Inventor · disambiguated record
Nuno Yen-Chu Chen
Also filed as: CHEN NUNO · CHEN NUNO YEN-CHU
7 granted patents·3 pending applications·8 citations·filing 2005–2021
75Inventor score
Top patents by PatentIndex Score
10 records- 0181US10991617B2Methods and apparatus for cleaving of semiconductor substratesAPPLIED MATERIALS INC·Filed 2019·Granted Apr 27, 2021·2 cites·4 claims
- 0274USD1007449STarget profile for a physical vapor deposition chamber targetAPPLIED MATERIALS INC·Filed 2021·Granted Dec 12, 2023·6 cites·1 claims
- 0370US11610807B2Methods and apparatus for cleaving of semiconductor substratesAPPLIED MATERIALS INC·Filed 2021·Granted Mar 21, 2023·0 cites·19 claims
- 0470US11569122B2Methods and apparatus for cleaving of semiconductor substratesAPPLIED MATERIALS INC·Filed 2021·Granted Jan 31, 2023·0 cites·20 claims
- 0552US11929260B2Low warpage curing methodology by inducing curvatureAPPLIED MATERIALS INC·Filed 2021·Granted Mar 12, 2024·0 cites·20 claims
- 0650US11375584B2Methods and apparatus for processing a substrate using microwave energyAPPLIED MATERIALS INC·Filed 2019·Granted Jun 28, 2022·0 cites·20 claims
- 0743US2007166998A1Interconnecting process and method for fabricating complex dielectric barrier alyerUNITED MICROELECTRONICS CORP·Filed 2007·Application pending·0 cites
- 0842US2021001520A1Methods and apparatus for microwave processing of polymer materialsAPPLIED MATERIALS INC·Filed 2020·Application pending·0 cites
- 0941US12048948B2Methods for forming microwave tunable composited thin-film dielectric layerAPPLIED MATERIALS INC·Filed 2019·Granted Jul 30, 2024·0 cites·11 claims
- 1033US2006194427A1Interconnecting process and method for fabricating complex dielectric barrier layerWU YI-CHING·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →