Inventor · disambiguated record
Sean S. Cahill
Also filed as: CAHILL SEAN · CAHILL SEAN S · CAHILL SEAN SAMUEL
31 granted patents·9 pending applications·1,103 citations·filing 1993–2024
97Inventor score
Files withROSENBERGER HOCHFREQUENZTECHNIK GMBH & CO KG8MAXIM INTEGRATED PRODUCTS5FUJIFILM DIMATIX INC4TOKYO GAS CO LTD4BRIDGEWAVE COMMUNICATIONS INC3
Top patents by PatentIndex Score
40 records- 0197US6351996B1Hermetic packaging for semiconductor pressure sensorsMAXIM INTEGRATED PRODUCTS·Filed 1998·Granted Mar 5, 2002·144 cites·37 claims
- 0295US6229190B1Compensated semiconductor pressure sensorMAXIM INTEGRATED PRODUCTS·Filed 1998·Granted May 8, 2001·201 cites·47 claims
- 0395US5393647AMethod of making superhard tips for micro-probe microscopy and field emissionNEUKERMANS ARMAND P·Filed 1993·Granted Feb 28, 1995·161 cites·20 claims
- 0494US6346742B1Chip-scale packaged pressure sensorMAXIM INTEGRATED PRODUCTS·Filed 1998·Granted Feb 12, 2002·97 cites·82 claims
- 0593US6770822B2High frequency device packages and methodsBRIDGEWAVE COMMUNICATIONS INC·Filed 2002·Granted Aug 3, 2004·112 cites·31 claims
- 0692US6006607APiezoresistive pressure sensor with sculpted diaphragmMAXIM INTEGRATED PRODUCTS·Filed 1998·Granted Dec 28, 1999·93 cites·30 claims
- 0791US5444244APiezoresistive cantilever with integral tip for scanning probe microscopePARK SCIENT INSTR CORP·Filed 1993·Granted Aug 22, 1995·114 cites·19 claims
- 0881US7305890B2Micro-electromechanical sensorSMC KK·Filed 2006·Granted Dec 11, 2007·14 cites·22 claims
- 0977US5802911ASemiconductor layer pressure switchTOKYO GAS CO LTD·Filed 1994·Granted Sep 8, 1998·30 cites·5 claims
- 1076US7047814B2Micro-electromechanical sensorREDWOOD MICROSYSTEMS INC·Filed 2002·Granted May 23, 2006·20 cites·43 claims
- 1173US8839508B2Method of making a high frequency device packageSANJUAN ERIC A·Filed 2011·Granted Sep 23, 2014·3 cites·7 claims
- 1273US8581113B2Low cost high frequency device package and methodsSANJUAN ERIC A·Filed 2007·Granted Nov 12, 2013·5 cites·11 claims
- 1369US6667549B2Micro circuits with a sculpted ground planeBRIDGEWAVE COMMUNICATIONS INC·Filed 2002·Granted Dec 23, 2003·16 cites·7 claims
- 1468US6058027AMicromachined circuit elements driven by micromachined DC-to-DC converter on a common substrateMAXIM INTEGRATED PRODUCTS·Filed 1999·Granted May 2, 2000·37 cites·19 claims
- 1567US2025332831A1Dry film membrane tentingFUJIFILM DIMATIX INC·Filed 2024·Application pending·0 cites
- 1662US2024424791A1Process for an ipc coatingFUJIFILM DIMATIX INC·Filed 2023·Application pending·0 cites
- 1761US9859188B2Heat isolation structures for high bandwidth interconnectsROSENBERGER HOCHFREQUENZTECHNIK GMBH & CO KG·Filed 2014·Granted Jan 2, 2018·1 cites·16 claims
- 1858US2024391238A1Ink jet print head nozzle matrix layoutFUJIFILM DIMATIX INC·Filed 2024·Application pending·0 cites
- 1957US5604313AVarying apparent mass accelerometerTOKYO GAS CO LTD·Filed 1994·Granted Feb 18, 1997·16 cites·3 claims
- 2056US9523977B2Barcode menu structure advancementCUBIC CORP·Filed 2016·Granted Dec 20, 2016·1 cites·20 claims
- 2155US9997489B2Coated bond wires for die packages and methods of manufacturing said coated bond wiresROSENBERGER HOCHFREQUENZTECHNIK GMBH & CO KG·Filed 2014·Granted Jun 12, 2018·0 cites·8 claims
- 2255US2010010531A1Tissue Expansion DevicesSHALON TADMOR·Filed 2009·Application pending·0 cites
- 2351US2024424788A1Ipc coating for printheadFUJIFILM DIMATIX INC·Filed 2023·Application pending·0 cites
- 2450US9275961B2Low cost high frequency device package and methodsSANJUAN ERIC A·Filed 2012·Granted Mar 1, 2016·0 cites·14 claims
- 2548US9812420B2Die packaging with fully or partially fused dielectric leadsROSENBERGER HOCHFREQUENZTECHNIK GMBH & CO KG·Filed 2014·Granted Nov 7, 2017·0 cites·18 claims
- 2648US7520054B2Process of manufacturing high frequency device packagesBRIDGEWAVE COMMUNICATIONS INC·Filed 2002·Granted Apr 21, 2009·3 cites·6 claims
- 2747US9673137B2Electronic device having a lead with selectively modified electrical propertiesROSENBERGER HOCHFREQUENZTECHNIK GMBH & CO KG·Filed 2014·Granted Jun 6, 2017·0 cites·15 claims
- 2847US2017271296A1Coated bond wires for die packages and methods of manufacturing said coated bond wiresROSENBERGER HOCHFREQUENZTECHNIK GMBH & CO KG·Filed 2017·Application pending·0 cites
- 2946US10340209B2Mixed impedance leads for die packages and method of making the sameROSENBERGER HOCHFREQUENZTECHNIK GMBH & CO KG·Filed 2014·Granted Jul 2, 2019·0 cites·16 claims
- 3046US9824997B2Die package with low electromagnetic interference interconnectionROSENBERGER HOCHFREQUENZTECHNIK GMBH & CO KG·Filed 2014·Granted Nov 21, 2017·0 cites·17 claims
- 3146US2006069403A1Tissue expansion devicesSHALON VENTURES INC·Filed 2005·Application pending·0 cites
- 3246US2018248242A1Metalized molded plastic components for millimeter wave electronics and method for manufactureREMEC BROADBAND WIRELESS NETWORKS LLC·Filed 2018·Application pending·0 cites
- 3345US9960468B2Metalized molded plastic components for millimeter wave electronics and method for manufactureCAHILL SEAN S·Filed 2012·Granted May 1, 2018·0 cites·15 claims
- 3445US9711479B2Substrate less die package having wires with dielectric and metal coatings and the method of manufacturing the sameROSENBERGER HOCHFREQUENZTECHNIK GMBH & CO KG·Filed 2014·Granted Jul 18, 2017·0 cites·9 claims
- 3541US5545594ASemiconductor sensor anodic-bonding process, wherein bonding of corrugation is preventedYAZAKI METER CO LTD·Filed 1993·Granted Aug 13, 1996·8 cites·2 claims
- 3638US2012154239A1Millimeter wave radio assembly with a compact antennaBAR-SADE IDAN·Filed 2010·Application pending·0 cites
- 3736US5644086APreloaded linear beam vibration sensorTOKYO GAS CO LTD·Filed 1996·Granted Jul 1, 1997·11 cites·17 claims
- 3836US5484745AMethod for forming a semiconductor sensorYAZAKI METER CO LTD·Filed 1993·Granted Jan 16, 1996·5 cites·7 claims
- 3935US5528070ASemiconductor sensor manufactured through anodic-bonding processYAZAKI METER CO LTD·Filed 1994·Granted Jun 18, 1996·5 cites·5 claims
- 4032US5629243APreloaded linear beam vibration sensor and its manufacturing methodTOKYO GAS CO LTD·Filed 1995·Granted May 13, 1997·6 cites·2 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →