Inventor · disambiguated record
Mitul Modi
Also filed as: MODI MITUL · MODI MITUL B · MODI MITUL BHARAT
39 granted patents·16 pending applications·192 citations·filing 2005–2025
96Inventor score
Top patents by PatentIndex Score
55 records- 0198US10199354B2Die sidewall interconnects for 3D chip assembliesINTEL CORP·Filed 2016·Granted Feb 5, 2019·153 cites·17 claims
- 0294US12261150B2Mold shelf package design and process flow for advanced package architecturesINTEL CORP·Filed 2023·Granted Mar 25, 2025·1 cites·20 claims
- 0394US12087731B2No mold shelf package design and process flow for advanced package architecturesINTEL CORP·Filed 2023·Granted Sep 10, 2024·1 cites·18 claims
- 0494US2025391754A1Ultra-thin, hyper-density semiconductor packagesINTEL CORP·Filed 2025·Application pending·0 cites
- 0592US12392970B2Photonic integrated circuit packaging architecturesINTEL CORP·Filed 2021·Granted Aug 19, 2025·2 cites·20 claims
- 0691US11430724B2Ultra-thin, hyper-density semiconductor packagesINTEL CORP·Filed 2017·Granted Aug 30, 2022·5 cites·24 claims
- 0785US12422615B2Nested glass packaging architecture for hybrid electrical and optical communication devicesINTEL CORP·Filed 2021·Granted Sep 23, 2025·1 cites·11 claims
- 0885US10510667B2Conductive coating for a microelectronics packageINTEL CORP·Filed 2016·Granted Dec 17, 2019·4 cites·20 claims
- 0984US12476174B2Ultra-thin, hyper-density semiconductor packagesINTEL CORP·Filed 2023·Granted Nov 18, 2025·0 cites·20 claims
- 1083US11024559B2Semiconductor package with electromagnetic interference shielding structuresINTEL CORP·Filed 2016·Granted Jun 1, 2021·4 cites·17 claims
- 1183US2025372578A1Semiconductor package having passive support waferINTEL CORP·Filed 2025·Application pending·0 cites
- 1280US11574851B2Coupled cooling fins in ultra-small systemsINTEL CORP·Filed 2019·Granted Feb 7, 2023·3 cites·23 claims
- 1379US12406914B2Ultra-thin, hyper-density semiconductor packagesINTEL CORP·Filed 2022·Granted Sep 2, 2025·0 cites·20 claims
- 1479US12027448B2Open cavity bridge power delivery architectures and processesINTEL CORP·Filed 2020·Granted Jul 2, 2024·1 cites·11 claims
- 1579US11901333B2No mold shelf package design and process flow for advanced package architecturesINTEL CORP·Filed 2019·Granted Feb 13, 2024·1 cites·25 claims
- 1678US2025192101A1No mold shelf package design and process flow for advanced package architecturesINTEL CORP·Filed 2025·Application pending·0 cites
- 1777US12068222B2Dummy die structures of a packaged integrated circuit deviceINTEL CORP·Filed 2020·Granted Aug 20, 2024·1 cites·15 claims
- 1877US12040246B2Chip-scale package architectures containing a die back side metal and a solder thermal interface materialINTEL CORP·Filed 2020·Granted Jul 16, 2024·1 cites·15 claims
- 1977US11328968B2Stacked die cavity packageINTEL CORP·Filed 2016·Granted May 10, 2022·2 cites·18 claims
- 2076US2022344247A1Ultra-thin, hyper-density semiconductor packagesINTEL CORP·Filed 2022·Application pending·0 cites
- 2173US10910314B2Conductive coating for a microelectronics packageINTEL CORP·Filed 2019·Granted Feb 2, 2021·1 cites·20 claims
- 2272US11705377B2Stacked die cavity packageINTEL CORP·Filed 2022·Granted Jul 18, 2023·0 cites·7 claims
- 2370US11417630B2Semiconductor package having passive support waferINTEL CORP·Filed 2016·Granted Aug 16, 2022·1 cites·15 claims
- 2470US10224290B2Electromagnetically shielded electronic devices and related systems and methodsINTEL CORP·Filed 2015·Granted Mar 5, 2019·2 cites·20 claims
- 2570US7352061B2Flexible core for enhancement of package interconnect reliabilityINTEL CORP·Filed 2005·Granted Apr 1, 2008·4 cites·13 claims
- 2670US2022352121A1Semiconductor package having passive support waferINTEL CORP·Filed 2022·Application pending·0 cites
- 2769US11735495B2Active package cooling structures using molded substrate packaging technologyINTEL CORP·Filed 2019·Granted Aug 22, 2023·1 cites·14 claims
- 2869US2024332112A1Chip-scale package architectures containing a die back side metal and a solder thermal interface materialINTEL CORP·Filed 2024·Application pending·0 cites
- 2967US10229887B2Systems and methods for electromagnetic interference shieldingINTEL CORP·Filed 2016·Granted Mar 12, 2019·1 cites·6 claims
- 3061US9516752B2Underfill device and methodINTEL CORP·Filed 2013·Granted Dec 6, 2016·1 cites·12 claims
- 3158US10763220B2Systems and methods for electromagnetic interference shieldingINTEL CORP·Filed 2019·Granted Sep 1, 2020·0 cites·20 claims
- 3255US11942393B2Substrate with thermal insulationINTEL CORP·Filed 2020·Granted Mar 26, 2024·0 cites·16 claims
- 3354US10325866B2Electronic device packages with conformal EMI shielding and related methodsINTEL CORP·Filed 2017·Granted Jun 18, 2019·0 cites·14 claims
- 3452US12176268B2Open cavity bridge co-planar placement architectures and processesINTEL CORP·Filed 2020·Granted Dec 24, 2024·0 cites·6 claims
- 3552US9704811B1Perforated conductive material for EMI shielding of semiconductor device and componentsINTEL CORP·Filed 2015·Granted Jul 11, 2017·0 cites·20 claims
- 3652US7633142B2Flexible core for enhancement of package interconnect reliabilityINTEL CORP·Filed 2007·Granted Dec 15, 2009·0 cites·6 claims
- 3752US2025183067A1Modular equipment mainframe for semiconductor process flowsINTEL CORP·Filed 2023·Application pending·0 cites
- 3851US9847304B2Electronic device packages with conformal EMI shielding and related methodsINTEL CORP·Filed 2015·Granted Dec 19, 2017·0 cites·9 claims
- 3950US8399291B2Underfill device and methodBRUSSO PATRICIA A·Filed 2005·Granted Mar 19, 2013·1 cites·7 claims
- 4050US2023089494A1Photonic integrated circuit packaging architecturesINTEL CORP·Filed 2021·Application pending·0 cites
- 4150US2017250145A1Perforated conductive material for emi shielding of semiconductor device and componentsINTEL CORP·Filed 2017·Application pending·0 cites
- 4249US2025321909A13d stacked i/o chiplet on optical interposer for high bandwidth applicationsLIGHTMATTER INC·Filed 2025·Application pending·0 cites
- 4348US7691667B2Compliant integrated circuit package substrateINTEL CORP·Filed 2006·Granted Apr 6, 2010·0 cites·4 claims
- 4447US11545407B2Thermal management solutions for integrated circuit packagesINTEL CORP·Filed 2019·Granted Jan 3, 2023·0 cites·20 claims
- 4547US7745917B2Compliant integrated circuit package substrateINTEL CORP·Filed 2010·Granted Jun 29, 2010·0 cites·13 claims
- 4646US11611164B2Wideband multi-pin edge connector for radio frequency front end moduleINTEL CORP·Filed 2019·Granted Mar 21, 2023·0 cites·21 claims
- 4746US7719109B2Embedded capacitors for reducing package crackingINTEL CORP·Filed 2006·Granted May 18, 2010·0 cites·12 claims
- 4843US2022102231A1Dummy die in a recessed mold structure of a packaged integrated circuit deviceINTEL CORP·Filed 2020·Application pending·0 cites
- 4942US7692307B2Compliant structure for an electronic device, method of manufacturing same, and system containing sameINTEL CORP·Filed 2006·Granted Apr 6, 2010·0 cites·12 claims
- 5040US2020273811A1Ic die package thermal spreader and emi shield comprising graphiteINTEL CORP·Filed 2019·Application pending·0 cites
Showing the top 50 of 55 patent records by PatentIndex Score.
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