Inventor · disambiguated record
Xiao Hu Liu
Also filed as: LIU XIAO H · LIU XIAO HU
87 granted patents·11 pending applications·904 citations·filing 2002–2019
99Inventor score
Top patents by PatentIndex Score
98 records- 0198US7955955B2Using crack arrestor for inhibiting damage from dicing and chip packaging interaction failures in back end of line structuresIBM·Filed 2007·Granted Jun 7, 2011·70 cites·22 claims
- 0298US7388273B2Reprogrammable fuse structure and methodIBM·Filed 2005·Granted Jun 17, 2008·73 cites·12 claims
- 0397US7394089B2Heat-shielded low power PCM-based reprogrammable EFUSE deviceIBM·Filed 2006·Granted Jul 1, 2008·76 cites·3 claims
- 0497US7276787B2Silicon chip carrier with conductive through-vias and method for fabricating sameIBM·Filed 2003·Granted Oct 2, 2007·124 cites·8 claims
- 0596US9586857B2Controlling fragmentation of chemically strengthened glassIBM·Filed 2015·Granted Mar 7, 2017·13 cites·20 claims
- 0696US8405279B2Coupling piezoelectric material generated stresses to devices formed in integrated circuitsELMEGREEN BRUCE G·Filed 2012·Granted Mar 26, 2013·23 cites·27 claims
- 0795US8604618B2Structure and method for reducing vertical crack propagationCOONEY III EDWARD C·Filed 2011·Granted Dec 10, 2013·24 cites·21 claims
- 0894US10490513B2Advanced crack stop structureIBM·Filed 2018·Granted Nov 26, 2019·8 cites·12 claims
- 0994US8076756B2Structure for inhibiting back end of line damage from dicing and chip packaging interaction failuresLANE MICHAEL W·Filed 2011·Granted Dec 13, 2011·21 cites·20 claims
- 1093US8159854B2Piezo-effect transistor device and applicationsELMEGREEN BRUCE G·Filed 2009·Granted Apr 17, 2012·27 cites·32 claims
- 1193US7902541B2Semiconductor nanowire with built-in stressIBM·Filed 2009·Granted Mar 8, 2011·22 cites·24 claims
- 1292US7989233B2Semiconductor nanowire with built-in stressIBM·Filed 2011·Granted Aug 2, 2011·13 cites·20 claims
- 1391US10475753B2Advanced crack stop structureIBM·Filed 2018·Granted Nov 12, 2019·5 cites·18 claims
- 1491US9670061B1Flexible electronics for wearable healthcare sensorsIBM·Filed 2016·Granted Jun 6, 2017·4 cites·10 claims
- 1591US8247947B2Coupling piezoelectric material generated stresses to devices formed in integrated circuitsELMEGREEN BRUCE G·Filed 2009·Granted Aug 21, 2012·18 cites·22 claims
- 1691US7848135B2Piezo-driven non-volatile memory cell with hysteretic resistanceIBM·Filed 2008·Granted Dec 7, 2010·30 cites·24 claims
- 1790US10388567B2Thru-silicon-via structuresGLOBALFOUNDRIES INC·Filed 2017·Granted Aug 20, 2019·6 cites·19 claims
- 1890US7314789B2Structure and method to generate local mechanical gate stress for MOSFET channel mobility modificationIBM·Filed 2006·Granted Jan 1, 2008·13 cites·16 claims
- 1989US9812359B2Thru-silicon-via structuresIBM·Filed 2015·Granted Nov 7, 2017·6 cites·4 claims
- 2089US7955952B2Crackstop structures and methods of making sameIBM·Filed 2008·Granted Jun 7, 2011·17 cites·20 claims
- 2189US7525161B2Strained MOS devices using source/drain epitaxyIBM·Filed 2007·Granted Apr 28, 2009·17 cites·9 claims
- 2289US7371684B2Process for preparing electronics structures using a sacrificial multilayer hardmask schemeIBM·Filed 2005·Granted May 13, 2008·12 cites·21 claims
- 2388US8367492B2Multiple Orientation Nanowires with Gate Stack SensorsIBM·Filed 2012·Granted Feb 5, 2013·7 cites·3 claims
- 2488US7357977B2Ultralow dielectric constant layer with controlled biaxial stressIBM·Filed 2005·Granted Apr 15, 2008·10 cites·7 claims
- 2588US7067902B2Building metal pillars in a chip for structure supportIBM·Filed 2003·Granted Jun 27, 2006·42 cites·10 claims
- 2685US11133259B2Multi-chip package structure having high density chip interconnect bridge with embedded power distribution networkIBM·Filed 2019·Granted Sep 28, 2021·4 cites·20 claims
- 2785US8368125B2Multiple orientation nanowires with gate stack stressorsIBM·Filed 2009·Granted Feb 5, 2013·9 cites·10 claims
- 2885US7790577B2Crackstop structures and methods of making sameIBM·Filed 2008·Granted Sep 7, 2010·13 cites·10 claims
- 2984US9738560B2Controlling fragmentation of chemically strengthened glassIBM·Filed 2016·Granted Aug 22, 2017·2 cites·20 claims
- 3083US7960808B2Reprogrammable fuse structure and methodIBM·Filed 2007·Granted Jun 14, 2011·8 cites·21 claims
- 3182US10964881B2Piezoelectronic device with novel force amplificationIBM·Filed 2017·Granted Mar 30, 2021·3 cites·15 claims
- 3282US6972209B2Stacked via-stud with improved reliability in copper metallurgyIBM·Filed 2002·Granted Dec 6, 2005·32 cites·8 claims
- 3381US9082781B2Semiconductor article having a zig-zag guard ring and method of forming the sameIBM·Filed 2013·Granted Jul 14, 2015·5 cites·19 claims
- 3481US8846191B2Thermal expansion control employing platelet fillersIBM·Filed 2012·Granted Sep 30, 2014·2 cites·19 claims
- 3581US7173312B2Structure and method to generate local mechanical gate stress for MOSFET channel mobility modificationIBM·Filed 2004·Granted Feb 6, 2007·20 cites·11 claims
- 3680US9565759B2Axiocentric scrubbing land grid array contacts and methods for fabricationGLOBALFOUNDRIES INC·Filed 2015·Granted Feb 7, 2017·2 cites·3 claims
- 3780US8263879B2Axiocentric scrubbing land grid array contacts and methods for fabricationHOUGHAM GARETH·Filed 2009·Granted Sep 11, 2012·14 cites·7 claims
- 3880US7456098B2Building metal pillars in a chip for structure supportIBM·Filed 2006·Granted Nov 25, 2008·8 cites·8 claims
- 3979US8449971B2Thermal expansion control employing platelet fillersHOUGHAM GARETH G·Filed 2011·Granted May 28, 2013·2 cites·24 claims
- 4078US9536842B2Structure with air gap crack stopGLOBALFOUNDRIES INC·Filed 2014·Granted Jan 3, 2017·4 cites·18 claims
- 4178US7947907B2Electronics structures using a sacrificial multi-layer hardmask schemeIBM·Filed 2008·Granted May 24, 2011·5 cites·20 claims
- 4277US7622737B2Test structures for electrically detecting back end of the line failures and methods of making and using the sameIBM·Filed 2007·Granted Nov 24, 2009·7 cites·19 claims
- 4375US8278155B2Reprogrammable fuse structure and methodBURR GEOFFREY W·Filed 2011·Granted Oct 2, 2012·3 cites·20 claims
- 4475US7417315B2Negative thermal expansion system (NTEs) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packagingIBM·Filed 2002·Granted Aug 26, 2008·12 cites·30 claims
- 4574US8969174B2Fixed curvature force loading of mechanically spalled filmsIBM·Filed 2014·Granted Mar 3, 2015·2 cites·16 claims
- 4674US8765595B2Thick on-chip high-performance wiring structuresCOONEY III EDWARD C·Filed 2012·Granted Jul 1, 2014·3 cites·16 claims
- 4774US7485582B2Hardmask for improved reliability of silicon based dielectricsIBM·Filed 2008·Granted Feb 3, 2009·5 cites·13 claims
- 4874US7335980B2Hardmask for reliability of silicon based dielectricsIBM·Filed 2004·Granted Feb 26, 2008·12 cites·13 claims
- 4973US8241957B2Negative thermal expansion system (NTES) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packagingHOUGHAM GARETH GEOFFREY·Filed 2010·Granted Aug 14, 2012·2 cites·16 claims
- 5071US7491965B2Heat-shielded low power PCM-based reprogrammable eFUSE deviceIBM·Filed 2008·Granted Feb 17, 2009·6 cites·17 claims
Showing the top 50 of 98 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →