Inventor · disambiguated record
Seh Kwang Lee
Also filed as: LEE SEH KWANG
9 granted patents·3 pending applications·23 citations·filing 1998–2022
81Inventor score
Files withLEE SEH KWANG6APPLIED MATERIALS INC2EHWA DIAMOND IND CO LTD2EHWA DIAMOND INDUSTRIAL COMPANY LTD1SAMSUNG ELECTRONICS CO LTD1
Top patents by PatentIndex Score
12 records- 0181US8187553B2MicroreactorsLEE SEH KWANG·Filed 2010·Granted May 29, 2012·5 cites·20 claims
- 0271US10525566B2Preparing conditioning disk for chemical mechanical polishing and chemical mechanical polishing method including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jan 7, 2020·2 cites·17 claims
- 0348US9776306B2Method for manufacturing an electrodeposited diamond wire saw using patterned non-conductive materialsLEE SEH-KWANG·Filed 2012·Granted Oct 3, 2017·0 cites·7 claims
- 0447US7294242B1Collimated and long throw magnetron sputtering of nickel/iron films for magnetic recording head applicationsAPPLIED MATERIALS INC·Filed 1998·Granted Nov 13, 2007·13 cites·39 claims
- 0547US2024173823A1Diamond disc and method for manufacturing sameEHWA DIAMOND INDUSTRIAL COMPANY LTD·Filed 2022·Application pending·0 cites
- 0645US10358375B2Scribing wheel having fine structure recessEHWA DIAMOND IND CO LTD·Filed 2013·Granted Jul 23, 2019·0 cites·4 claims
- 0745US9421668B2CMP apparatusLEE SEH KWANG·Filed 2012·Granted Aug 23, 2016·0 cites·14 claims
- 0842US10166653B2CMP pad conditionerLEE SEH KWANG·Filed 2012·Granted Jan 1, 2019·0 cites·18 claims
- 0942US9314901B2CMP pad conditioner, and method for producing the CMP pad conditionerLEE SEH KWANG·Filed 2012·Granted Apr 19, 2016·0 cites·15 claims
- 1039US2014154956A1Pad Conditioning and Wafer Retaining Ring and Manufacturing Method ThereofEHWA DIAMOND IND CO LTD·Filed 2013·Application pending·0 cites
- 1136US2013344779A1Conditioner for soft pad and method for manufacturing sameLEE SEH KWANG·Filed 2012·Application pending·0 cites
- 1231US6280579B1Target misalignment detectorAPPLIED MATERIALS INC·Filed 1998·Granted Aug 28, 2001·3 cites·43 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →