Inventor · disambiguated record
Felix Deng
Also filed as: DENG FELIX
5 granted patents·1 pending application·2 citations·filing 2019–2021
65Inventor score
Files withAPPLIED MATERIALS INC6
Top patents by PatentIndex Score
6 records- 0181US10991617B2Methods and apparatus for cleaving of semiconductor substratesAPPLIED MATERIALS INC·Filed 2019·Granted Apr 27, 2021·2 cites·4 claims
- 0270US11610807B2Methods and apparatus for cleaving of semiconductor substratesAPPLIED MATERIALS INC·Filed 2021·Granted Mar 21, 2023·0 cites·19 claims
- 0370US11569122B2Methods and apparatus for cleaving of semiconductor substratesAPPLIED MATERIALS INC·Filed 2021·Granted Jan 31, 2023·0 cites·20 claims
- 0452US11929260B2Low warpage curing methodology by inducing curvatureAPPLIED MATERIALS INC·Filed 2021·Granted Mar 12, 2024·0 cites·20 claims
- 0542US2021001520A1Methods and apparatus for microwave processing of polymer materialsAPPLIED MATERIALS INC·Filed 2020·Application pending·0 cites
- 0641US12048948B2Methods for forming microwave tunable composited thin-film dielectric layerAPPLIED MATERIALS INC·Filed 2019·Granted Jul 30, 2024·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →