Inventor · disambiguated record
Weston Roth
Also filed as: ROTH WESTON · ROTH WESTON C
14 granted patents·5 pending applications·126 citations·filing 2002–2019
91Inventor score
Top patents by PatentIndex Score
19 records- 0183US6713871B2Surface mount solder method and apparatus for decoupling capacitance and process of makingINTEL CORP·Filed 2002·Granted Mar 30, 2004·45 cites·25 claims
- 0280US7122891B2Ceramic embedded wireless antennaINTEL CORP·Filed 2003·Granted Oct 17, 2006·32 cites·16 claims
- 0363US7495318B2Apparatus and method for improving AC coupling on circuit boardsINTEL CORP·Filed 2005·Granted Feb 24, 2009·2 cites·2 claims
- 0463US6793505B2Ganged land grid array socket contacts for improved power deliveryINTEL CORP·Filed 2002·Granted Sep 21, 2004·11 cites·10 claims
- 0562US7361988B2Apparatuses and methods to route line to lineINTEL CORP·Filed 2003·Granted Apr 22, 2008·11 cites·17 claims
- 0659US10251273B2Mainboard assembly including a package overlying a die directly attached to the mainboardSEARLS DAMION·Filed 2008·Granted Apr 2, 2019·2 cites·12 claims
- 0757US7135758B2Surface mount solder method and apparatus for decoupling capacitance and process of makingINTEL CORP·Filed 2004·Granted Nov 14, 2006·5 cites·16 claims
- 0854US7334325B2Apparatus and method for improving coupling across plane discontinuities on circuit boardsINTEL CORP·Filed 2004·Granted Feb 26, 2008·5 cites·21 claims
- 0952US10555417B2Mainboard assembly including a package overlying a die directly attached to the mainboardINTEL CORP·Filed 2019·Granted Feb 4, 2020·0 cites·15 claims
- 1052US6884087B2Socket with multiple contact pad area socket contactsINTEL CORP·Filed 2003·Granted Apr 26, 2005·7 cites·15 claims
- 1151US2009310320A1Low profile solder grid array technology for printed circuit board surface mount componentsROTH WESTON·Filed 2008·Application pending·0 cites
- 1251US2012224331A1Low profile solder grid array technology for printed circuit board surface mount componentsROTH WESTON·Filed 2012·Application pending·0 cites
- 1350US6905979B2Apparatus and method for improving AC coupling on circuit boardsINTEL CORP·Filed 2002·Granted Jun 14, 2005·3 cites·15 claims
- 1448US7282647B2Apparatus for improving coupling across plane discontinuities on circuit boardsINTEL CORP·Filed 2002·Granted Oct 16, 2007·3 cites·16 claims
- 1545US2009051004A1Surface Mount Components Joined Between a Package Substrate and a Printed Circuit BoardROTH WESTON C·Filed 2007·Application pending·0 cites
- 1643US7255492B2Electro-optic surface mount light pipe and connectorINTEL CORP·Filed 2004·Granted Aug 14, 2007·0 cites·7 claims
- 1743US6793503B2Ganged land grid array socket contacts for improved power deliveryINTEL CORP·Filed 2003·Granted Sep 21, 2004·0 cites·6 claims
- 1840US2006024060A1Apparatus and method for optical interconnects on a carrier substrateROTH WESTON C·Filed 2004·Application pending·0 cites
- 1939US2005068788A1Electro-optic through-hole mount light pipe and connectorFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →