Inventor · disambiguated record
Dai Nakajima
Also filed as: NAKAJIMA DAI
38 granted patents·3 pending applications·491 citations·filing 2000–2022
98Inventor score
Top patents by PatentIndex Score
41 records- 0188US6762937B2Power moduleMITSUBISHI ELECTRIC CORP·Filed 2002·Granted Jul 13, 2004·41 cites·2 claims
- 0288US6501172B1Power moduleMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Dec 31, 2002·48 cites·11 claims
- 0387US6304448B1Power moduleMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Oct 16, 2001·50 cites·13 claims
- 0485US10348150B2Rotating electric machine statorTOYOTA MOTOR CO LTD·Filed 2015·Granted Jul 9, 2019·3 cites·4 claims
- 0584US10768127B2Thermal conductivity measurement apparatus and thermal conductivity measurement methodMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Sep 8, 2020·3 cites·13 claims
- 0684US6522544B1Power moduleMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Feb 18, 2003·31 cites·5 claims
- 0783US6979843B2Power semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2003·Granted Dec 27, 2005·39 cites·13 claims
- 0883US6867484B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2002·Granted Mar 15, 2005·39 cites·10 claims
- 0981US6900986B2Power moduleRYODEN SEMICONDUCTOR SYST ENG·Filed 2004·Granted May 31, 2005·25 cites·4 claims
- 1081US6700194B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2002·Granted Mar 2, 2004·35 cites·18 claims
- 1179US8299666B2Control apparatus-integrated dynamoelectric machineSHIRAKATA YUJI·Filed 2010·Granted Oct 30, 2012·7 cites·7 claims
- 1279US6903457B2Power semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2003·Granted Jun 7, 2005·27 cites·14 claims
- 1378US9236324B2Electric power semiconductor device and method for producing sameBESSHI NORIYUKI·Filed 2012·Granted Jan 12, 2016·7 cites·5 claims
- 1478US7081671B2Power moduleMITSUBISHI ELECTRIC CORP·Filed 2002·Granted Jul 25, 2006·23 cites·4 claims
- 1577US9479029B2Electric rotating machineFUKASE TATSUYA·Filed 2011·Granted Oct 25, 2016·4 cites·20 claims
- 1676US10529643B2Semiconductor device and method of manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Jan 7, 2020·3 cites·13 claims
- 1776US8461733B2Power supply unit-integrated dynamoelectric machineTAKECHI ATSUSHI·Filed 2010·Granted Jun 11, 2013·5 cites·9 claims
- 1875US9129949B2Power semiconductor moduleASADA SHINSUKE·Filed 2011·Granted Sep 8, 2015·5 cites·12 claims
- 1974US6940164B1Power moduleMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Sep 6, 2005·20 cites·6 claims
- 2073US10727167B2Power semiconductor device and method for manufacturing power semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Jul 28, 2020·2 cites·9 claims
- 2173US10461010B2Power module, power semiconductor device and power module manufacturing methodMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Oct 29, 2019·2 cites·22 claims
- 2272US11152280B2Semiconductor device and method for manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Oct 19, 2021·2 cites·13 claims
- 2372US9577495B2Rotary electric machineFUKASE TATSUYA·Filed 2011·Granted Feb 21, 2017·3 cites·6 claims
- 2471US9892992B2Swaged heat sink and heat sink integrated power moduleMITSUBISHI ELECTRIC CORP·Filed 2014·Granted Feb 13, 2018·3 cites·20 claims
- 2571US6787893B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Sep 7, 2004·19 cites·19 claims
- 2670US7560809B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2006·Granted Jul 14, 2009·4 cites·9 claims
- 2770US7151311B2Mold resin-sealed power semiconductor device having insulating resin layer fixed on bottom surface of heat sink and metal layer on the resin layerMITSUBISHI ELECTRIC CORP·Filed 2003·Granted Dec 19, 2006·19 cites·4 claims
- 2868US9698646B2Rotating electrical machineSHIRAKATA YUJI·Filed 2011·Granted Jul 4, 2017·2 cites·5 claims
- 2967US9653969B2Brush structure with heat dissipation memberFUKASE TATSUYA·Filed 2011·Granted May 16, 2017·2 cites·14 claims
- 3067US7151661B2Capacitor module and semiconductor device using the sameMITSUBISHI ELECTRIC CORP·Filed 2002·Granted Dec 19, 2006·13 cites·17 claims
- 3161US9812929B2Electric rotating machineSHIRAKATA YUJI·Filed 2012·Granted Nov 7, 2017·1 cites·11 claims
- 3248US6753596B1Resin-sealed semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2003·Granted Jun 22, 2004·3 cites·7 claims
- 3345US10775329B2Thermal conductivity measurement device and thermal conductivity measurement methodMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Sep 15, 2020·0 cites·20 claims
- 3444US9531318B2Rotating electrical machineSHIRAKATA YUJI·Filed 2010·Granted Dec 27, 2016·0 cites·7 claims
- 3543US2024105667A1Aluminum bonding wire for power semiconductorTANAKA ELECTRONICS IND·Filed 2022·Application pending·0 cites
- 3642US9620444B2Power semiconductor deviceFUKASE TATSUYA·Filed 2012·Granted Apr 11, 2017·0 cites·16 claims
- 3741US2005041369A1Capacitor module and semiconductorMITSUBISHI ELECTRIC CORP·Filed 2004·Application pending·0 cites
- 3838US2013200136A1Reflow soldering device and reflow soldering methodBESSHI NORIYUKI·Filed 2011·Application pending·0 cites
- 3937US6984884B2Electric power semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2004·Granted Jan 10, 2006·1 cites·10 claims
- 4036US11049787B2Semiconductor device and method of manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Jun 29, 2021·0 cites·16 claims
- 4133US6580147B2Semiconductor device having built-in capacitorsMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Jun 17, 2003·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →