Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed circuit board

Abstract

It is intended to provide a resin composition that serves as a raw material for a printed circuit board excellent in chemical resistance, desmear resistance, and insulation reliability. The resin composition of the present invention contains a maleimide compound, a silane compound having a styrene skeleton and a hydrolyzable group or a hydroxy group, and an inorganic filler.

1 . A resin composition comprising a maleimide compound, a silane compound having a styrene skeleton and a hydrolyzable group or a hydroxy group, and an inorganic filler. 
     
     
         2 . The resin composition according to  claim 1 , wherein the resin composition comprises, as the silane compound, a compound represented by the following formula (A): 
       
         
           
           
               
               
           
         
         wherein R 8  represents the hydrolyzable group or the hydroxy group; R 9  represents a hydrogen atom or an alkyl group having 1 to 3 carbon atoms; when a plurality of R 8  or R 9  are present, the plurality of R 8  or R 9  are the same as or different from each other; and k represents an integer of 1 to 3. 
       
     
     
         3 . The resin composition according to  claim 1 , further comprising an alkenyl-substituted nadimide. 
     
     
         4 . The resin composition according to  claim 3 , wherein the resin composition comprises, as the alkenyl-substituted nadimide, a compound represented by the following formula (1): 
       
         
           
           
               
               
           
         
         wherein each R 1  independently represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, and R 2  represents an alkylene group having 1 to 6 carbon atoms, a phenylene group, a biphenylene group, a naphthylene group, or a group represented by the following formula (2) or (3): 
       
       
         
           
           
               
               
           
         
         wherein R 3  represents a methylene group, an isopropylidene group, or a substituent represented by CO, O, S, or SO 2 , and 
       
       
         
           
           
               
               
           
         
         wherein each R 4  independently represents an alkylene group having 1 to 4 carbon atoms, or a cycloalkylene group having 5 to 8 carbon atoms. 
       
     
     
         5 . The resin composition according to  claim 3 , wherein the resin composition comprises, as the alkenyl-substituted nadimide, a compound represented by the following formula (4) and/or (5): 
       
         
           
           
               
               
           
         
       
     
     
         6 . The resin composition according to  claim 1 , wherein the resin composition comprises, as the maleimide compound, at least one compound selected from the group consisting of bis(4-maleimidophenyl)methane, 2,2-bis{4-(4-maleimidophenoxy)-phenyl}propane, bis(3-ethyl-5-methyl-4-maleimidophenyl)methane, and a maleimide compound represented by the following formula (6): 
       
         
           
           
               
               
           
         
         wherein each R 5  independently represents a hydrogen atom or a methyl group, and n 1  represents an integer of 1 or larger. 
       
     
     
         7 . The resin composition according to  claim 1 , further comprising a cyanate ester compound. 
     
     
         8 . The resin composition according to  claim 7 , wherein the resin composition comprises, as the cyanate ester compound, a compound represented by the following formula (7) and/or (8): 
       
         
           
           
               
               
           
         
         wherein each R 6  independently represents a hydrogen atom or a methyl group, and n 2  represents an integer of 1 or larger, and 
       
       
         
           
           
               
               
           
         
         wherein each R 7  independently represents a hydrogen atom or a methyl group, and n 3  represents an integer of 1 or larger. 
       
     
     
         9 . The resin composition according to  claim 1 , wherein the inorganic filler is surface-treated in advance with the silane compound. 
     
     
         10 . The resin composition according to  claim 1 , wherein the content of the silane compound is 0.1 to 15 parts by mass based on 100 parts by mass in total of component(s) constituting a resin in the resin composition. 
     
     
         11 . The resin composition according to  claim 1 , wherein the inorganic filler comprises at least one selected from the group consisting of silica, alumina, and aluminum nitride. 
     
     
         12 . The resin composition according to  claim 1 , wherein the content of the inorganic filler is 100 to 1100 parts by mass based on 100 parts by mass in total of component(s) constituting a resin in the resin composition. 
     
     
         13 . (canceled) 
     
     
         14 . (canceled) 
     
     
         15 . (canceled) 
     
     
         16 . (canceled) 
     
     
         17 . A metal foil-clad laminate having at least one material selected from the group consisting of a prepreg comprising a base material and a resin composition according to  claim 1 , the base material being impregnated or coated with the resin composition, and a resin sheet comprising a support and the resin composition, the support being coated with the resin composition, and a metal foil disposed on one side or both sides of at least one material selected from the group consisting of the prepreg and the resin sheet, the metal foil-clad laminate comprising a cured product of a resin composition contained in at least one material selected from the group consisting of the prepreg and the resin sheet. 
     
     
         18 . A printed circuit board comprising an insulating layer and a conductor layer formed on a surface of the insulating layer, wherein the insulating layer comprises a resin composition according to  claim 1 .