Inventor · disambiguated record
Venkata Sharat Chandra Parimi
Also filed as: PARIMI VENKATA SHARAT CHANDRA
21 granted patents·6 pending applications·5 citations·filing 2019–2024
89Inventor score
Top patents by PatentIndex Score
27 records- 0189US11495483B2Backside gas leakby for bevel deposition reductionAPPLIED MATERIALS INC·Filed 2020·Granted Nov 8, 2022·2 cites·20 claims
- 0285US11584994B2Pedestal for substrate processing chambersAPPLIED MATERIALS INC·Filed 2019·Granted Feb 21, 2023·1 cites·21 claims
- 0380US12000048B2Pedestal for substrate processing chambersAPPLIED MATERIALS INC·Filed 2023·Granted Jun 4, 2024·0 cites·20 claims
- 0479US11600470B2Targeted heat control systemsAPPLIED MATERIALS INC·Filed 2019·Granted Mar 7, 2023·2 cites·20 claims
- 0576US12211728B2Electrostatic chuck design with improved chucking and arcing performanceAPPLIED MATERIALS INC·Filed 2023·Granted Jan 28, 2025·0 cites·20 claims
- 0676US2025125129A1Processing chamber deposition confinementAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 0774US11984305B2Substrate pedestal for improved substrate processingAPPLIED MATERIALS INC·Filed 2023·Granted May 14, 2024·0 cites·20 claims
- 0866US12211673B2Processing chamber deposition confinementAPPLIED MATERIALS INC·Filed 2020·Granted Jan 28, 2025·0 cites·10 claims
- 0962US11587773B2Substrate pedestal for improved substrate processingAPPLIED MATERIALS INC·Filed 2020·Granted Feb 21, 2023·0 cites·12 claims
- 1062US10923334B2Selective deposition of hardmaskAPPLIED MATERIALS INC·Filed 2019·Granted Feb 16, 2021·0 cites·23 claims
- 1160US11682574B2Electrostatic chuck design with improved chucking and arcing performanceAPPLIED MATERIALS INC·Filed 2019·Granted Jun 20, 2023·0 cites·20 claims
- 1256US12255054B2Methods to eliminate of deposition on wafer bevel and backsideAPPLIED MATERIALS INC·Filed 2020·Granted Mar 18, 2025·0 cites·17 claims
- 1356US11682544B2Cover wafer for semiconductor processing chamberAPPLIED MATERIALS INC·Filed 2020·Granted Jun 20, 2023·0 cites·19 claims
- 1455US2019382889A1Technique to enable high temperature clean for rapid processing of wafersAPPLIED MATERIALS INC·Filed 2019·Application pending·0 cites
- 1555US2025218819A1Radiative heat windows and wafer support pads in vapor etch reactorsLAM RES CORP·Filed 2023·Application pending·0 cites
- 1652US11821082B2Reduced defect deposition processesAPPLIED MATERIALS INC·Filed 2020·Granted Nov 21, 2023·0 cites·19 claims
- 1752US11515129B2Radiation shield modification for improving substrate temperature uniformityAPPLIED MATERIALS INC·Filed 2019·Granted Nov 29, 2022·0 cites·20 claims
- 1850US12027366B2Reduced hydrogen deposition processesAPPLIED MATERIALS INC·Filed 2020·Granted Jul 2, 2024·0 cites·20 claims
- 1950US11830706B2Heated pedestal design for improved heat transfer and temperature uniformityAPPLIED MATERIALS INC·Filed 2019·Granted Nov 28, 2023·0 cites·19 claims
- 2048US11862475B2Gas mixer to enable RPS purgingAPPLIED MATERIALS INC·Filed 2020·Granted Jan 2, 2024·0 cites·17 claims
- 2147US12100609B2Electrostatic chucking processAPPLIED MATERIALS INC·Filed 2020·Granted Sep 24, 2024·0 cites·17 claims
- 2245US12191169B2Systems and methods for faceplate temperature controlAPPLIED MATERIALS INC·Filed 2020·Granted Jan 7, 2025·0 cites·16 claims
- 2345US12191115B2Dual RF for controllable film depositionAPPLIED MATERIALS INC·Filed 2019·Granted Jan 7, 2025·0 cites·15 claims
- 2445US2021287924A1Semiconductor substrate support with wafer backside damage controlAPPLIED MATERIALS INC·Filed 2020·Application pending·0 cites
- 2544US11804363B2Chamber components for gas delivery modulationAPPLIED MATERIALS INC·Filed 2020·Granted Oct 31, 2023·0 cites·14 claims
- 2644US2020249263A1Method and tool for electrostatic chuckingAPPLIED MATERIALS INC·Filed 2020·Application pending·0 cites
- 2741US2022108891A1Modular zone control for a processing chamberAPPLIED MATERIALS INC·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →