Inventor · disambiguated record
Meguru Ito
Also filed as: ITO Meguru
11 granted patents·3 pending applications·12 citations·filing 2012–2021
83Inventor score
Top patents by PatentIndex Score
14 records- 0191US11195638B2Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed circuit boardMITSUBISHI GAS CHEMICAL CO·Filed 2020·Granted Dec 7, 2021·2 cites·16 claims
- 0287US10676579B2Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed circuit boardMITSUBISHI GAS CHEMICAL CO·Filed 2016·Granted Jun 9, 2020·3 cites·16 claims
- 0382US9512329B2Resin composition, prepreg, and laminateNOBUKUNI TAKESHI·Filed 2012·Granted Dec 6, 2016·5 cites·17 claims
- 0476US11769607B2Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed circuit boardMITSUBISHI GAS CHEMICAL CO·Filed 2021·Granted Sep 26, 2023·0 cites·13 claims
- 0570US10550228B2Resin composition, prepreg, metal foil-clad laminate, and printed circuit boardMITSUBISHI GAS CHEMICAL CO·Filed 2016·Granted Feb 4, 2020·1 cites·25 claims
- 0663US2018197655A1Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed circuit boardMITSUBISHI GAS CHEMICAL CO·Filed 2016·Application pending·0 cites
- 0758US9904860B2Vehicle exterior environment recognition apparatusSUBARU CORP·Filed 2016·Granted Feb 27, 2018·1 cites·9 claims
- 0856US10791626B2Prepreg, metal foil-clad laminate, and printed wiring boardMITSUBISHI GAS CHEMICAL CO·Filed 2014·Granted Sep 29, 2020·0 cites·17 claims
- 0949US2020325292A1Resin composition, prepreg, laminate, metal foil-clad laminate, printed wiring board, and multilayer printed wiring boardMITSUBISHI GAS CHEMICAL CO·Filed 2018·Application pending·0 cites
- 1048US10292260B2Insulating layer for printed circuit board and printed circuit boardMITSUBISHI GAS CHEMICAL CO·Filed 2015·Granted May 14, 2019·0 cites·18 claims
- 1145US10717837B2Resin composition and prepreg, resin sheet, laminate, and printed circuit board comprising sameMITSUBISHI GAS CHEMICAL CO·Filed 2016·Granted Jul 21, 2020·0 cites·15 claims
- 1245US2023098357A1Resin composition, resin sheet, prepreg and printed wiring boardMITSUBISHI GAS CHEMICAL CO·Filed 2021·Application pending·0 cites
- 1344US10869390B2Resin composition, prepreg, metal foil-clad laminate, and printed circuit boardMITSUBISHI GAS CHEMICAL CO·Filed 2016·Granted Dec 15, 2020·0 cites·12 claims
- 1443US10815349B2Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed circuit boardMITSUBISHI GAS CHEMICAL CO·Filed 2016·Granted Oct 27, 2020·0 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →