AMethod of forming wafer alignment patternsMICRON TECHNOLOGY INC·Filed 1998·Granted Apr 4, 2000·105 cites·28 claims
- 0494US5686747AIntegrated circuits comprising interconnecting plugsMICRON TECHNOLOGY INC·Filed 1996·Granted Nov 11, 1997·124 cites·19 claims
- 0593US5821140AMethod of forming a bit line over capacitor array of memory cells and an array of bit line over capacitor array of memory cellsMICRON TECHNOLOGY INC·Filed 1996·Granted Oct 13, 1998·115 cites·9 claims
- 0692US5900660AMethod of forming a bit line over capacitor array of memory cells and an array of bit line over capacitor array of memory callsMICRON TECHNOLOGY INC·Filed 1997·Granted May 4, 1999·95 cites·18 claims
- 0792US5702990AMethod of forming a bit line over capacitor array of memory cells and an array of bit line over capacitor array of memory cellsMICRON TECHNOLOGY INC·Filed 1996·Granted Dec 30, 1997·96 cites·26 claims
- 0892US5563089AMethod of forming a bit line over capacitor array of memory cells and an array of bit line over capacitor array of memory cellsMICRON TECHNOLOGY INC·Filed 1995·Granted Oct 8, 1996·108 cites·10 claims
- 0990US6110774AMethod of forming a bit line over capacitor array of memory cells and an array of bit line over capacitor array of memory cellsMICRON TECHNOLOGY INC·Filed 1997·Granted Aug 29, 2000·80 cites·3 claims
- 1089US5604147AMethod of forming a cylindrical container stacked capacitorMICRON TECHNOLOGY INC·Filed 1995·Granted Feb 18, 1997·84 cites·20 claims
- 1187US5128271AHigh performance vertical bipolar transistor structure via self-aligning processing techniquesIBM·Filed 1990·Granted Jul 7, 1992·71 cites·30 claims
- 1283US6150257APlasma treatment of an interconnect surface during formation of an interlayer dielectricMICRON TECHNOLOGY INC·Filed 1998·Granted Nov 21, 2000·47 cites·46 claims
- 1381US5739068ASemiconductor processing method of making electrical contact to a node received within a mass of insulating dielectric materialMICRON TECHNOLOGY INC·Filed 1996·Granted Apr 14, 1998·51 cites·29 claims
- 1480US5700732ASemiconductor wafer, wafer alignment patterns and method of forming wafer alignment patternsMICRON TECHNOLOGY INC·Filed 1996·Granted Dec 23, 1997·37 cites·9 claims
- 1579US6418008B1Enhanced capacitor shapeMICRON TECHNOLOGY INC·Filed 2001·Granted Jul 9, 2002·17 cites·5 claims
- 1676US5258318AMethod of forming a BiCMOS SOI wafer having thin and thick SOI regions of siliconIBM·Filed 1992·Granted Nov 2, 1993·58 cites·22 claims
- 1771US5925937ASemiconductor wafer, wafer alignment patternsMICRON TECHNOLOGY INC·Filed 1997·Granted Jul 20, 1999·23 cites·2 claims
- 1869US7659630B2Interconnect structures with interlayer dielectricMICRON TECHNOLOGY INC·Filed 2007·Granted Feb 9, 2010·2 cites·18 claims
- 1965US6605516B2Semiconductor wafer, wafer alignment patterns and method of forming wafer alignment patternsFiled 2001·Granted Aug 12, 2003·7 cites·6 claims
- 2065US5311539ARoughened sidewall ridge for high power fundamental mode semiconductor ridge waveguide laser operationIBM·Filed 1992·Granted May 10, 1994·21 cites·6 claims
- 2164US6461963B1Utilization of disappearing silicon hard mask for fabrication of semiconductor structuresMICRON TECHNOLOGY INC·Filed 2000·Granted Oct 8, 2002·6 cites·9 claims
- 2264US5789304AMethod of forming a capacitorMICRON TECHNOLOGY INC·Filed 1996·Granted Aug 4, 1998·21 cites·23 claims
- 2362US6596641B2Chemical vapor deposition methodsMICRON TECHNOLOGY INC·Filed 2001·Granted Jul 22, 2003·13 cites·34 claims
- 2462US5869403ASemiconductor processing methods of forming a contact opening to a semiconductor substrateMICRON TECHNOLOGY INC·Filed 1997·Granted Feb 9, 1999·22 cites·39 claims
- 2561US5966611ASemiconductor processing for forming capacitors by etching polysilicon and coating layer formed over the polysiliconMICRON TECHNOLOGY INC·Filed 1998·Granted Oct 12, 1999·21 cites·42 claims
- 2659US6982228B2Methods of etching a contact opening over a node location on a semiconductor substrateMICRON TECHNOLOGY INC·Filed 2002·Granted Jan 3, 2006·2 cites·32 claims
- 2759US6689693B2Methods for utilization of disappearing silicon hard mask for fabrication of semiconductor structuresMICRON TECHNOLOGY INC·Filed 2002·Granted Feb 10, 2004·4 cites·18 claims
- 2858US7955976B2Methods of forming semiconductor structuresMICRON TECHNOLOGY INC·Filed 2009·Granted Jun 7, 2011·0 cites·22 claims
- 2958US5962885AMethod of forming a capacitor and a capacitor constructionMICRON TECHNOLOGY INC·Filed 1997·Granted Oct 5, 1999·16 cites·5 claims
- 3055US5888877AMethod of forming recessed container cellsMICRON TECHNOLOGY INC·Filed 1997·Granted Mar 30, 1999·15 cites·40 claims
- 3154US6025271AMethod of removing surface defects or other recesses during the formation of a semiconductor deviceMICRON TECHNOLOGY INC·Filed 1997·Granted Feb 15, 2000·14 cites·24 claims
- 3253US6534408B2Utilization of disappearing silicon hard mask for fabrication of semiconductor structuresMICRON TECHNOLOGY INC·Filed 2002·Granted Mar 18, 2003·2 cites·18 claims
- 3353US6137186ASemiconductor wafer, wafer alignment patterns and method of forming wafer alignment patternsMICRON TECHNOLOGY INC·Filed 1998·Granted Oct 24, 2000·10 cites·18 claims
- 3451US6355566B1Method of removing surface defects or other recesses during the formation of a semiconductor deviceMICRON TECHNOLOGY INC·Filed 2001·Granted Mar 12, 2002·3 cites·25 claims
- 3551US5994237ASemiconductor processing methods of forming a contact opening to a semiconductor substrateMICRON TECHNOLOGY INC·Filed 1999·Granted Nov 30, 1999·13 cites·12 claims
- 3651US2006024973A1Methods of etching a contact opening over a node location on a semiconductor substrateJOST MARK E·Filed 2005·Application pending·0 cites
- 3750US6828252B2Method of etching a contact openingMICRON TECHNOLOGY INC·Filed 2004·Granted Dec 7, 2004·2 cites·12 claims
- 3850US6790762B1Method of making an electrical device including an interconnect structureMICRON TECHNOLOGY INC·Filed 2000·Granted Sep 14, 2004·2 cites·27 claims
- 3950US6369432B1Enhanced capacitor shapeMICRON TECHNOLOGY INC·Filed 1998·Granted Apr 9, 2002·11 cites·5 claims
- 4049US6153527ASemiconductor processing method of making electrical contact to a node received within a mass of insulating dielectric materialMICRON TECHNOLOGY INC·Filed 1999·Granted Nov 28, 2000·11 cites·8 claims
- 4149US6127239ASemiconductor processing methods, and methods of forming capacitorsMICRON TECHNOLOGY INC·Filed 1999·Granted Oct 3, 2000·12 cites·18 claims
- 4247US5798292AMethod of forming wafer alignment patternsMICRON TECHNOLOGY INC·Filed 1997·Granted Aug 25, 1998·7 cites·27 claims
- 4345US6228772B1Method of removing surface defects or other recesses during the formation of a semiconductor deviceMICRON TECHNOLOGY INC·Filed 2000·Granted May 8, 2001·1 cites·25 claims
- 4444US7279414B1Method of forming interconnect structure with interlayer dielectricMICRON TECHNOLOGY INC·Filed 1999·Granted Oct 9, 2007·7 cites·16 claims
- 4544US6787472B2Utilization of disappearing silicon hard mask for fabrication of semiconductor structuresMICRON TECHNOLOGY INC·Filed 2003·Granted Sep 7, 2004·0 cites·19 claims
- 4643US6037261ASemiconductor processing method of making electrical contact to a node received within a mass of insulating dielectric materialMICRON TECHNOLOGY INC·Filed 1998·Granted Mar 14, 2000·8 cites·4 claims
- 4742US6207529B1Semiconductor wafer,wafer alignment patterns and method of forming wafer alignment patternsMICRON TECHNOLOGY INC·Filed 1997·Granted Mar 27, 2001·5 cites·19 claims
- 4841US6653241B2Methods of forming protective segments of material, and etch stopsMICRON TECHNOLOGY INC·Filed 2002·Granted Nov 25, 2003·0 cites·26 claims
- 4941US6620734B1Methods of forming protective segments of material, and etch stopsMICRON TECHNOLOGY INC·Filed 2002·Granted Sep 16, 2003·0 cites·26 claims
- 5037US5307357AProtection means for ridge waveguide laser structures using thick organic filmsIBM·Filed 1992·Granted Apr 26, 1994·6 cites·5 claims
Showing the top 50 of 53 patent records by PatentIndex Score.
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